Dell PowerEdge HS5610: руководство по обслуживанию

Chassis dimensions

The image shows system dimensions. — Figure 1. Chassis dimensions

Table 1. PowerEdgeHS5610 chassis dimensionsThis table provides the dimensions of the system:
Drives	Xa	Xb	Y	Za	Zb	Zc
10 or 6 or 4 SATA/SAS/NVMe drives	482 mm (18.976 inches)	434.0 mm (17 inches)	42.8 mm (1.685 inches)	35.84 mm (1.41 inches)With bezel 22 mm (0.86 inches)Without bezel	677.1 mm (26.65 inches) Ear to rear wall	712.95 mm (28.05 inches) Ear to PSU handle without velcro strap
8 NVMe drives	482 mm (18.976 inches)	434.0 mm (17 inches)	42.8 mm (1.685 inches)		677.1 mm (26.65 inches) Ear to rear wall
8 SATA/SAS drives or No backplane configuration	482 mm (18.976 inches)	434.0 mm (17 inches)	42.8 mm (1.685 inches)	35.84 mm (1.41 inches)With bezel 22 mm (0.86 inches)Without bezel	626.42 mm (24.66 inches) Ear to rear wall	661.37 mm (26.03 inches) Ear to PSU handle without velcro strap

NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge HS5610 system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all drives/SSDs)
10 x 2.5-inch	18.74 kg (41.31 pound)
4 x 3.5-inch	19.45 Kg (55.33 pound)
8 x 2.5-inch	18.25 kg (40.23 pound)
6 x 2.5-inch	18.1 kg (39.90 pound)
No backplane configuration	15.38 kg (33.90 pound)

Table 2. PowerEdge system weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight	Description
40 pounds - 70 pounds	Recommend two person to lift
70 pounds- 120 pounds	Recommend three person to lift
≥ 121 pounds	Recommend to use a server-lift

Processor specifications

Table 1. PowerEdge HS5610 processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
Up to two 5^th Generation Intel Xeon Scalable processors with up to 32 cores and 4^th Generation Intel Xeon Scalable processors with up to 32 cores	Up to two

PSU specifications

The PowerEdgeHS5610system supports up to two AC or DC power supply units (PSUs).

Table 1. HS5610 PSU specifications This table describes PSU specifications for the system.
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	AC Voltage			DC Voltage			Current (A)
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	100–120 V	200–240 V	277 V	240 V	336 V	- (48 V — 60 V)	Current (A)
700 W mixed mode HLAC	Titanium	2625	50/60	N/A	700 W	N/A	N/A	N/A	N/A	4.1 A
700 W mixed mode HLAC	N/A	2625	N/A	N/A	N/A	N/A	700 W	N/A	N/A	3.4 A
800 W mixed mode	Platinum	3000	50/60	800 W	800 W	N/A	N/A	N/A	N/A	9.2 A - 4.7 A
800 W mixed mode	N/A	3000	N/A	N/A	N/A	N/A	800 W	N/A	N/A	3.8 A
1100 W -48 V DC	N/A	4265	N/A	N/A	N/A	N/A	N/A	N/A	1100 W	27 A
1100 W mixed mode	Titanium	4125	50/60	1050 W	1100 W	N/A	N/A	N/A	N/A	12 A - 6.3 A
1100 W mixed mode	N/A	4125	N/A	N/A	N/A	N/A	1100 W	N/A	N/A	5.2 A
1400 W mixed mode	Titanium	5250	50/60	1050 W	1400 W	N/A	N/A	N/A	N/A	12 A - 8 A
1400 W mixed mode	N/A	5250	N/A	N/A	N/A	N/A	1400 W	N/A	N/A	6.5 A
1400 W mixed mode	Platinum	5250	50/60	1050 W	1400 W	N/A	N/A	N/A	N/A	12 A - 8 A
1400 W mixed mode	N/A	5250	N/A	N/A	N/A	N/A	1400 W	N/A	N/A	6.6 A
1400 W 277 V AC and HVDC	Titanium	5250	50/60	N/A	N/A	1400 W	N/A	N/A	N/A	5.8 A
1400 W 277 V AC and HVDC	Titanium	5250	N/A	N/A	N/A	N/A	N/A	1400 W	N/A	5.17 A
1800 W mixed mode HLAC	Titanium	6610	50/60	N/A	1800 W	N/A	N/A	N/A	N/A	10 A
1800 W mixed mode HLAC	N/A	6610	N/A	N/A	N/A	N/A	1800 W	N/A	N/A	8.2 A

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE:HLAC stands for High-Line AC, with a range of 200 - 240V AC. HVDC stands for High-Voltage DC, with 336V DC.

NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

this image shows list of PSU power cords — Figure 1. PSU power cords

This image shows APP 2006G1power cord. — Figure 2. APP 2006G1 power cord

This images shows Lotes DC PSU connector — Figure 3. Lotes DC PSU connector

Table 2. PSU power cordsThe table lists the PSU power cords list .
Form factor	Output	Power cord
Redundant 60 mm	700 W Mixed Mode HLAC	C13
	800 W Mixed Mode	C13
	1100 W Mixed Mode	C13
	1100 W -48 V DC	Lotes DC PSU connector
	1400 W Mixed Mode	C13
	1400 W 277 VAC and HVDC	APP 2006G1
	1800 W Mixed Mode HLAC	C15

NOTE:C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

Supported operating systems

The PowerEdge HS5610 system supports the following operating systems:

Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware vSAN/ESXi

For more information, go to Operating System Manuals.

Cooling fan specifications

The PowerEdgeHS5610system supports up to seven, cabled Standard fans (STD) and High performance (HPR) gold grade fans. The HS5610 system supports cabled fans by default and can replace with hot swap fans.

This image shows Standard cabled fan. — Figure 1. Standard cabled fan

This image shows High performance (HPR) gold grade cabled fan. — Figure 2. High performance (HPR) gold grade cabled fan

This image shows Hot swappable Standard fan. — Figure 3. Hot swappable Standard fan

This image shows Hot swappable High performance (HPR) gold grade fan. — Figure 4. Hot swappable High performance (HPR) gold grade fan

System battery specifications

The PowerEdge HS5610 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge HS5610 system supports up to three PCI express (PCIe) Gen 5 expansion cards.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot	Riser	PCIe slot height	PCIe slot length	PCIe slot width
Slot 1	Riser 1a	Low Profile	Half length	x16
Slot 1	Riser 1b	Low Profile	Half length	x8
Slot 2 and 3	Riser 2a	Low Profile	Half length	x8 + x8
Slot 3	Riser 2c	Low Profile	Half length	x16
Slot 2	Riser 2d	Low Profile	Half length	x8
Slot 2	Riser 2e	Low Profile	Half length	x16

Memory specifications

The PowerEdge HS5610 system supports the following memory specifications for optimized operation.

Table 1. Memory specifications for 4th Generation Intel Xeon Scalable ProcessorsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processors
DIMM type	DIMM rank	DIMM capacity	Minimum memory capacity	Maximum memory capacity	Minimum memory capacity	Maximum memory capacity
RDIMM	Single rank	16 GB	16 GB	128 GB	32 GB	256 GB
	Dual rank	32 GB	32 GB	256 GB	64 GB	512 GB
	Dual rank	64 GB	64 GB	512 GB	128 GB	1 TB
	Quad rank	128 GB	128 GB	1 TB	256 GB	2 TB

Table 2. Memory module sockets for 4th Generation Intel Xeon Scalable ProcessorsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
16, 288-pin	4000 MT/s, 4400 MT/s, 4800 MT/s

Table 3. Memory specifications for 5th Generation Intel Xeon Scalable ProcessorsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processors
DIMM type	DIMM rank	DIMM capacity	Minimum memory capacity	Maximum memory capacity	Minimum memory capacity	Maximum memory capacity
RDIMM	Single rank	16 GB	16 GB	128 GB	32 GB	256 GB
	Dual rank	32 GB	32 GB	256 GB	64 GB	512 GB
		64 GB	64 GB	512 GB	128 GB	1 TB
		96 GB	96 GB	768 GB	192 GB	1.5 TB
	Quad rank	128 GB	128 GB	1 TB	256 GB	2 TB

Table 4. Memory module sockets for 5th Generation Intel Xeon Scalable ProcessorsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
16, 288-pin	4000 MT/s, 4400 MT/s, 4800 MT/s, 5200 MT/s, 5600 MT/s

NOTE:Memory DIMM slots are not hot pluggable.

NOTE:The processor may reduce the performance of the rated DIMM speed.

Storage controller specifications

The PowerEdge HS5610 system supports the following controller cards:

Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller cards
Internal controllers PERC H755N PERC H755 PERC H355 HBA355i HBA465i
External controllers HBA355e HBA465e HBA965e
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 1, 2 x M.2 SSDs USB
Software RAID S160

Drives

The PowerEdge HS5610 system supports:

0 drive
Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) drives
Up to 6 x 2.5-inch NVMe SSD drives
Up to 8 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives
Up to 10 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives
Up to 2 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives on rear of the system

NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support > Browse all products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

NIC port specifications

The PowerEdge HS5610 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
LOM	1 GB x 2
OCP card (OCP 3.0) (Optional)	1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4

Serial connector specifications

The PowerEdge HS5610 system supports one optional card type serial connector on rear of the system, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The process to install the optional serial connector card is similar to an expansion card filler bracket.

USB ports specifications

Table 1. PowerEdge HS5610 system USB ports specifications The following table shows the USB ports specifications :
Front		Rear		Internal (Optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 2.0-compliant port	One	Internal USB 3.0-compliant port	One
iDRAC Direct port (Micro-AB USB 2.0-compliant port)	One	USB 3.0-compliant port	One	Internal USB 3.0-compliant port	One

NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NOTE:The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.

NOTE:The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

VGA ports specifications

The PowerEdge HS5610 system supports two DB-15 VGA ports, one each on the front and rear panels of the system.

Video specifications

The PowerEdge HS5610 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options for the systemThis table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on Dell Support.

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Operational climatic range for category A2	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C (10.4°F) minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Operational climatic range for category A3	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C (10.4°F) minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Operational climatic range for category A4	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Continuous Operation Specifications for Rugged Environment This table describes the operational climatic range for category A4.
Operational climatic range for category A4	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 5. Common Environmental Specifications for ASHRAE A2, A3, A4, and Rugged This table describes the shared requirements across all categories.
Environmental Specifications for ASHRAE A2, A3, A4, and Rugged	Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40°C to 65°C (-104°F to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

Table 6. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.21 G_rms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 7. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.

Table 8. Particulate and gaseous contamination specifications This table shows particulate and gaseous contamination specifications
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE:The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 9. Gaseous contamination specificationsThis table shows gaseous contamination specifications
Gaseous contamination	Specification
Copper coupon corrosion rate	<300A/month per class G1 as defines by ANSI/ISA71.04-2013
Silver coupon corrosion rate	<200A/month as defined by ANSI/ISA71.04-2013

Thermal restrictions

Table 1. Thermal restriction matrix for processor and fans with iDRACThis table describes the thermal restriction for processor and fans.
Configuration / Processor TDP	No Backplane	6 x 2.5-inch NVMe cold asile	4 x 3.5-inch SAS/SATA		8 x 2.5-inch SAS3/SATA		10 x 2.5-inch SAS3/SATA
Rear Storage	Rear 3 LP	Rear 3 LP	Rear 3 LP	1 LP + 2 Rear drives	Rear 3 LP	Rear 1 LP + 2 Rear drives	Rear 3 LP
DIMM	14W (128 GB)	14W (128 GB)	12W (96 GB)	12W (96 GB)	14W (128 GB)	14W (128 GB)	14W (128 GB)
125 W	STD fan STD HSK 45 °C	HPR (Gold) fan STD HSK 40 °C	STD fan STD HSK 40 °C	STD fan STD HSK 35 °C	STD fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C	STD fan STD HSK 40 °C
135 W	STD fan STD HSK 45 °C	STD fan STD HSK 40 °C	STD fan STD HSK 40 °C	STD fan STD HSK 35 °C	STD fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C	STD fan STD HSK 40 °C
150 W	STD fan STD HSK 40 °C	STD fan STD HSK 40 °C	STD fan STD HSK 40 °C	STD fan STD HSK 35 °C	STD fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C	STD fan STD HSK 40 °C
165 W	STD fan HPR HSK 40 °C	HPR (Gold) fan HPR HSK 35 °C	STD fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	STD fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C
185 W	STD fan HPR HSK 40 °C	HPR (Gold) fan HPR HSK 35 °C	STD fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	STD fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C
195 W	STD fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	STD fan HPR HSK 35 °C	STD fan HPR HSK 35 °C	****HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C
205 W	STD fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	STD fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	****STD fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C
225 W	STD fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	*	*	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C

Table 2. Thermal restriction matrix for processor and fans with iDRACThis table describes the thermal restriction for processor and fans.
Configuration / Processor TDP	10 x 2.5-inch SAS4/SATA		8 x 2.5-inch NVMe		10 x 2.5-inch NVMe
Rear Storage	Rear 3 LP	1 LP + 2 Rear drives	Rear 3 LP	1 LP + 2 Rear drives	Rear 3 LP	1 LP + 2 Rear drives
DIMM	14W (128 GB)	14W (128 GB)	14W (128 GB)	14W (128 GB)	14W (128 GB)	14W (128 GB)
125 W	HPR (Gold) fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C
135 W	HPR (Gold) fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C
150 W	HPR (Gold) fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C
165 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C
185 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C
195 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C
205 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C
225 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C

NOTE:

*Configs supported in the " CPU TDP> 205W,225W and configurations with HW Restriction "

** Cold Aisle 6 x 2.5 NVMe configuration always requires 7 VHP fans

** Except cold aisle configuration: 5 fans is required for 1 x Processor + W/O RM configuration

*** Except cold aisle configuration: 7 fans is required for 2 x Processors configuration. and 1 x Processor + RM configuration

**** Intel 6434/6526Y/6534 205W CPU would need HPR Gold Fan to support in this configuration.

EMR CPU tested could only support DIMM frequency up-to 5200MHz. 5600MHz DIMM will need to be re-tested for new CPU support DIMM frequency 5600MHz.

4x3.5" SAS/SATA config only support DIMM up to 96G and all the other configs support DIMM up to 128G.

Table 3. Thermal restriction matrix for processor and fans with iDRAC with TDP > 205 W, 225 WThis table describes the thermal restriction for processor and fans.
SM Configuration with Restrictions	No Backplane	6 x 2.5-inch NVMe cold asile	2 x 3.5-inch SAS/SATA		4 x 2.5-inch SAS3/SATA
Drives	No	HDD 0 ~ 5	HDD 0 ~ 1		HDD 0 ~ 3
DIMM	14W (128 GB)	14W (128 GB)	12W (96 GB)	12W (96 GB)	14W (128 GB)	14W (128 GB)
Rear Storage	Rear 3 LP	Rear 3 LP	PCIe 1 + OCP only. PCIe 2,PCIe 3 and BOSS are not supported	1 LP + 2 Rear drives	Rear 3 LP	Rear 1 LP + 2 Rear drives
225 W	*	*	STD fan HPR HSK 35 °C	STD fan HPR HSK 30 °C	*	*
250 W	STD fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	STD fan HPR HSK 35 °C	STD fan HPR HSK 30 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C

Table 4. Thermal restriction matrix for processor and fans with iDRAC with TDP > 205 W, 225 WThis table describes the thermal restriction for processor and fans.
SM Configuration with Restrictions	6 x 2.5-inch SAS4/SATA		4 x 2.5-inch NVMe		4 x 2.5-inch NVMe
Drives	HDD 0 ~ 5		HDD 0 ~ 3		HDD 0 ~ 3
DIMM	14W (128 GB)	14W (128 GB)	14W (128 GB)	14W (128 GB)	14W (128 GB)	14W (128 GB)
Rear Storage	Rear 3 LP	1 LP + 2 Rear drives	Rear 3 LP	1 LP + 2 Rear drives	Rear 3 LP	1 LP + 2 Rear drives
225 W	*	*	*	*	*	*
250 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C

NOTE:

*Configs supported in the " CPU <205W,225W without HW restriction thermal restriction table"

** 2 x3.5" SAS/SATA config only support DIMM up to 96G and all the other configs support DIMM up to 128G.

Table 5. Thermal restriction matrix for processor and fans with OSMThis table describes the thermal restriction for processor and fans.
Configuration / Processor TDP	No Backplane	6 x 2.5-inch NVMe cold asile	4 x 3.5-inch SAS/SATA		8 x 2.5-inch SAS3/SATA
Rear Storage	Rear 3 LP	Rear 3 LP	Rear 3 LP	1 LP + 2 Rear drives	Rear 3 LP	1 LP + 2 Rear drives
125 W	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	STD fan STD HSK 35 °C	STD fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C
135 W	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	STD fan STD HSK 35 °C	STD fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C
150 W	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	STD fan STD HSK 35 °C	STD fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C
165 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	STD fan HPR HSK 35 °C	STD fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C
185 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	STD fan HPR HSK 35 °C	STD fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C
205 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	STD fan HPR HSK 35 °C	*	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C
225 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	*	*	*	*

Table 6. Thermal restriction matrix for processor and fans with OSMThis table describes the thermal restriction for processor and fans.
Configuration / Processor TDP	10 x 2.5-inch SAS4/SATA		8 x 2.5-inch NVMe		10 x 2.5-inch SAS3/SATA	10 x 2.5-inch NVMe
Rear Storage	Rear 3 LP	1 LP + 2 Rear drives	Rear 3 LP	1 LP + 2 Rear drives	Rear 3 LP	Rear 3 LP	1 LP + 2 Rear drives
125 W	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	STD fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C
135 W	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	STD fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C
150 W	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	STD fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 35 °C
165 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C
185 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C
205 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C
225 W	*	*	*	*	HPR (Gold) fan HPR HSK 35 °C	*	*

NOTE:

* Configs supported in the table of "without HW restriction thermal restriction table"

** All configs always requires 7x fans.

*** Matrix are developed based on not support fan redundancy and allow system showing events at fan failure condition.

4x3.5" SAS/SATA config only support DIMM up to 64G and all the other configs support DIMM up to 128G.

195 W CPU restriction will follow 205 W CPU restriction.

Table 7. Thermal restriction matrix for processor and fans with OSM with TDP>185W, 205W & 225W config with HW restrictionThis table describes the thermal restriction for processor and fans.
SM Configuration	No Backplane	6 x 2.5-inch NVMe cold asile	4 x 3.5-inch SAS/SATA		8 x 2.5-inch SAS/SATA
Drives with HW Restrictions	No HDD	HDD 0 ~ 5	HDD 0 ~ 1		HDD 0 ~ 3
Rear Storage	Rear 3 LP	Rear 3 LP	PCIe 1 + OCP only. PCIe 2,PCIe 3 and BOSS are not supported	1 LP + 2 Rear drives	Rear 3 LP	1 LP+2 rear drives
205 W	*	*	*	STD fan HPR HSK 30 °C	*	*
225 W	*	*	STD fan HPR HSK 35 °C	STD fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C
250 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	STD fan HPR HSK 35 °C	Not supported	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C

Table 8. Thermal restriction matrix for processor and fans with OSM with TDP>185W, 205W & 225W config with HW restrictionThis table describes the thermal restriction for processor and fans.
SM Configuration	10 x 2.5-inch SAS3/SATA	10 x 2.5-inch SAS3/SATA		8 x 2.5-inch NVMe		10 x 2.5-inch NVMe
Drives with HW Restrictions	HDD 0 ~ 5	HDD 0 ~ 5		HDD 0 ~ 3		HDD 0 ~ 5
Rear Storage	Rear 3 LP	Rear 3 LP	1 LP+2 rear drives	Rear 3 LP	1 LP+2 rear drives	Rear 3 LP	1 LP+2 rear drives
205 W	*	*	*	*	*	*	*
225 W	*	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C
250 W	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 30 °C

NOTE: * Configs supported in the table of "without HW restriction thermal restriction table"

** All configs always requires 7x fans.

*** Matrix are developed based on not support fan redundancy and allow system showing events at fan failure condition.

Table 9. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
STD	Standard
LP	Low Profile
HPR (Gold)	High performance (gold grade)
HSK	Heat sink

Thermal Restriction for ASHRAE A2/A3/A4

Table 10. No BP Configuration with iDRACThis table describes the thermal restriction for No BP Configuration with iDRAC.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted.	Dell PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant)	Dell PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
STD (Brickfielder) Fan is required. STD HSK is required for CPU Base TDP <=150W HPR HSK is required for CPU Base TDP >150W 2-processor all configs or 1-processor with RM config requires 7x fans 1-processor without RM config requires 5x fans 100G PCIe NIC could not support MFS1S00-VxxE (spec 75C) transceiver 100G OCP3.0 NIC could only support optic transceiver with thermal spec 85C and power <=2.5W ( DPN:4WGYD) 25G OCP3.0 NIC with 4 ports or PCIe cooling tier higher than or equal to 5 could only support optic transceiver with thermal spec 85C and power <=1.2W ( DPN: M14MK) 25G OCP3.0 NIC with PCIe cooling tier lower than 5 could not support spec 70C optic transceiver with power higher than 1.2W ( DPN: 0YR96) H965e cannot not be installed in PCIe slot1	Not support CPU Base TDP > 185W STD (Brickfielder) Fan is required. STD HSK is required for CPU Base TDP <=150W HPR HSK is required for CPU Base TDP >150W. Not support BOSS M.2 Module Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards Not support NIC consuming power >= 25W. Not Support Config with RM Not support OCP transfer rate >25G or cooling tier > 9 Optic Transceiver with spec 85C is required Two PSUs are required. System performance may be reduced in the event of a PSU failure	Not support CPU Base TDP > 135W STD (Brickfielder) Fan and STD HSK is required. Not support BOSS M.2 Module Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards Not support NIC consuming power >= 25W. Or PCIe cooling Tier> 5 Not Support Config with RM Not support OCP3.0 transfer rate >25G or OCP3.0 cooling tier > 6 Optic Transceiver with spec 85C is required. Two PSUs are required. System performance may be reduced in the event of a PSU failure

Table 11. 6 x 2.5-inch Cold Aisle Configuration with iDRACThis table describes the thermal restriction for 6 x 2.5-inch Cold Aisle Configuration with iDRAC.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted.	Dell PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant)	Dell PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
HPR Gold (VHP) Fan is required. STD HSK is required for CPU Base TDP <=150W HPR HSK is required for CPU Base TDP >150W All config requires 7x fans · 100G PCIe NIC could not support MFS1S00-VxxE (spec 75C) transceiver but could support optic transceiver with thermal spec 70C and 85C.	Not support CPU Base TDP > 150W Not support BOSS M.2 Module Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards Not support NIC consuming power >= 25W. Not Support Config with RM Not support OCP transfer rate >25G or cooling tier > 10 Optic Transceiver with spec 85C is required Two PSUs are required. System performance may be reduced in the event of a PSU failure	Not support

Table 12. 4 x 3.5-inch SAS/SATA Configuration with iDRACThis table describes the thermal restriction for 4 x 3.5-inch SAS/SATA Configuration with iDRAC.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted.	Dell PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant)	Dell PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
STD (Brickfielder) Fan is required. STD HSK is required for CPU Base TDP <=150W HPR HSK is required for CPU Base TDP >150W 2-processor all configs or 1-processor with RM config requires 7x fans 1-processor without RM config requires 5x fans HW restriction is required for CPU Base TDP >205W SM only support 2x3.5 at HDD#0, HDD1 and HDD Blank F3F7V x 2 are required at HDD#2 and HDD#3 RIO only support PCIe1 and OCP3.0. Could not support BOSS, PCIe2 and PCIe3. With RM config only support max. 30C ambient. Only support DDR5 DIMM up to 96 GB. 100G PCIe NIC could not support MFS1S00-VxxE (spec 75C) transceiver. 100G PCIe and OCP3.0 NIC could only support optic transceiver with thermal Spec 85C and power <=2.5W 25G PCIe NIC could only support optic transceiver with thermal Spec 85C and power <=1.2W 25G OCP3.0 NIC with 4 ports or PCIe cooling tier higher than 5 could only support optic transceiver with thermal spec 85C and power <=1.2W 25G OCP3.0 NIC with PCIe cooling tier lower than or equal to 5 could not support thermal spec 70C optic transceiver with power higher than 1.2W The following SAS drives could NOT support in RM. (But could support in front SM) Kioxia PM6 SAS all capacities SATA SSD, Hynix SE5031 all capacities or thermal spec <70C H965e cannot not be installed in PCIe slot1	Not support CPU Base TDP > 150W STD (Brickfielder) Fan is required. STD HSK is required Not support BOSS M.2 Module Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards Not support NIC consuming power >= 25W. Not Support Config with RM Not support OCP transfer rate >25G or cooling tier > 10 Optic Transceiver with spec 85C is required Two PSUs are required. System performance may be reduced in the event of a PSU failure	Not support

Table 13. 8 x 2.5-inch SAS3/SATA Configuration with iDRACThis table describes the thermal restriction for 8 x 2.5-inch SAS3/SATA Configuration with iDRAC.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted.	Dell PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant)	Dell PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
STD (Brickfielder) Fan is required for CPU Base TDP<=205W HPR Gold (VHP) Fan is required for CPU Base TDP>205W and Intel 6434/6526Y/6534 CPU with base TDP 205 W STD HSK is required for CPU Base TDP <=150W HPR HSK is required for CPU Base TDP >150W 2-processor all configs or 1-processor with RM config requires 7x fans 1-processor without RM config requires 5x fans HW restriction is required for CPU Base TDP >225W SM only support 4x2.5"SAS/SATA drives at HDD#0~3, and HDD Bracket GG6M3 x1 and M8KTX x1 are required at empty HDD bay 100G PCIe and OCP3.0 NIC could only support optic transceiver with thermal Spec 85C and power <=2.5W 25G PCIe NIC could only support optic transceiver with thermal Spec 85C and power <=1.2W 25G OCP3.0 NIC with 4 ports or PCIe cooling tier higher than 5 could only support optic transceiver with thermal spec 85C and power <=1.2W 25G OCP3.0 NIC with PCIe cooling tier lower than or equal to 5 could not support thermal spec 70C optic transceiver with power higher than 1.2W The following SAS drives could NOT support in RM. (But could support in front SM) Kioxia PM6 SAS all capacities SATA SSD, Hynix SE5031 all capacities or thermal spec <70C H965e cannot not be installed in PCIe slot1	Not support CPU Base TDP > 150W STD (Brickfielder) Fan is required. STD HSK is required Not support BOSS M.2 Module Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards Not support NIC consuming power >= 25W. Not Support Config with RM Not support OCP transfer rate >25G or cooling tier > 10 Optic Transceiver with spec 85C is required Two PSUs are required. System performance may be reduced in the event of a PSU failure	Not support

Table 14. 10 x 2.5-inch SAS3/SATA Configuration with iDRACThis table describes the thermal restriction for 10 x 2.5-inch SAS3/SATA Configuration with iDRAC.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted.	Dell PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant)	Dell PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
STD (Brickfielder) Fan is required for CPU Base TDP<=150W HPR Gold (VHP) Fan is required for CPU Base TDP>150W STD HSK is required for CPU Base TDP <=150W HPR HSK is required for CPU Base TDP >150W 2-processor all configs or 1-processor with RM config requires 7x fans 1-processor without RM config requires 5x fans HW restriction is required for CPU Base TDP >225W SM only support 6x2.5"SAS/SATA drives at HDD#0~5, and HDD Bracket GG6M3 x2 are required at empty HDD bay. 100G PCIe and OCP3.0 NIC could only support optic transceiver with thermal Spec 85C and power <=2.5W 25G PCIe NIC could not support thermal spec 70C optic transceiver with power higher than 1.2W 25G OCP3.0 NIC with 4 ports or PCIe cooling tier higher than 5 could only support optic transceiver with thermal spec 85C and power <=1.2W 25G OCP3.0 NIC with PCIe cooling tier lower than or equal to 5 could not support thermal spec 70C optic transceiver with power higher than 1.2W H965e cannot not be installed in PCIe slot1	Not support CPU Base TDP > 150W STD (Brickfielder) Fan is required. STD HSK is required Not support BOSS M.2 Module Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards Not support NIC consuming power >= 25W. Not Support Config with RM Not support OCP transfer rate >25G or cooling tier > 10 Optic Transceiver with spec 85C is required Two PSUs are required. System performance may be reduced in the event of a PSU failure	Not support

Table 15. 10 x 2.5-inch SAS4/SATA Configuration with iDRACThis table describes the thermal restriction for 10 x 2.5-inch SAS4/SATA Configuration with iDRAC.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted.	Dell PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant)	Dell PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
HPR Gold (VHP) Fan is required for all configurations STD HSK is required for CPU Base TDP <=150W HPR HSK is required for CPU Base TDP >150W 2-processor all configs or 1-processor with RM config requires 7x fans 1-processor without RM config requires 5x fans HW restriction is required for CPU Base TDP >225W SM only support 6x2.5"SAS/SATA drives at HDD#0~5, and HDD Bracket GG6M3 x2 are required at empty HDD bay. 100G PCIe and OCP3.0 NIC could only support optic transceiver with thermal Spec 85C and power <=2.5W 25G PCIe NIC could not support thermal spec 70C optic transceiver with power higher than 1.2W · 25G OCP3.0 NIC with 4 ports or PCIe cooling tier higher 5 could only support optic transceiver with thermal spec 85C and power <=1.2W 25G OCP3.0 NIC with PCIe cooling tier lower than or equal to 5 could not support thermal spec 70C optic transceiver with power higher than 1.2W With RM config only support max. 30C ambient when CPU Base TDP>=205W The following SAS drives could NOT support in RM. (But could support in front SM) Kioxia PM6 SAS all capacities SATA SSD, Hynix SE5031 all capacities or thermal spec <70C	Not support CPU Base TDP > 150W · HPR Gold (VHP) Fan is required. STD HSK is required Not support BOSS M.2 Module Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards Not support NIC consuming power >= 25W. Not Support Config with RM Not support OCP transfer rate >25G or cooling tier > 10 Optic Transceiver with spec 85C is required Two PSUs are required. System performance may be reduced in the event of a PSU failure	Not support

Table 16. 8 x 2.5-inch NVMe configuration with iDRACThis table describes the thermal restriction for 8 x 2.5-inch NVMe configuration with iDRAC.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted.	Dell PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant)	Dell PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
HPR Gold (VHP) Fan is required for all configurations STD HSK is required for CPU Base TDP <=150W HPR HSK is required for CPU Base TDP >150W 2-processor all configs or 1-processor with RM config requires 7x fans 1-processor without RM config requires 5x fans HW restriction is required for CPU Base TDP >225W SM only support 4x2.5"NVMe at HDD#0~3, and HDD Bracket GG6M3 x3 are required at empty HDD bay. 100G PCIe and OCP3.0 NIC could only support optic transceiver with thermal spec 85C and power <=2.5W 25G OCP3.0 NIC with 4 ports or PCIe cooling tier higher 5 could only support optic transceiver with thermal spec 85C and power <=1.2W 25G OCP3.0 NIC with PCIe cooling tier lower than or equal to 5 could not support thermal spec 70C optic transceiver with power higher than 1.2W With RM config only support max. 30C ambient when CPU Base TDP>=205W The following NVMe drives could NOT support in RM. (But could support in front SM) Samsung PM1735a/PM1735 Capacities > 6.4TB Samsung PM1733a/PM1733 Capacities > 7.68TB Skhynix PE8010 Capacity > 960 GB Kioxia CM6 all capacities Redtail NVMe all capacities Skhynix PE8110 capacity > 960 GB	Not support CPU Base TDP > 150W HPR Gold (VHP) Fan is required. STD HSK is required Not support BOSS M.2 Module Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards Not support NIC consuming power >= 25W. Not Support Config with RM Not support OCP transfer rate >25G or cooling tier > 10 Optic Transceiver with spec 85C is required Two PSUs are required. System performance may be reduced in the event of a PSU failure	Not support

Table 17. 10 x 2.5-inch NVMe configuration with iDRACThis table describes the thermal restriction for 10 x 2.5-inch NVMe configuration with iDRAC.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted.	Dell PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant)	Dell PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
HPR Gold (VHP) Fan is required for all configurations STD HSK is required for CPU Base TDP <=150W HPR HSK is required for CPU Base TDP >150W 2-processor all configs or 1-processor with RM config requires 7x fans 1-processor without RM config requires 5x fans HW restriction is required for CPU Base TDP >225W SM only support 4x2.5"NVMe at HDD#0~3, and HDD Bracket GG6M3 x3 are required at empty HDD bay. . 100G PCIe NIC could not support MFS1S00-VxxE (spec 75C) transceiver but could support optic transceiver with thermal spec 70C and 85C. 100G PCIe and OCP3.0 NIC could only support optic transceiver with thermal spec 85C and power <=2.5W 25G OCP3.0 NIC with 4 ports or PCIe cooling tier higher 5 could only support optic transceiver with thermal spec 85C and power <=1.2W 25G OCP3.0 NIC with PCIe cooling tier lower than or equal to 5 could not support thermal spec 70C optic transceiver with power higher than 1.2W With RM config only support max. 30C ambient when CPU Base TDP>=205W The following NVMe drives could NOT support in RM. (But could support in front SM) Samsung PM1735a/PM1735 Capacities > 6.4TB Samsung PM1733a/PM1733 Capacities > 7.68TB Skhynix PE8010 capacity > 960 GB Kioxia CM6 all capacities Redtail NVMe all capacities Skhynix PE8110 capacity > 960 GB	Not support CPU Base TDP > 150W HPR Gold (VHP) Fan is required. STD HSK is required Not support BOSS M.2 Module Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards Not support NIC consuming power >= 25W. Not Support Config with RM Not support OCP transfer rate >25G or cooling tier > 10 Optic Transceiver with spec 85C is required Two PSUs are required. System performance may be reduced in the event of a PSU failure	Not support

Table 18. Thermal Solution Configuration with iDRACThis table describes the thermal restriction for Thermal Solution Configuration with iDRAC.
Configurations	Rear drive configurations	Processor (TDP)	Fan type	Heat sink type	Air Shroud	Memory Blank	Processor Blank	Fan Counts	Fan Blank
6 x 2.5-inch NVMe Cold Aisle	without rear drives	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK	Yes	No	Only required on processor 2 for Configuration	7 x fans	No
6 x 2.5-inch NVMe Cold Aisle	without rear drives	150 W < TDP <= 250 W	HPR Gold Fan (VHP)	HPR HSK	Yes	No	Only required on processor 2 for Configuration	7 x fans	No
4 x 3.5-inch drives	without rear drives	TDP <= 150 W	STD fan	STD HSK	Yes	No	Only required on processor 2 for 1 processor Configuration	7 x fans for 2 processors and 1xProcessor + Rear HDD Configuration 5 x fans for 1 processors Configuration + W/O Rear HDDs Config	Only required on fan Slot 1 and slot 2 for 5x Fans configuration
	without rear drives	150 W < TDP <= 205 W	STD fan	HPR HSK		No
	with rear dries	TDP <= 150 W	STD fan	STD HSK		Yes
	with rear dries	150 W < TDP <= 205 W	STD fan	HPR HSK		Yes
8 x 2.5-inch SAS/SATA drives	without rear drives	TDP <= 150 W	STD fan	STD HSK		No
		150 W < TDP <= 205 W	**STD fan	HPR HSK
		205 W < TDP <= 225 W	HPR Gold Fan (VHP)	HPR HSK
8 x 2.5-inch SAS/SATA drives	with rear dries	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK		Yes
8 x 2.5-inch SAS/SATA drives	with rear dries	150 W < TDP <= 225 W	HPR Gold Fan (VHP)	HPR HSK		Yes
10 x 2.5-inch SAS3/SATA drives	without rear drives	TDP <= 150 W	STD fan	STD HSK		No
10 x 2.5-inch SAS3/SATA drives	without rear drives	150 W < TDP <= 225 W	HPR Gold Fan (VHP)	HPR HSK		No
10 x 2.5-inch SAS4/SATA drives	without rear drives	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK		No
	without rear drives	150 W < TDP <= 225 W	HPR Gold Fan (VHP)	HPR HSK		No
	with rear dries	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK		Yes
	with rear dries	150 W < TDP <= 225 W	HPR Gold Fan (VHP)	HPR HSK		Yes
8 and 10 x 2.5-inch NVMe drives	without rear drives	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK		Yes
8 and 10 x 2.5-inch NVMe drives	without rear drives	150 W < TDP <= 225 W	HPR Gold Fan (VHP)	HPR HSK		Yes
8 and 10 x 2.5-inch NVMe drives	with rear dries	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK		Yes
8 and 10 x 2.5-inch NVMe drives	with rear dries	150 W < TDP <= 225 W	HPR Gold Fan (VHP)	HPR HSK		Yes
No Backplane	without rear drives	TDP <= 150 W	STD fan	STD HSK		No
No Backplane	without rear drives	150 W < TDP <= 250 W	STD fan	HPR HSK		No

NOTE:

* Based on test result, 4x3.5 config could only support CPU TDP up to 205W and DDR5 DIMM up to 12W (96GB)

** Intel 6434/6526Y/6534 CPU Base TDP 205 W should use HPR Gold (VHP) Fan

Table 19. Thermal Solution Configuration with iDRAC with TDP > 205 W, 225 WThis table describes the thermal restriction for Thermal Solution Configuration with iDRAC with TDP > 205 W, 225 W.
Configurations	Rear drive configurations	Processor (TDP)	Fan type	Heat sink type	Air Shroud	Memory Blank	Processor Blank	Fan Counts	Fan Blank
3.5-inch HDDs x2 (3.5-inch HDDs x4 config remove HDD 2 & 3 and replace by HDD blank)	W/O RM Support PCIe Slot 1 + OCP3.0 Only (no BOSS & PCIe slot 2 and 3)	205W <TDP<= 250W	Brickfielder Fan (STD)	HPR HS	Yes	No	Yes for 1x Processor config No for 2x Processor Config	5x Fans for 1xProcessor + W/O Rear HDDs Config 7x Fans for 2xProcessors Config and 1xProcessor + Rear HDD Config	Yes for 5x Fans Config. @ Fan slot 1 and 2 for 5x Fans configuration
	with RM	205W <TDP<= 250W	Brickfielder Fan (STD)	HPR HS		Yes
2.5-inch SAS3/SATA x4 (2.5-inch SAS3/SATAx8 config remove HDD 4 ~ 7 and replace by SM blank)	without rear drives	225W <TDP<= 250W	HPR Gold Fan (VHP)	HPR HS		No
	with rear dries	225W <TDP<= 250W	HPR Gold Fan (VHP)	HPR HS		Yes
2.5-inch SAS3/SATA 6 (2.5-inch SAS3/SATAx10 config remove HDD 6 ~ 9 and replace by SM blank)	without rear drives	225W <TDP<= 250W	HPR Gold Fan (VHP)	HPR HS		No
2.5-inch NVME x4 (2.5-inch NVMex10 config remove HDD 4 ~ 9 and replace by SM blank)	without rear drives	225W <TDP<= 250W	HPR Gold Fan (VHP)	HPR HS		Yes
	with rear dries	225W <TDP<= 250W	HPR Gold Fan (VHP)	HPR HS		Yes
2.5-inch SAS4/SATA x6 (2.5-inch SAS4/SATAx10 config remove HDD 6 ~ 9 and replace by SM blank	without rear drives	225W <TDP<= 250W	HPR Gold Fan (VHP)	HPR HS		No
	with rear dries	225W <TDP<= 250W	HPR Gold Fan (VHP)	HPR HS		Yes

Table 20. Thermal Solution Configuration with OSMThis table describes thermal Solution Configuration with OSM.
Configurations	Rear drive configurations	Processor (TDP)	Fan type	Heat sink type	Air Shroud	Memory Blank	Processor Blank	Fan Counts	Fan Blank
6 x 2.5-inch NVMe Cold Aisle	without rear drives	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK	Yes	No	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
6 x 2.5-inch NVMe Cold Aisle	without rear drives	150 W < TDP <= 250 W	HPR Gold Fan (VHP)	HPR HSK	Yes	No	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
No Backplane	without rear drives	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK	Yes	No	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
No Backplane	without rear drives	150 W < TDP <= 250 W	HPR Gold Fan (VHP)	HPR HSK	Yes	No	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
8 x 2.5-inch drives SAS3/SATA	without rear drives	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK	Yes	No	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
8 x 2.5-inch drives SAS3/SATA	without rear drives	150 W < TDP <= 205 W	HPR Gold Fan (VHP)	HPR HSK	Yes	No	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
8 x 2.5-inch drives SAS3/SATA	with rear dries	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK	Yes	Yes	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
8 x 2.5-inch drives SAS3/SATA	with rear dries	150 W < TDP <= 205 W	HPR Gold Fan (VHP)	HPR HSK	Yes	Yes	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
*4 x 3.5-inch drives	without rear drives	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK	Yes	No	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
	without rear drives	150 W < TDP <= 205 W	HPR Gold Fan (VHP)	HPR HSK	Yes	No	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
	with rear dries	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK	Yes	Yes	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
	with rear dries	150 W < TDP <= 185 W	HPR Gold Fan (VHP)	HPR HSK	Yes	Yes	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
10 x 2.5-inch drives SAS4/SATA	without rear drives	TDP <= 150 W	STD Fan	STD HSK	Yes	No	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
10 x 2.5-inch drives SAS4/SATA	without rear drives	150 W < TDP <= 205 W	HPR Gold Fan (VHP)	HPR HSK	Yes	No	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
10 x 2.5-inch drives SAS4/SATA	with rear dries	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK	Yes	Yes	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
10 x 2.5-inch drives SAS4/SATA	with rear dries	150 W < TDP <= 205 W	HPR Gold Fan (VHP)	HPR HSK	Yes	Yes	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
8 x 2.5-inch NVMe	without rear drives	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK	Yes	Yes	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
8 x 2.5-inch NVMe	without rear drives	150 W < TDP <= 205 W	HPR Gold Fan (VHP)	HPR HSK	Yes	Yes	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
8 x 2.5-inch NVMe	with rear dries	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK	Yes	Yes	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
8 x 2.5-inch NVMe	with rear dries	150 W < TDP <= 205 W	HPR Gold Fan (VHP)	HPR HSK	Yes	Yes	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
10 x 2.5-inch SAS3/SATA drives	without rear drives	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK	Yes	No	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
10 x 2.5-inch SAS3/SATA drives	without rear drives	150 W < TDP <= 205 W	HPR Gold Fan (VHP)	HPR HSK	Yes	No	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
10 x 2.5-inch NVMe drives	without rear drives	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK	Yes	Yes	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
10 x 2.5-inch NVMe drives	without rear drives	150 W < TDP <= 205 W	HPR Gold Fan (VHP)	HPR HSK	Yes	Yes	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
10 x 2.5-inch NVMe drives	with rear dries	TDP <= 150 W	HPR Gold Fan (VHP)	STD HSK	Yes	Yes	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No
10 x 2.5-inch NVMe drives	with rear dries	150 W < TDP <= 205 W	HPR Gold Fan (VHP)	HPR HSK	Yes	Yes	Only required on processor 2 for 1 processor Configuration	7 x Fans for all Configurations	No

Table 21. Thermal Solution Configuration with OSM with TDP > 185 W, 205 W, 225 WThis table describes theThermal Solution Configuration with OSM with TDP > 185 W, 205 W, 225 W.
Configurations	Rear drive configurations	Processor (TDP)	Fan type	Heat sink type	Air Shroud	Memory Blank	Processor Blank	Fan Counts	Fan Blank
3.5-inch HDDs x2 (3.5-inch HDDs x4 config remove HDD 2 & 3 and replace by HDD blank)	W/O RM Support PCIe Slot 1 + OCP3.0 Only (no BOSS & PCIe slot 2 and 3)	205W <TDP<= 250W	Brickfielder Fan (STD)	HPR HS	Yes	No	Yes for 1x Processor config No for 2x Processor Config	7 x Fans for all Configurations	No
	with rear drives	185W <TDP<= 225W	Brickfielder Fan (STD)	HPR HS		Yes
2.5-inch SAS3/SATA x4 2.5-inch SAS3/SATAx8 config remove HDD #4 ~ #7 and replace by SM blank	without rear drives	205W <TDP<= 250W	HPR Gold Fan (VHP)	HPR HS		No
	with rear drives	205W <TDP<= 250W	HPR Gold Fan (VHP)	HPR HS		Yes
2.5-inch SAS3/SATA x6 (2.5-inch SAS3/SATAx10 config remove HDD 6 ~ 9 and replace by SM blank)	without rear drives	225W <TDP<= 250W	HPR Gold Fan (VHP)	HPR HS		No
2.5-inch SAS4/SATA x6 2.5-inch SAS4/SATAx10 config remove HDD #6 ~ #9 and replace by SM blank	without rear drives	205W <TDP<= 250W	HPR Gold Fan (VHP)	HPR HS		No
	with rear drives	205W <TDP<= 250W	HPR Gold Fan (VHP)	HPR HS		Yes
2.5-inch NMVe x4 (2.5-inch NVMe x10, 2.5 -inch NVMex8 config remove HDD 4 ~ 9 and replace by SM blank)	without rear drives	205W <TDP<= 250W	HPR Gold Fan (VHP)	HPR HS		Yes
2.5-inch NVMe x4 2.5-inch NVMe x10 2.5-inch NVMe x8 config remove HDD #5 ~ #9 and replace by SM blank	with rear drives	205W <TDP<= 250W	HPR Gold Fan (VHP)	HPR HS		Yes

NOTE: * Based on test result, 4x3.5 config could only support CPU TDP up to 205W and DDR5 DIMM up to 12W (64G)

HS5610 Thermal Restriction (OSM)

Rear NVMe /SAS/SATA drives Thermal Restriction

The following NVMe /SAS drives could NOT support in RM . (But could support in front SM)

Samsung PM1735a/PM1735 Capacities > 6.4TB in all configs.
Samsung PM1733a/PM1733 Capacities > 7.68TB in all configs.
Skhynix PE8010 Capacity >960GB in 3.5-inch config.
Skhynix PE8010 Capacity >1.92TB in 2.5-inch config.
Kioxia CM6 all capacities in all configs.
Kioxia PM6 SAS all capacities in all configs.
Redtail NVMe all capacities in all configs.
Hynix SATA SSD SE5031 all capacities or SSD with thermal spec <70C.

Optic Transceiver Restriction

Optic transceiver with thermal spec 85C are required for all PCIe and OCP3.0 NIC cards in OSM system.