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Dell PowerEdge C6620: руководство по обслуживанию
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Dell PowerEdge C6620: руководство по обслуживанию

Sled dimensions

Figure 1. Sled dimensions

This figure shows the dimensions of the sled C6520.

Table 1. PowerEdgeC6620 sled dimensionsThis table provides the dimensions of the sled:
X Y Z
174.4 mm (6.86 inches)40.0 mm (1.57 inches)549.7 mm (21.64 inches) - diskless configuration

561.3 mm (22.10 inches) - 2.5-inch E3.s configuration

System weight

Table 1. PowerEdge C6620 system weightThe table below shows the maximum weight of the system.
System configuration Maximum weight
Air cooling 5.1 kg (11.2 lb)
Liquid cooling 5.1 kg (11.2 lb)

Processor specifications

Table 1. PowerEdge C6620 processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
4th and 5th Generation Intel Xeon Scalable processors with up to 64 cores Up to two

Minimum firmware version requirements

Table 2. Minimum firmware requirements for CPUsThe following table shows the minimum firmware version requirements for the CPUs.
Processors iDRAC BIOS CPLD
8580 7.10.05.00 2.0.0 1.0.5
6548Y
8592
8558U
6542Y
6548N
8562Y
5512U
8568Y
4510
6526Y
4509Y
4514Y
6534
8462Y+ 6.10.39.00 1.2.1 1.0.5
6458Q
6448Y
6444Y
6442Y
6438Y+
6438M
6434
6426Y
5420+
5418Y
5416S
5415+
5412U
4416+
4410Y
3408U
9480 6.10.80.00 1.3.2 1.0.5
9470
9460
9462

PSU specifications

The PowerEdge C6620 system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) (BTU/hr) Frequency (Hz) Voltage AC DC Current (A)
High line wattage Low line wattage
3200 W N/A 12000 BTU/hr N/A 336 V DC N/A N/A 3200 W 11.5 A
3200 W N/A 12000 BTU/hr 50/60 Hz 277 V AC 3200 W N/A N/A 13.0 A
2800 W N/A 10500 BTU/hr N/A 240 V DC N/A N/A 2800 W 13.6 A
2800 W Titanium 10500 BTU/hr 50/60 Hz 200-240 V AC 2800 W N/A N/A 15.6 A
2400 W N/A 9000 BTU/hr N/A 240 V DC N/A N/A 2400 W 11.2 A
2400 W Platinum 9000 BTU/hr 50/60 Hz 100-240 V AC 2400 W 1400 W N/A 16-13.5 A
1800 W N/A 6750 BTU/hr N/A 240 VDC N/A N/A 1800 W 8.2 A
1800 W Titanium 6750 BTU/hr 50/60 Hz 200-240 V AC 1800 W N/A N/A 10 A
NOTE:3200 W AC and DC power supplies are only available in North America.
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

Supported operating systems

The PowerEdge C6620 system supports the following operating systems:
  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware vSAN/ESXi

For more information, go to OS support.

System battery specifications

The PowerEdge C6620 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdgeC6620 system supports up to four PCI express (PCIe) slots on the system board.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot Expansion card riser Processor connection Height Length Slot width
Slot 1 Riser 1A Processor 1 Low Profile Half length x16
Slot 1 Riser 1B Processor 1, 2 Low Profile Half length x8 + x8
Slot 2 Riser 2B Processor 2 Low Profile Half length x16
Slot 2 Riser 2A Processor 1 Low Profile Half length x8 + x8

Memory specifications

The PowerEdge C6620 system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum system capacity Maximum system capacity Minimum system capacity Maximum system capacity
DDR5 RDIMM Single rank 16 GB 16 GB 128 GB 32 GB 256 GB
Dual rank 32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1 TB
128 GB 128 GB 1 TB 256 GB 2 TB
256 GB 256 GB 2 TB 512 GB 4 TB
NOTE:DDR4 DIMMs are not supported in the C6620 sled.
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
16, 288-pin 4800 MT/s, 5600 MT/s
NOTE:Memory DIMM slots are not hot swappable.

Storage controller specifications

The PowerEdge C6620 system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller cards
Internal controllers
  • PERC H965i
  • PERC H755
  • PERC H355
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 SSDs or uSD card
Software RAID
  • S160
SAS Hot Bus Adapters (HBA)
  • HBA355i

Drives

The PowerEdge C6620 system supports:
  • 16 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives
  • 8 x E3.s NVMe SSD drives
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page >Browse all Products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

The PowerEdge C6620 system supports one USB 3.0 on the rear of each sled.

Display port specifications

The PowerEdge C6620 system supports one Mini-DisplayPort on the rear of each sled.

NIC port specifications

The PowerEdge C6620 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM card 1 GbE x 1
OCP card (OCP 3.0) 1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 25 GbE x 4

iDRAC9 port specifications

The PowerEdge C6620 system supports one iDRAC Direct port (Micro-AB USB 2.0-compliant port) on the rear of the system.

GPU specifications

The PowerEdge C6620 system supports up to two 75 W (Low-Profile) GPUs.

Video specifications

The PowerEdge C6620 system supports integrated Matrox G200 graphics controller from mini-DP display port.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
640 x 480 60 8, 16, 32
800 x 600 60 8, 16, 32
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, see the Product Environmental Datasheet located in the Documentation on Dell Support.
Table 1. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Item Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft)
Table 2. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Item Allowable continuous operations

Temperature range for altitudes <= 900 m (<= 2953 ft)

5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft)
Table 3. Common Environmental Specifications for ASHRAE A3 and A4 This table describes the shared requirements across all categories.
Item Allowable continuous operations
Maximum temperature gradient (applies to both operation and nonoperation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Nonoperational temperature limits -40°C to 65°C (-104°F to 149°F)
Nonoperational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum nonoperational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 4. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 5. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal air restrictions for C6620

ASHRAE A3/A4 configuration restrictions

  • NVMe SSD and E3.s are not supported
  • A2 GPU is not supported.
  • 128 GB and 256 GB DIMM is not supported
  • CPU TDP restrictions:
    • Air cooled 2.5-inch chassis:
      • Maximum supported CPU TDP is 150 W for one processor configuration
      • Two processor configuration is not supported
    • Air cooled with no backplane chassis
      • Maximum supported CPU TDP is 250 W for one processor configuration
      • Maximum supported CPU TDP is 205 W for two processor configuration

DIMM/HDD/M.2 Blanks Restriction

  • Table 1. DIMM blank requirementsDIMM blank requirements.
    Requirements 1 socket configuration 2 socket configuration
    CPU 1 slot CPU 2 slot CPU 1 slot CPU 2 slot
    DIMM blank requirement Yes No Yes Yes
  • All sled slots must be fully populated or blanked.
  • All HDD slots must be fully populated or blanked
  • BOSS card slot must be populated or blanked
  • All PSU slots must be fully populated or blanked
  • All E3.s slots must be fully populated or blanked

Mixed Sled Restriction

Mix of 1P sled and 2P sled on the same chassis is restricted. Only homogeneous 1P sleds or homogeneous 2P sleds can be supported.

Thermal restrictions

NOTE:Not available: Indicates that the configuration is not offered by Dell Technologies.
NOTE:Not supported: Indicates that the configuration is not thermally supported.
NOTE:All components including the DIMMs, communication cards, M.2 SATA, and PERC cards can be supported with sufficient thermal margin if the ambient temperature is equal to or below the maximum continuous operating temperature that is listed in these tables.

Processor/DIMM/HDD/M.2 blanks requirement

All component slots that are listed below must be fully populated or blanked.

  • Sled slot
  • HDD slot
  • BOSS slot
  • PSU slot
  • EDSFF slot
Table 1. DIMM blank requirementsDIMM blank requirements.
CPU installed 1x socket configuration 2x socket configuration
DIMM slots of CPU1 slot CPU2 slot CPU1 slot CPU2 slot
DIMM blank requirement Yes No Yes Yes
Table 2. DIMM blank requirements for Xeon Max CPUDIMM blank requirements.
Specific for Xeon Max only mode with liquid cooled chassis 2x socket configuration
CPU1 slot CPU2 slot
DIMM blank requirements No No

ASHRAE A3/A4 configuration restriction

  • NVMe SSD and EDSFF are not supported.
  • A2 GPU is not supported.
  • 128 GB and 256 GB DIMMs are not supported.
  • CPU TDP Restriction
    • Air cooled, 2.5-inch chassis
      • The maximum supported CPU TDP is 150 W for a 1x Processor configuration.
      • 2x Processors configuration is not supported.
    • Air cooled, no backplane chassis
      • The maximum supported CPU TDP is 250 W for a 1x Processor configuration.
      • The maximum supported CPU TDP is 185 W for 2x Processors configuration.

Mixed sled restriction

The mix of 1P sleds and 2P sleds on the same chassis is restricted. Only homogeneous 1P sleds or homogeneous 2P sleds can be supported.

Temperature restriction for air cooled 2.5-inch HDDs/2.5-inch NVMe/No backplane/EDSFF chassis without A2 GPU

Table 3. Supported ambient temperature (2P) - 2.5-inch chassis, air cooledSupported ambient temperature (2P) - 2.5-inch chassis, air cooled.
Processor TDP Core Model CPU1 HSK CPU2 HSK DIMM Capacity ≤ 96 GB/DIMM DIMM Capacity = 128 GB DIMM DIMM Capacity = 256 GB DIMM
8592+ 350 W 64 XCC N/A N/A N/A N/A N/A
8580 350 W 60 XCC N/A N/A N/A N/A N/A
8480+ 350 W 56 XCC N/A N/A N/A N/A N/A
9480 350 W 56 Xeon Max N/A N/A N/A N/A N/A
8470Q 350 W 52 XCC N/A N/A N/A N/A N/A
8470 350 W 52 XCC N/A N/A N/A N/A N/A
9470 350 W 52 Xeon Max N/A N/A N/A N/A N/A
8568Y+ 350 W 48 XCC N/A N/A N/A N/A N/A
8468 350 W 48 XCC N/A N/A N/A N/A N/A
8458P 350 W 44 XCC N/A N/A N/A N/A N/A
9460 350 W 40 Xeon Max N/A N/A N/A N/A N/A
6458Q 350 W 32 MCC N/A N/A N/A N/A N/A
9462 350 W 32 Xeon Max N/A N/A N/A N/A N/A
8468V 330 W 48 XCC N/A N/A N/A N/A N/A
8471N 300 W 52 XCC N/A N/A N/A N/A N/A
8470N 300 W 52 XCC N/A N/A N/A N/A N/A
8461V 300 W 48 XCC N/A N/A N/A N/A N/A
8558U 300 W 48 XCC N/A N/A N/A N/A N/A
8460Y+ 300 W 40 XCC N/A N/A N/A N/A N/A
8452Y 300 W 36 XCC N/A N/A N/A N/A N/A
8562Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
8462Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
6454S 270 W 32 XCC N/A N/A N/A N/A N/A
8454H 270 W 32 XCC N/A N/A N/A N/A N/A
6430 270 W 32 XCC N/A N/A N/A N/A N/A
6444Y 270 W 16 MCC N/A N/A N/A N/A N/A
6414U 250 W 32 XCC N/A N/A N/A N/A N/A
6548Y+ 250 W 32 MCC N/A N/A N/A N/A N/A
6542Y 250 W 24 MCC N/A N/A N/A N/A N/A
6448Y 225 W 32 MCC N/A N/A N/A N/A N/A
6442Y 225 W 24 MCC N/A N/A N/A N/A N/A
6438M 205 W 32 MCC T0FVH (Extended) V25GT 25 20 20
6438Y+ 205 W 32 MCC T0FVH (Extended) V25GT 25 20 20
5420+ 205 W 28 MCC T0FVH (Extended) V25GT 25 20 20
6526Y 195 W 16 MCC T0FVH (Extended) V25GT 20 20 20
6534 195 W 8 MCC T0FVH (Extended) V25GT 20 20 20
6434 195 W 8 MCC T0FVH (Extended) V25GT 20 20 20
5418Y 185 W 24 MCC V3P2V (General) V25GT 20* 20* 20*
6426Y 185 W 16 MCC V3P2V (General) V25GT 20* 20* 20*
4416+ 165 W 20 MCC V3P2V (General) V25GT 30* 25* 25*
4514Y 150 W 16 MCC V3P2V (General) V25GT 30* 25* 25*
5416S 150 W 16 MCC V3P2V (General) V25GT 30* 25* 25*
4410Y 150 W 12 MCC V3P2V (General) V25GT 30* 25* 25*
4510 150 W 12 LCC V3P2V (General) V25GT 30* 25* 25*
5415+ 150 W 8 MCC V3P2V (General) V25GT 30* 25* 25*
4509Y 125 W 8 LCC V3P2V (General) V25GT 30* 25* 25*
Table 4. Supported ambient temperature (1P) - 2.5-inch chassis, air cooledSupported ambient temperature (1P) - 2.5-inch chassis, air cooled.
Processor TDP Core Model CPU1 HSK CPU2 HSK DIMM Capacity ≤ 96 GB/DIMM DIMM Capacity = 128 GB DIMM DIMM Capacity = 256 GB DIMM
8592+ 350 W 64 XCC N/A N/A N/A N/A N/A
8580 350 W 60 XCC N/A N/A N/A N/A N/A
8480+ 350 W 56 XCC N/A N/A N/A N/A N/A
9480 350 W 56 Xeon Max N/A N/A N/A N/A N/A
8470Q 350 W 52 XCC N/A N/A N/A N/A N/A
8470 350 W 52 XCC N/A N/A N/A N/A N/A
9470 350 W 52 Xeon Max N/A N/A N/A N/A N/A
8568Y+ 350 W 48 XCC N/A N/A N/A N/A N/A
8468 350 W 48 XCC N/A N/A N/A N/A N/A
8458P 350 W 44 XCC N/A N/A N/A N/A N/A
9460 350 W 40 Xeon Max N/A N/A N/A N/A N/A
6458Q 350 W 32 MCC N/A N/A N/A N/A N/A
9462 350 W 32 Xeon Max N/A N/A N/A N/A N/A
8468V 330 W 48 XCC N/A N/A N/A N/A N/A
8471N 300 W 52 XCC N/A N/A N/A N/A N/A
8470N 300 W 52 XCC N/A N/A N/A N/A N/A
8461V 300 W 48 XCC N/A N/A N/A N/A N/A
8558U 300 W 48 XCC N/A N/A N/A N/A N/A
8460Y+ 300 W 40 XCC N/A N/A N/A N/A N/A
8452Y 300 W 36 XCC N/A N/A N/A N/A N/A
8562Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
8462Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
6454S 270 W 32 XCC T0FVH (Extended) N/A 25 25 25
8454H 270 W 32 XCC T0FVH (Extended) N/A 25 25 25
6430 270 W 32 XCC T0FVH (Extended) N/A 25 25 25
6444Y 270 W 16 MCC T0FVH (Extended) N/A 25 25 25
6414U 250 W 32 XCC T0FVH (Extended) N/A 25 25 25
6548Y+ 250 W 32 MCC V3P2V (General) N/A 25 25 25
6542Y 250 W 24 MCC V3P2V (General) N/A 25 25 25
6448Y 225 W 32 MCC V3P2V (General) N/A 30* 25 25
6442Y 225 W 24 MCC V3P2V (General) N/A 30* 25 25
6438M 205 W 32 MCC V3P2V (General) N/A 30* 25* 25*
6438Y+ 205 W 32 MCC V3P2V (General) N/A 30* 25* 25*
5420+ 205 W 28 MCC V3P2V (General) N/A 30* 25* 25*
6526Y 195 W 16 MCC V3P2V (General) N/A 25 25 25
6534 195 W 8 MCC V3P2V (General) N/A 25 25 25
6434 195 W 8 MCC V3P2V (General) N/A 25 25 25
5512U 185 W 28 MCC V3P2V (General) N/A 35 30 30
5418Y 185 W 24 MCC V3P2V (General) N/A 35 30 30
5412U 185 W 24 MCC V3P2V (General) N/A 35 30 30
6426Y 185 W 16 MCC V3P2V (General) N/A 35 30 30
4416+ 165 W 20 MCC V3P2V (General) N/A 35 30 30
4514Y 150 W 16 MCC V3P2V (General) N/A 35 35 35
5416S 150 W 16 MCC V3P2V (General) N/A 35 35 35
4410Y 150 W 12 MCC V3P2V (General) N/A 35 35 35
5415+ 150 W 8 MCC V3P2V (General) N/A 35 35 35
4510 150 W 12 LCC V3P2V (General) N/A 35 35 35
3408U 125 W 8 MCC V3P2V (General) N/A 35 35 35
4509Y 125 W 8 LCC V3P2V (General) N/A 35 35 35
Table 5. Supported ambient temperature (2P) - NVMe chassis, air cooledSupported ambient temperature (2P) - NVMe chassis, air cooled.
Processor TDP Core Model CPU1 HSK CPU2 HSK DIMM Capacity ≤ 96 GB/DIMM DIMM Capacity = 128 GB DIMM DIMM Capacity = 256 GB DIMM
8592+ 350 W 64 XCC N/A N/A N/A N/A N/A
8580 350 W 60 XCC N/A N/A N/A N/A N/A
8480+ 350 W 56 XCC N/A N/A N/A N/A N/A
9480 350 W 56 Xeon Max N/A N/A N/A N/A N/A
8470Q 350 W 52 XCC N/A N/A N/A N/A N/A
8470 350 W 52 XCC N/A N/A N/A N/A N/A
9470 350 W 52 Xeon Max N/A N/A N/A N/A N/A
8568Y+ 350 W 48 XCC N/A N/A N/A N/A N/A
8468 350 W 48 XCC N/A N/A N/A N/A N/A
8458P 350 W 44 XCC N/A N/A N/A N/A N/A
9460 350 W 40 Xeon Max N/A N/A N/A N/A N/A
6458Q 350 W 32 MCC N/A N/A N/A N/A N/A
9462 350 W 32 Xeon Max N/A N/A N/A N/A N/A
8468V 330 W 48 XCC N/A N/A N/A N/A N/A
8470N 300 W 52 XCC N/A N/A N/A N/A N/A
8460Y+ 300 W 40 XCC N/A N/A N/A N/A N/A
8452Y 300 W 36 XCC N/A N/A N/A N/A N/A
8562Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
8462Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
6454S 270 W 32 XCC N/A N/A N/A N/A N/A
8454H 270 W 32 XCC N/A N/A N/A N/A N/A
6430 270 W 32 XCC N/A N/A N/A N/A N/A
6444Y 270 W 16 MCC N/A N/A N/A N/A N/A
6548Y+ 250 W 32 MCC N/A N/A N/A N/A N/A
6542Y 250 W 24 MCC N/A N/A N/A N/A N/A
6448Y 225 W 32 MCC N/A N/A N/A N/A N/A
6442Y 225 W 24 MCC N/A N/A N/A N/A N/A
6438M 205 W 32 MCC T0FVH (Extended) V25GT 20 N/A N/A
6438Y+ 205 W 32 MCC T0FVH (Extended) V25GT 20 N/A N/A
5420+ 205 W 28 MCC T0FVH (Extended) V25GT 20 N/A N/A
6526Y 195 W 16 MCC N/A N/A N/A N/A N/A
6534 195 W 8 MCC N/A N/A N/A N/A N/A
6434 195 W 8 MCC N/A N/A N/A N/A N/A
5418Y 185 W 24 MCC V3P2V (General) V25GT 20* N/A N/A
6426Y 185 W 16 MCC V3P2V (General) V25GT 20* N/A N/A
4416+ 165 W 20 MCC V3P2V (General) V25GT 25* N/A N/A
4514Y 150 W 16 MCC V3P2V (General) V25GT 25* N/A N/A
5416S 150 W 16 MCC V3P2V (General) V25GT 25* N/A N/A
4410Y 150 W 12 MCC V3P2V (General) V25GT 25* N/A N/A
4510 150 W 12 LCC V3P2V (General) V25GT 25* N/A N/A
5415+ 150 W 8 MCC V3P2V (General) V25GT 25* N/A N/A
4509Y 125 W 8 LCC V3P2V (General) V25GT 25* N/A N/A
Table 6. Supported ambient temperature (1P) - NVMe chassis, air cooledSupported ambient temperature (1P) - NVMe chassis, air cooled.
Processor TDP Core Model CPU1 HSK CPU2 HSK DIMM Capacity ≤ 96 GB/DIMM DIMM Capacity = 128 GB DIMM DIMM Capacity = 256 GB DIMM
8592+ 350 W 64 XCC N/A N/A N/A N/A N/A
8580 350 W 60 XCC N/A N/A N/A N/A N/A
8480+ 350 W 56 XCC N/A N/A N/A N/A N/A
9480 350 W 56 Xeon Max N/A N/A N/A N/A N/A
8470Q 350 W 52 XCC N/A N/A N/A N/A N/A
8470 350 W 52 XCC N/A N/A N/A N/A N/A
9470 350 W 52 Xeon Max N/A N/A N/A N/A N/A
8568Y+ 350 W 48 XCC N/A N/A N/A N/A N/A
8468 350 W 48 XCC N/A N/A N/A N/A N/A
8458P 350 W 44 XCC N/A N/A N/A N/A N/A
9460 350 W 40 Xeon Max N/A N/A N/A N/A N/A
6458Q 350 W 32 MCC N/A N/A N/A N/A N/A
9462 350 W 32 Xeon Max N/A N/A N/A N/A N/A
8468V 330 W 48 XCC N/A N/A N/A N/A N/A
8471N 300 W 52 XCC N/A N/A N/A N/A N/A
8470N 300 W 52 XCC N/A N/A N/A N/A N/A
8461V 300 W 48 XCC N/A N/A N/A N/A N/A
8558U 300 W 48 XCC N/A N/A N/A N/A N/A
8460Y+ 300 W 40 XCC N/A N/A N/A N/A N/A
8452Y 300 W 36 XCC N/A N/A N/A N/A N/A
8562Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
8462Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
6454S 270 W 32 XCC N/A N/A N/A N/A N/A
8454H 270 W 32 XCC N/A N/A N/A N/A N/A
6430 270 W 32 XCC N/A N/A N/A N/A N/A
6444Y 270 W 16 MCC N/A N/A N/A N/A N/A
6414U 250 W 32 XCC N/A N/A N/A N/A N/A
6548Y+ 250 W 32 MCC N/A N/A N/A N/A N/A
6542Y 250 W 24 MCC N/A N/A N/A N/A N/A
6448Y 225 W 32 MCC V3P2V (General) N/A 25 20 20
6442Y 225 W 24 MCC V3P2V (General) N/A 25 20 20
6438M 205 W 32 MCC V3P2V (General) N/A 30 20 20
6438Y+ 205 W 32 MCC V3P2V (General) N/A 30 20 20
5420+ 205 W 28 MCC V3P2V (General) N/A 30 20 20
6526Y 195 W 16 MCC V3P2V (General) N/A 25 20 20
6534 195 W 8 MCC V3P2V (General) N/A 25 20 20
6434 195 W 8 MCC V3P2V (General) N/A 25 20 20
5512U 185 W 28 MCC V3P2V (General) N/A 35 25 25
5418Y 185 W 24 MCC V3P2V (General) N/A 35 25 25
5412U 185 W 24 MCC V3P2V (General) N/A 35 25 25
6426Y 185 W 16 MCC V3P2V (General) N/A 35 25 25
4416+ 165 W 20 MCC V3P2V (General) N/A 35 25 25
4514Y 150 W 16 MCC V3P2V (General) N/A 35 30 30
5416S 150 W 16 MCC V3P2V (General) N/A 35 30 30
4410Y 150 W 12 MCC V3P2V (General) N/A 35 30 30
5415+ 150 W 8 MCC V3P2V (General) N/A 35 30 30
4510 150 W 12 LCC V3P2V (General) N/A 35 30 30
3408U 125 W 8 MCC V3P2V (General) N/A 35 30 30
4509Y 125 W 8 LCC V3P2V (General) N/A 35 30 30
Table 7. Supported ambient temperature (2P) - no backplane chassis and EDSFF chassis, air cooledSupported ambient temperature (2P) - no backplane chassis and EDSFF chassis, air cooled.
Processor TDP Core Model CPU1 HSK CPU2 HSK DIMM Capacity ≤ 96 GB/DIMM DIMM Capacity = 128 GB DIMM DIMM Capacity = 256 GB DIMM
8592+ 350 W 64 XCC N/A N/A N/A N/A N/A
8580 350 W 60 XCC N/A N/A N/A N/A N/A
8480+ 350 W 56 XCC N/A N/A N/A N/A N/A
9480 350 W 56 Xeon Max N/A N/A N/A N/A N/A
8470Q 350 W 52 XCC N/A N/A N/A N/A N/A
8470 350 W 52 XCC N/A N/A N/A N/A N/A
9470 350 W 52 Xeon Max N/A N/A N/A N/A N/A
8568Y+ 350 W 48 XCC N/A N/A N/A N/A N/A
8468 350 W 48 XCC N/A N/A N/A N/A N/A
8458P 350 W 44 XCC N/A N/A N/A N/A N/A
9460 350 W 40 Xeon Max N/A N/A N/A N/A N/A
6458Q 350 W 32 MCC N/A N/A N/A N/A N/A
9462 350 W 32 Xeon Max N/A N/A N/A N/A N/A
8468V 330 W 48 XCC N/A N/A N/A N/A N/A
8470N 300 W 52 XCC T0FVH (Extended) V25GT 20 20 20
8460Y+ 300 W 40 XCC T0FVH (Extended) V25GT 20 20 20
8452Y 300 W 36 XCC T0FVH (Extended) V25GT 20 20 20
8562Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
8462Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
6454S 270 W 32 XCC T0FVH (Extended) V25GT 25 25 25
8454H 270 W 32 XCC T0FVH (Extended) V25GT 25 25 25
6430 270 W 32 XCC T0FVH (Extended) V25GT 25 25 25
6444Y 270 W 16 MCC T0FVH (Extended) V25GT 20 20 20
6548Y+ 250 W 32 MCC V3P2V (General) V25GT 25* 25* 25*
6542Y 250 W 24 MCC V3P2V (General) V25GT 25* 25* 25*
6448Y 225 W 32 MCC V3P2V (General) V25GT 30* 30* 30*
6442Y 225 W 24 MCC V3P2V (General) V25GT 30* 30* 30*
6438M 205 W 32 MCC V3P2V (General) V25GT 35 35 35
6438Y+ 205 W 32 MCC V3P2V (General) V25GT 35 35 35
5420+ 205 W 28 MCC V3P2V (General) V25GT 35 35 35
6526Y 195 W 16 MCC V3P2V (General) V25GT 35 35 35
6534 195 W 8 MCC V3P2V (General) V25GT 35 35 35
6434 195 W 8 MCC V3P2V (General) V25GT 35 35 35
5418Y 185 W 24 MCC V3P2V (General) V25GT 35 35 35
6426Y 185 W 16 MCC V3P2V (General) V25GT 35 35 35
4416+ 165 W 20 MCC V3P2V (General) V25GT 35 35 35
4514Y 150 W 16 MCC V3P2V (General) V25GT 35 35 35
5416S 150 W 16 MCC V3P2V (General) V25GT 35 35 35
4410Y 150 W 12 MCC V3P2V (General) V25GT 35 35 35
4510 150 W 12 LCC V3P2V (General) V25GT 35 35 35
5415+ 150 W 8 MCC V3P2V (General) V25GT 35 35 35
4509Y 125 W 8 LCC V3P2V (General) V25GT 35 35 35
Table 8. Supported ambient temperature (1P) - no backplane chassis and EDSFF chassis, air cooledSupported ambient temperature (1P) - no backplane chassis and EDSFF chassis, air cooled.
Processor TDP Core Model CPU1 HSK CPU2 HSK DIMM Capacity ≤ 96 GB/DIMM DIMM Capacity = 128 GB DIMM DIMM Capacity = 256 GB DIMM
8592+ 350 W 64 XCC T0FVH (Extended) N/A 30 30 30
8580 350 W 60 XCC T0FVH (Extended) N/A 30 30 30
8480+ 350 W 56 XCC T0FVH (Extended) N/A 30 30 30
9480 350 W 56 Xeon Max N/A N/A N/A N/A N/A
8470Q 350 W 52 XCC N/A N/A N/A N/A N/A
8470 350 W 52 XCC T0FVH (Extended) N/A 30 30 30
9470 350 W 52 Xeon Max N/A N/A N/A N/A N/A
8568Y+ 350 W 48 XCC T0FVH (Extended) N/A 30 30 30
8468 350 W 48 XCC T0FVH (Extended) N/A 30 30 30
8458P 350 W 44 XCC T0FVH (Extended) N/A 30 30 30
9460 350 W 40 Xeon Max T0FVH (Extended) N/A 30 30 30
6458Q 350 W 32 MCC N/A N/A N/A N/A N/A
9462 350 W 32 Xeon Max T0FVH (Extended) N/A 30 30 30
8468V 330 W 48 XCC V3P2V (General) N/A 25* 25* 25*
8471N 300 W 52 XCC V3P2V (General) N/A 35 35 35
8470N 300 W 52 XCC V3P2V (General) N/A 35 35 35
8461V 300 W 48 XCC V3P2V (General) N/A 35 35 35
8558U 300 W 48 XCC V3P2V (General) N/A 35 35 35
8460Y+ 300 W 40 XCC V3P2V (General) N/A 35 35 35
8452Y 300 W 36 XCC V3P2V (General) N/A 35 35 35
8562Y+ 300 W 32 MCC V3P2V (General) N/A 35 35 35
8462Y+ 300 W 32 MCC V3P2V (General) N/A 35 35 35
6454S 270 W 32 XCC V3P2V (General) N/A 35 35 35
8454H 270 W 32 XCC V3P2V (General) N/A 35 35 35
6430 270 W 32 XCC V3P2V (General) N/A 35 35 35
6444Y 270 W 16 MCC V3P2V (General) N/A 35 35 35
6414U 250 W 32 XCC V3P2V (General) N/A 35 35 35
6548Y+ 250 W 32 MCC V3P2V (General) N/A 35 35 35
6542Y 250 W 24 MCC V3P2V (General) N/A 35 35 35
6448Y 225 W 32 MCC V3P2V (General) N/A 35 35 35
6442Y 225 W 24 MCC V3P2V (General) N/A 35 35 35
6438M 205 W 32 MCC V3P2V (General) N/A 35 35 35
6438Y+ 205 W 32 MCC V3P2V (General) N/A 35 35 35
5420+ 205 W 28 MCC V3P2V (General) N/A 35 35 35
6526Y 195 W 16 MCC V3P2V (General) N/A 35 35 35
6534 195 W 8 MCC V3P2V (General) N/A 35 35 35
6434 195 W 8 MCC V3P2V (General) N/A 35 35 35
5512U 185 W 28 MCC V3P2V (General) N/A 35 35 35
5418Y 185 W 24 MCC V3P2V (General) N/A 35 35 35
5412U 185 W 24 MCC V3P2V (General) N/A 35 35 35
6426Y 185 W 16 MCC V3P2V (General) N/A 35 35 35
4416+ 165 W 20 MCC V3P2V (General) N/A 35 35 35
4514Y 150 W 16 MCC V3P2V (General) N/A 35 35 35
5416S 150 W 16 MCC V3P2V (General) N/A 35 35 35
4410Y 150 W 12 MCC V3P2V (General) N/A 35 35 35
5415+ 150 W 8 MCC V3P2V (General) N/A 35 35 35
4510 150 W 12 LCC V3P2V (General) N/A 35 35 35
3408U 125 W 8 MCC V3P2V (General) N/A 35 35 35
4509Y 125 W 8 LCC V3P2V (General) N/A 35 35 35

Temperature restriction for liquid cooled 2.5-inch HDDs/2.5-inch NVMe/No backplane/EDSFF chassis without A2 GPU

Table 9. Supported ambient temperature - no backplane chassis, EDSFF, and 2.5-inch HDD chassis, liquid cooledSupported ambient temperature - no backplane chassis, EDSFF, and 2.5-inch HDD chassis, liquid cooled.
Processor TDP Core Model CPU1 HSK CPU2 HSK DIMM Capacity ≤ 96 GB/DIMM DIMM Capacity = 128 GB DIMM DIMM Capacity = 256 GB DIMM
8592+ 350 W 64 XCC Cold plate Cold plate 35 35 35
8580 350 W 60 XCC Cold plate Cold plate 35 35 35
8480+ 350 W 56 XCC Cold plate Cold plate 35 35 35
9480 350 W 56 Xeon Max Cold plate Cold plate 35 35 35
8470Q 350 W 52 XCC Cold plate Cold plate 35 35 35
8470 350 W 52 XCC Cold plate Cold plate 35 35 35
9470 350 W 52 Xeon Max Cold plate Cold plate 35 35 35
8568Y+ 350 W 48 XCC Cold plate Cold plate 35 35 35
8468 350 W 48 XCC Cold plate Cold plate 35 35 35
8458P 350 W 44 XCC Cold plate Cold plate 35 35 35
9460 350 W 40 Xeon Max Cold plate Cold plate 35 35 35
6458Q 350 W 32 MCC Cold plate Cold plate 35 35 35
9462 350 W 32 Xeon Max Cold plate Cold plate 35 35 35
8468V 330 W 48 XCC Cold plate Cold plate 35 35 35
8470N 300 W 52 XCC Cold plate Cold plate 35 35 35
8460Y+ 300 W 40 XCC Cold plate Cold plate 35 35 35
8452Y 300 W 36 XCC Cold plate Cold plate 35 35 35
8562Y+ 300 W 32 MCC Cold plate Cold plate 35 35 35
8462Y+ 300 W 32 MCC Cold plate Cold plate 35 35 35
6454S 270 W 32 XCC Cold plate Cold plate 35 35 35
8454H 270 W 32 XCC Cold plate Cold plate 35 35 35
6430 270 W 32 XCC Cold plate Cold plate 35 35 35
6444Y 270 W 16 MCC Cold plate Cold plate 35 35 35
6548Y+ 250 W 32 MCC Cold plate Cold plate 35 35 35
6542Y 250 W 24 MCC Cold plate Cold plate 35 35 35
6448Y 225 W 32 MCC Cold plate Cold plate 35 35 35
6442Y 225 W 24 MCC Cold plate Cold plate 35 35 35
6438M 205 W 32 MCC Cold plate Cold plate 35 35 35
6438Y+ 205 W 32 MCC Cold plate Cold plate 35 35 35
5420+ 205 W 28 MCC Cold plate Cold plate 35 35 35
6526Y 195 W 16 MCC Cold plate Cold plate 35 35 35
6534 195 W 8 MCC Cold plate Cold plate 35 35 35
6434 195 W 8 MCC Cold plate Cold plate 35 35 35
5418Y 185 W 24 MCC Cold plate Cold plate 35 35 35
6426Y 185 W 16 MCC Cold plate Cold plate 35 35 35
4416+ 165 W 20 MCC Cold plate Cold plate 35 35 35
4514Y 150 W 16 MCC Cold plate Cold plate 35 35 35
5416S 150 W 16 MCC Cold plate Cold plate 35 35 35
4410Y 150 W 12 MCC Cold plate Cold plate 35 35 35
4510 150 W 12 LCC Cold plate Cold plate 35 35 35
5415+ 150 W 8 MCC Cold plate Cold plate 35 35 35
4509Y 125 W 8 LCC Cold plate Cold plate 35 35 35
Table 10. Supported ambient temperature - 2.5-inch NVMe chassis, liquid cooled without A2 GPU Supported ambient temperature - 2.5-inch NVMe chassis, liquid cooled without A2 GPU.
Processor TDP Core Model CPU1 HSK CPU2 HSK DIMM Capacity ≤ 96 GB/DIMM DIMM Capacity = 128 GB DIMM DIMM Capacity = 256 GB DIMM
8592+ 350 W 64 XCC Cold plate Cold plate 35 N/A N/A
8580 350 W 60 XCC Cold plate Cold plate 35 N/A N/A
8480+ 350 W 56 XCC Cold plate Cold plate 35 N/A N/A
9480 350 W 56 Xeon Max Cold plate Cold plate 35 N/A N/A
8470Q 350 W 52 XCC Cold plate Cold plate 35 N/A N/A
8470 350 W 52 XCC Cold plate Cold plate 35 N/A N/A
9470 350 W 52 Xeon Max Cold plate Cold plate 35 N/A N/A
8568Y+ 350 W 48 XCC Cold plate Cold plate 35 N/A N/A
8468 350 W 48 XCC Cold plate Cold plate 35 N/A N/A
8458P 350 W 44 XCC Cold plate Cold plate 35 N/A N/A
9460 350 W 40 Xeon Max Cold plate Cold plate 35 N/A N/A
6458Q 350 W 32 MCC Cold plate Cold plate 35 N/A N/A
9462 350 W 32 Xeon Max Cold plate Cold plate 35 N/A N/A
8468V 330 W 48 XCC Cold plate Cold plate 35 N/A N/A
8470N 300 W 52 XCC Cold plate Cold plate 35 N/A N/A
8460Y+ 300 W 40 XCC Cold plate Cold plate 35 N/A N/A
8452Y 300 W 36 XCC Cold plate Cold plate 35 N/A N/A
8562Y+ 300 W 32 MCC Cold plate Cold plate 35 N/A N/A
8462Y+ 300 W 32 MCC Cold plate Cold plate 35 N/A N/A
6454S 270 W 32 XCC Cold plate Cold plate 35 N/A N/A
8454H 270 W 32 XCC Cold plate Cold plate 35 N/A N/A
6430 270 W 32 XCC Cold plate Cold plate 35 N/A N/A
6444Y 270 W 16 MCC Cold plate Cold plate 35 N/A N/A
6548Y+ 250 W 32 MCC Cold plate Cold plate 35 N/A N/A
6542Y 250 W 24 MCC Cold plate Cold plate 35 N/A N/A
6448Y 225 W 32 MCC Cold plate Cold plate 35 N/A N/A
6442Y 225 W 24 MCC Cold plate Cold plate 35 N/A N/A
6438M 205 W 32 MCC Cold plate Cold plate 35 N/A N/A
6438Y+ 205 W 32 MCC Cold plate Cold plate 35 N/A N/A
5420+ 205 W 28 MCC Cold plate Cold plate 35 N/A N/A
6526Y 195 W 16 MCC Cold plate Cold plate 35 N/A N/A
6534 195 W 8 MCC Cold plate Cold plate 35 N/A N/A
6434 195 W 8 MCC Cold plate Cold plate 35 N/A N/A
5418Y 185 W 24 MCC Cold plate Cold plate 35 N/A N/A
6426Y 185 W 16 MCC Cold plate Cold plate 35 N/A N/A
4416+ 165 W 20 MCC Cold plate Cold plate 35 N/A N/A
4514Y 150 W 16 MCC Cold plate Cold plate 35 N/A N/A
5416S 150 W 16 MCC Cold plate Cold plate 35 N/A N/A
4410Y 150 W 12 MCC Cold plate Cold plate 35 N/A N/A
4510 150 W 12 LCC Cold plate Cold plate 35 N/A N/A
5415+ 150 W 8 MCC Cold plate Cold plate 35 N/A N/A
4509Y 125 W 8 LCC Cold plate Cold plate 35 N/A N/A

Temperature restrictions for air cooled and liquid cooled chassis with A2 GPU

Table 11. Supported ambient temperature (2P) - no backplane chassis and EDSFF chassis, liquid cooled with A2 GPUSupported ambient temperature (2P) - no backplane chassis and EDSFF chassis, liquid cooled with A2 GPU.
Processor TDP Core Model CPU1 HSK CPU2 HSK DIMM Capacity ≤ 96 GB/DIMM DIMM Capacity = 128 GB DIMM DIMM Capacity = 256 GB DIMM
8592+ 350 W 64 XCC N/A N/A N/A N/A N/A
8580 350 W 60 XCC N/A N/A N/A N/A N/A
8480+ 350 W 56 XCC N/A N/A N/A N/A N/A
9480 350 W 56 Xeon Max N/A N/A N/A N/A N/A
8470Q 350 W 52 XCC N/A N/A N/A N/A N/A
8470 350 W 52 XCC N/A N/A N/A N/A N/A
9470 350 W 52 Xeon Max N/A N/A N/A N/A N/A
8568Y+ 350 W 48 XCC N/A N/A N/A N/A N/A
8468 350 W 48 XCC N/A N/A N/A N/A N/A
8458P 350 W 44 XCC N/A N/A N/A N/A N/A
9460 350 W 40 Xeon Max N/A N/A N/A N/A N/A
6458Q 350 W 32 MCC N/A N/A N/A N/A N/A
9462 350 W 32 Xeon Max N/A N/A N/A N/A N/A
8468V 330 W 48 XCC N/A N/A N/A N/A N/A
8470N 300 W 52 XCC T0FVH (Extended) V25GT 20 20 20
8460Y+ 300 W 40 XCC T0FVH (Extended) V25GT 20 20 20
8452Y 300 W 36 XCC T0FVH (Extended) V25GT 20 20 20
8562Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
8462Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
6454S 270 W 32 XCC T0FVH (Extended) V25GT 20 20 20
8454H 270 W 32 XCC T0FVH (Extended) V25GT 20 20 20
6430 270 W 32 XCC T0FVH (Extended) V25GT 20 20 20
6444Y 270 W 16 MCC T0FVH (Extended) V25GT 20 20 20
6548Y+ 250 W 32 MCC V3P2V (General) V25GT 25* 25* 25*
6542Y 250 W 24 MCC V3P2V (General) V25GT 25* 25* 25*
6448Y 225 W 32 MCC V3P2V (General) V25GT 30* 30* 30*
6442Y 225 W 24 MCC V3P2V (General) V25GT 30* 30* 30*
6438M 205 W 32 MCC V3P2V (General) V25GT 30* 30* 30*
6438Y+ 205 W 32 MCC V3P2V (General) V25GT 30* 30* 30*
5420+ 205 W 28 MCC V3P2V (General) V25GT 30* 30* 30*
6526Y 195 W 16 MCC V3P2V (General) V25GT 35 35 35
6534 195 W 8 MCC V3P2V (General) V25GT 35 35 35
6434 195 W 8 MCC V3P2V (General) V25GT 35 35 35
5418Y 185 W 24 MCC V3P2V (General) V25GT 35 35 35
6426Y 185 W 16 MCC V3P2V (General) V25GT 35 35 35
4416+ 165 W 20 MCC V3P2V (General) V25GT 35 35 35
4514Y 150 W 16 MCC V3P2V (General) V25GT 35 35 35
5416S 150 W 16 MCC V3P2V (General) V25GT 35 35 35
4410Y 150 W 12 MCC V3P2V (General) V25GT 35 35 35
4510 150 W 12 LCC V3P2V (General) V25GT 35 35 35
5415+ 150 W 8 MCC V3P2V (General) V25GT 35 35 35
4509Y 125 W 8 LCC V3P2V (General) V25GT 35 35 35
Table 12. Supported ambient temperature (1P) - no backplane chassis and EDSFF chassis, liquid cooled with A2 GPUSupported ambient temperature (1P) - no backplane chassis and EDSFF chassis, liquid cooled with A2 GPU.
Processor TDP Core Model CPU1 HSK CPU2 HSK DIMM Capacity ≤ 96 GB/DIMM DIMM Capacity = 128 GB DIMM DIMM Capacity = 256 GB DIMM
8592+ 350 W 64 XCC T0FVH (Extended) N/A 30 30 30
8580 350 W 60 XCC T0FVH (Extended) N/A 30 30 30
8480+ 350 W 56 XCC T0FVH (Extended) N/A 30 30 30
9480 350 W 56 Xeon Max N/A N/A N/A N/A N/A
8470Q 350 W 52 XCC N/A N/A N/A N/A N/A
8470 350 W 52 XCC T0FVH (Extended) N/A 30 30 30
9470 350 W 52 Xeon Max N/A N/A N/A N/A N/A
8568Y+ 350 W 48 XCC T0FVH (Extended) N/A 30 30 30
8468 350 W 48 XCC T0FVH (Extended) N/A 30 30 30
8458P 350 W 44 XCC T0FVH (Extended) N/A 30 30 30
9460 350 W 40 Xeon Max T0FVH (Extended) N/A 30 30 30
6458Q 350 W 32 MCC N/A N/A N/A N/A N/A
9462 350 W 32 Xeon Max N/A N/A 30 30 30
8468V 330 W 48 XCC V3P2V (General) N/A 25* 25* 25*
8471N 300 W 52 XCC V3P2V (General) N/A 30 30 30
8470N 300 W 52 XCC V3P2V (General) N/A 30 30 30
8461V 300 W 48 XCC V3P2V (General) N/A 30 30 30
8558U 300 W 48 XCC V3P2V (General) N/A 30 30 30
8460Y+ 300 W 40 XCC V3P2V (General) N/A 30 30 30
8452Y 300 W 36 XCC V3P2V (General) N/A 30 30 30
8562Y+ 300 W 32 MCC V3P2V (General) N/A 30 30 30
8462Y+ 300 W 32 MCC V3P2V (General) N/A 30 30 30
6454S 270 W 32 XCC V3P2V (General) N/A 30 30 30
8454H 270 W 32 XCC V3P2V (General) N/A 30 30 30
6430 270 W 32 XCC V3P2V (General) N/A 30 30 30
6444Y 270 W 16 MCC V3P2V (General) N/A 30 30 30
6414U 250 W 32 XCC V3P2V (General) N/A 35 35 35
6548Y+ 250 W 32 MCC V3P2V (General) N/A 35 35 35
6542Y 250 W 24 MCC V3P2V (General) N/A 35 35 35
6448Y 225 W 32 MCC V3P2V (General) N/A 35 35 35
6442Y 225 W 24 MCC V3P2V (General) N/A 35 35 35
6438M 205 W 32 MCC V3P2V (General) N/A 35 35 35
6438Y+ 205 W 32 MCC V3P2V (General) N/A 35 35 35
5420+ 205 W 28 MCC V3P2V (General) N/A 35 35 35
6526Y 195 W 16 MCC V3P2V (General) N/A 35 35 35
6534 195 W 8 MCC V3P2V (General) N/A 35 35 35
6434 195 W 8 MCC V3P2V (General) N/A 35 35 35
5512U 185 W 28 MCC V3P2V (General) N/A 35 35 35
5418Y 185 W 24 MCC V3P2V (General) N/A 35 35 35
5412U 185 W 24 MCC V3P2V (General) N/A 35 35 35
6426Y 185 W 16 MCC V3P2V (General) N/A 35 35 35
4416+ 165 W 20 MCC V3P2V (General) N/A 35 35 35
4514Y 150 W 16 MCC V3P2V (General) N/A 35 35 35
5416S 150 W 16 MCC V3P2V (General) N/A 35 35 35
4410Y 150 W 12 MCC V3P2V (General) N/A 35 35 35
5415+ 150 W 8 MCC V3P2V (General) N/A 35 35 35
4510 150 W 12 LCC V3P2V (General) N/A 35 35 35
3408U 125 W 8 MCC V3P2V (General) N/A 35 35 35
4509Y 125 W 8 LCC V3P2V (General) N/A 35 35 35
Table 13. Supported ambient temperature (1P) - 2.5-inch HDD, air cooled with A2 GPUSupported ambient temperature (1P) - 2.5-inch HDD, air cooled with A2 GPU.
Processor TDP Core Model CPU1 HSK CPU2 HSK DIMM Capacity ≤ 96 GB/DIMM DIMM Capacity = 128 GB DIMM DIMM Capacity = 256 GB DIMM
8592+ 350 W 64 XCC N/A N/A N/A N/A N/A
8580 350 W 60 XCC N/A N/A N/A N/A N/A
8480+ 350 W 56 XCC N/A N/A N/A N/A N/A
9480 350 W 56 Xeon Max N/A N/A N/A N/A N/A
8470Q 350 W 52 XCC N/A N/A N/A N/A N/A
8470 350 W 52 XCC N/A N/A N/A N/A N/A
9470 350 W 52 Xeon Max N/A N/A N/A N/A N/A
8568Y+ 350 W 48 XCC N/A N/A N/A N/A N/A
8468 350 W 48 XCC N/A N/A N/A N/A N/A
8458P 350 W 44 XCC N/A N/A N/A N/A N/A
9460 350 W 40 Xeon Max N/A N/A N/A N/A N/A
6458Q 350 W 32 MCC N/A N/A N/A N/A N/A
9462 350 W 32 Xeon Max N/A N/A N/A N/A N/A
8468V 330 W 48 XCC N/A N/A N/A N/A N/A
8471N 300 W 52 XCC N/A N/A N/A N/A N/A
8470N 300 W 52 XCC N/A N/A N/A N/A N/A
8461V 300 W 48 XCC N/A N/A N/A N/A N/A
8558U 300 W 48 XCC N/A N/A N/A N/A N/A
8460Y+ 300 W 40 XCC N/A N/A N/A N/A N/A
8452Y 300 W 36 XCC N/A N/A N/A N/A N/A
8562Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
8462Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
6454S 270 W 32 XCC N/A N/A N/A N/A N/A
8454H 270 W 32 XCC N/A N/A N/A N/A N/A
6430 270 W 32 XCC N/A N/A N/A N/A N/A
6444Y 270 W 16 MCC N/A N/A N/A N/A N/A
6414U 250 W 32 XCC T0FVH (Extended) N/A 20 20 N/A
6548Y+ 250 W 32 MCC T0FVH (Extended) N/A 20 N/A N/A
6542Y 250 W 24 MCC T0FVH (Extended) N/A 20 N/A N/A
6448Y 225 W 32 MCC T0FVH (Extended) N/A 20 N/A N/A
6442Y 225 W 24 MCC T0FVH (Extended) N/A 20 N/A N/A
6438M 205 W 32 MCC V3P2V (General) N/A 20 20 20
6438Y+ 205 W 32 MCC V3P2V (General) N/A 20 20 20
5420+ 205 W 28 MCC V3P2V (General) N/A 20 20 20
6526Y 195 W 16 MCC V3P2V (General) N/A 20 20 20
6534 195 W 8 MCC V3P2V (General) N/A 20 20 20
6434 195 W 8 MCC V3P2V (General) N/A 20 20 20
5512U 185 W 28 MCC V3P2V (General) N/A 20 20 20
5418Y 185 W 24 MCC V3P2V (General) N/A 20 20 20
5412U 185 W 24 MCC V3P2V (General) N/A 20 20 20
6426Y 185 W 16 MCC V3P2V (General) N/A 20 20 20
4416+ 165 W 20 MCC V3P2V (General) N/A 20* 20 20
4514Y 150 W 16 MCC V3P2V (General) N/A 25 20 20
5416S 150 W 16 MCC V3P2V (General) N/A 25 20 20
4410Y 150 W 12 MCC V3P2V (General) N/A 25 20 20
5415+ 150 W 8 MCC V3P2V (General) N/A 25 20 20
4510 150 W 12 LCC V3P2V (General) N/A 25 20 20
3408U 125 W 8 MCC V3P2V (General) N/A 25* 25 25
4509Y 125 W 8 LCC V 3P2V (General) N/A 25* 25 25
Table 14. Supported ambient temperature (1P) - NVMe chassis, air cooled with A2 GPUSupported ambient temperature (1P) - NVMe chassis, air cooled with A2 GPU.
Processor TDP Core Model CPU1 HSK CPU2 HSK DIMM Capacity ≤ 96 GB/DIMM DIMM Capacity = 128 GB DIMM DIMM Capacity = 256 GB DIMM
8592+ 350 W 64 XCC N/A N/A N/A N/A N/A
8580 350 W 60 XCC N/A N/A N/A N/A N/A
8480+ 350 W 56 XCC N/A N/A N/A N/A N/A
9480 350 W 56 Xeon Max N/A N/A N/A N/A N/A
8470Q 350 W 52 XCC N/A N/A N/A N/A N/A
8470 350 W 52 XCC N/A N/A N/A N/A N/A
9470 350 W 52 Xeon Max N/A N/A N/A N/A N/A
8568Y+ 350 W 48 XCC N/A N/A N/A N/A N/A
8468 350 W 48 XCC N/A N/A N/A N/A N/A
8458P 350 W 44 XCC N/A N/A N/A N/A N/A
9460 350 W 40 Xeon Max N/A N/A N/A N/A N/A
6458Q 350 W 32 MCC N/A N/A N/A N/A N/A
9462 350 W 32 Xeon Max N/A N/A N/A N/A N/A
8468V 330 W 48 XCC N/A N/A N/A N/A N/A
8471N 300 W 52 XCC N/A N/A N/A N/A N/A
8470N 300 W 52 XCC N/A N/A N/A N/A N/A
8461V 300 W 48 XCC N/A N/A N/A N/A N/A
8558U 300 W 48 XCC N/A N/A N/A N/A N/A
8460Y+ 300 W 40 XCC N/A N/A N/A N/A N/A
8452Y 300 W 36 XCC N/A N/A N/A N/A N/A
8562Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
8462Y+ 300 W 32 MCC N/A N/A N/A N/A N/A
6454S 270 W 32 XCC N/A N/A N/A N/A N/A
8454H 270 W 32 XCC N/A N/A N/A N/A N/A
6430 270 W 32 XCC N/A N/A N/A N/A N/A
6444Y 270 W 16 MCC N/A N/A N/A N/A N/A
6414U 250 W 32 XCC N/A N/A N/A N/A N/A
6548Y+ 250 W 32 MCC N/A N/A N/A N/A N/A
6542Y 250 W 24 MCC N/A N/A N/A N/A N/A
6448Y 225 W 32 MCC N/A N/A N/A N/A N/A
6442Y 225 W 24 MCC N/A N/A N/A N/A N/A
6438M 205 W 32 MCC N/A N/A N/A N/A N/A
6438Y+ 205 W 32 MCC N/A N/A N/A N/A N/A
5420+ 205 W 28 MCC N/A N/A N/A N/A N/A
6526Y 195 W 16 MCC N/A N/A N/A N/A N/A
6534 195 W 8 MCC N/A N/A N/A N/A N/A
6434 195 W 8 MCC N/A N/A N/A N/A N/A
5512U 185 W 28 MCC V3P2V (General) N/A 20 N/A N/A
5418Y 185 W 24 MCC V3P2V (General) N/A 20 N/A N/A
5412U 185 W 24 MCC V3P2V (General) N/A 20 N/A N/A
6426Y 185 W 16 MCC V3P2V (General) N/A 20 N/A N/A
4416+ 165 W 20 MCC V3P2V (General) N/A 20 N/A N/A
4514Y 150 W 16 MCC V3P2V (General) N/A 25 20 20
5416S 150 W 16 MCC V3P2V (General) N/A 25 20 20
4410Y 150 W 12 MCC V3P2V (General) N/A 25 20 20
5415+ 150 W 8 MCC V3P2V (General) N/A 25 20 20
4510 150 W 12 LCC V3P2V (General) N/A 25 20 20
3408U 125 W 8 MCC V3P2V (General) N/A 25 20 20
4509Y 125 W 8 LCC V3P2V (General) N/A 25 20 20
Table 15. Supported ambient temperature (2P) - no backplane chassis and EDSFF chassis, liquid cooled with A2 GPUSupported ambient temperature (2P) - no backplane chassis and EDSFF chassis, liquid cooled with A2 GPU.
Processor TDP Core Model CPU1 HSK CPU2 HSK DIMM Capacity ≤ 96 GB/DIMM DIMM Capacity = 128 GB DIMM DIMM Capacity = 256 GB DIMM
8592+ 350 W 64 XCC Cold plate Cold plate 35 35 35
8580 350 W 60 XCC Cold plate Cold plate 35 35 35
8480+ 350 W 56 XCC Cold plate Cold plate 35 35 35
9480 350 W 56 Xeon Max Cold plate Cold plate 35 35 35
8470Q 350 W 52 XCC Cold plate Cold plate 35 35 35
8470 350 W 52 XCC Cold plate Cold plate 35 35 35
9470 350 W 52 Xeon Max Cold plate Cold plate 35 35 35
8568Y+ 350 W 48 XCC Cold plate Cold plate 35 35 35
8468 350 W 48 XCC Cold plate Cold plate 35 35 35
8458P 350 W 44 XCC Cold plate Cold plate 35 35 35
9460 350 W 40 Xeon Max Cold plate Cold plate 35 35 35
6458Q 350 W 32 MCC Cold plate Cold plate 35 35 35
9462 350 W 32 Xeon Max Cold plate Cold plate 35 35 35
8468V 330 W 48 XCC Cold plate Cold plate 35 35 35
8470N 300 W 52 XCC Cold plate Cold plate 35 35 35
8460Y+ 300 W 40 XCC Cold plate Cold plate 35 35 35
8452Y 300 W 36 XCC Cold plate Cold plate 35 35 35
8562Y+ 300 W 32 MCC Cold plate Cold plate 35 35 35
8462Y+ 300 W 32 MCC Cold plate Cold plate 35 35 35
6454S 270 W 32 XCC Cold plate Cold plate 35 35 35
8454H 270 W 32 XCC Cold plate Cold plate 35 35 35
6430 270 W 32 XCC Cold plate Cold plate 35 35 35
6444Y 270 W 16 MCC Cold plate Cold plate 35 35 35
6548Y+ 250 W 32 MCC Cold plate Cold plate 35 35 35
6542Y 250 W 24 MCC Cold plate Cold plate 35 35 35
6448Y 225 W 32 MCC Cold plate Cold plate 35 35 35
6442Y 225 W 24 MCC Cold plate Cold plate 35 35 35
6438M 205 W 32 MCC Cold plate Cold plate 35 35 35
6438Y+ 205 W 32 MCC Cold plate Cold plate 35 35 35
5420+ 205 W 28 MCC Cold plate Cold plate 35 35 35
6526Y 195 W 16 MCC Cold plate Cold plate 35 35 35
6534 195 W 8 MCC Cold plate Cold plate 35 35 35
6434 195 W 8 MCC Cold plate Cold plate 35 35 35
5418Y 185 W 24 MCC Cold plate Cold plate 35 35 35
6426Y 185 W 16 MCC Cold plate Cold plate 35 35 35
4416+ 165 W 20 MCC Cold plate Cold plate 35 35 35
4514Y 150 W 16 MCC Cold plate Cold plate 35 35 35
5416S 150 W 16 MCC Cold plate Cold plate 35 35 35
4410Y 150 W 12 MCC Cold plate Cold plate 35 35 35
4510 150 W 12 LCC Cold plate Cold plate 35 35 35
5415+ 150 W 8 MCC Cold plate Cold plate 35 35 35
4509Y 125 W 8 LCC Cold plate Cold plate 35 35 35
Table 16. Supported ambient temperature (2P) - 2.5-inch HDD and NVMe chassis, liquid cooled with A2 GPUSupported ambient temperature (2P) - 2.5-inch HDD and NVMe chassis, liquid cooled with A2 GPU.
Processor TDP Core Model CPU1 HSK CPU2 HSK DIMM Capacity ≤ 96 GB/DIMM DIMM Capacity = 128 GB DIMM DIMM Capacity = 256 GB DIMM
8592+ 350 W 64 XCC Cold plate Cold plate 25 25 25
8580 350 W 60 XCC Cold plate Cold plate 25 25 25
8480+ 350 W 56 XCC Cold plate Cold plate 25 25 25
9480 350 W 56 Xeon Max Cold plate Cold plate 25 25 25
8470Q 350 W 52 XCC Cold plate Cold plate 25 25 25
8470 350 W 52 XCC Cold plate Cold plate 25 25 25
9470 350 W 52 Xeon Max Cold plate Cold plate 25 25 25
8568Y+ 350 W 48 XCC Cold plate Cold plate 25 25 25
8468 350 W 48 XCC Cold plate Cold plate 25 25 25
8458P 350 W 44 XCC Cold plate Cold plate 25 25 25
9460 350 W 40 Xeon Max Cold plate Cold plate 25 25 25
6458Q 350 W 32 MCC Cold plate Cold plate 25 25 25
9462 350 W 32 Xeon Max Cold plate Cold plate 25 25 25
8468V 330 W 48 XCC Cold plate Cold plate 25 25 25
8470N 300 W 52 XCC Cold plate Cold plate 25 25 25
8460Y+ 300 W 40 XCC Cold plate Cold plate 25 25 25
8452Y 300 W 36 XCC Cold plate Cold plate 25 25 25
8562Y+ 300 W 32 MCC Cold plate Cold plate 25 25 25
8462Y+ 300 W 32 MCC Cold plate Cold plate 25 25 25
6454S 270 W 32 XCC Cold plate Cold plate 25 25 25
8454H 270 W 32 XCC Cold plate Cold plate 25 25 25
6430 270 W 32 XCC Cold plate Cold plate 25 25 25
6444Y 270 W 16 MCC Cold plate Cold plate 25 25 25
6548Y+ 250 W 32 MCC Cold plate Cold plate 25 25 25
6542Y 250 W 24 MCC Cold plate Cold plate 25 25 25
6448Y 225 W 32 MCC Cold plate Cold plate 25 25 25
6442Y 225 W 24 MCC Cold plate Cold plate 25 25 25
6438M 205 W 32 MCC Cold plate Cold plate 25 25 25
6438Y+ 205 W 32 MCC Cold plate Cold plate 25 25 25
5420+ 205 W 28 MCC Cold plate Cold plate 25 25 25
6526Y 195 W 16 MCC Cold plate Cold plate 25 25 25
6534 195 W 8 MCC Cold plate Cold plate 25 25 25
6434 195 W 8 MCC Cold plate Cold plate 25 25 25
5418Y 185 W 24 MCC Cold plate Cold plate 25 25 25
6426Y 185 W 16 MCC Cold plate Cold plate 25 25 25
4416+ 165 W 20 MCC Cold plate Cold plate 25 25 25
4514Y 150 W 16 MCC Cold plate Cold plate 25 25 25
5416S 150 W 16 MCC Cold plate Cold plate 25 25 25
4410Y 150 W 12 MCC Cold plate Cold plate 25 25 25
4510 150 W 12 LCC Cold plate Cold plate 25 25 25
5415+ 150 W 8 MCC Cold plate Cold plate 25 25 25
4509Y 125 W 8 LCC Cold plate Cold plate 25 25 25