Dell PowerEdge C6615: руководство по обслуживанию

Sled dimensions

This figure shows the dimensions of the sled C6615. — Figure 1. Sled dimensions

Table 1. PowerEdgeC6615 sled dimensionsThis table provides the dimensions of the sled:
X	Y	Z
174.4 mm (6.86 inches)	40.0 mm (1.57 inches)	549.7 mm (21.64 inches) - diskless configuration 561.3 mm (22.10 inches) - SAS/SATA or NVMe or E3.S or Universal configuration

System weight

Table 1. PowerEdge C6615 system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight
Air cooling	3.7 kg (8.15 lb)

Processor specifications

Table 1. PowerEdge C6615 processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
AMD EPYC^TM processor with up to 64 cores	One

PSU specifications

The PowerEdgeC6615system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	Voltage	AC		DC	Current (A)
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	Voltage	High line wattage	Low line wattage	DC	Current (A)
3200 W	NA	12000 BTU/hr	50/60 Hz	277 V AC	3200 W	NA	NA	13.0 A
3200 W	Titanium	12000 BTU/hr	NA	336 V DC	NA	NA	3200 W	11.5 A
2800 W	NA	10500 BTU/hr	NA	240 V DC	NA	NA	2800 W	13.6 A
2800 W	Titanium	10500 BTU/hr	50/60 Hz	200-240 V AC	2800 W	NA	NA	15.6 A
2400 W	NA	9000 BTU/hr	NA	240 V DC	NA	NA	2400 W	11.2 A
2400 W	Platinum	9000 BTU/hr	50/60 Hz	100-240 V AC	2400 W	1400 W	NA	16-13.5 A
1800 W	NA	6610 BTU/hr	NA	240 VDC	NA	NA	1800 W	8.2 A
1800 W	Titanium	6610 BTU/hr	50/60 Hz	200-240 V AC	1800 W	NA	NA	10 A

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

NOTE:If a system with AC 2400 W PSUs operates at low line 100-120 Vac, then the power rating per PSU is degraded to 1400 W.

This image shows the types of PSU power cords. — Figure 1. PSU power cords

Table 2. PSU power cordsThe table lists the PSU power cords.
Form factor	Output	Power cord
Redundant 60 mm	1800 W AC	C15
Redundant 86 mm	2400 W AC	C19
	2800 W AC	C21
	3200 W AC	APP 2006G1

NOTE:C19 power cord combined with C20 to C21 jumper power cord can be used to adapt 2800 W PSU.

NOTE:C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

Supported operating systems

The PowerEdge C6615 system supports the following operating systems:

Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware vSAN/ESXi

For more information, go to OS support.

System battery specifications

The PowerEdge C6615 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdge C6615 system supports up to two PCI express (PCIe Gen5) slots on the system board.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot	Expansion card riser	Processor connection	Height	Length	Slot width
Slot 1	Riser 1A	Processor 1	Low Profile	Half length	PCIe Gen5 x16
Slot 2	Riser 2C	Processor 1	Low Profile	Half length	PCIe Gen5 x16

Memory specifications

The PowerEdge C6615 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Single processor
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity
DDR5 RDIMM	Single rank	16 GB	16 GB	96 GB
	Dual rank	32 GB	32 GB	192 GB
		64 GB	64 GB	384 GB
		96 GB	96 GB	576 GB

NOTE:DDR4 DIMMs are not supported in the C6615 system.

NOTE:Mixing of DIMMs with different memory capacities is not supported.

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
6, 288-pin	5600 MT/s

NOTE:Memory DIMM slots are not hot swappable.

Storage controller specifications

The PowerEdge C6615 system supports the following controller cards:

Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller cards
Internal controllers PERC H755 PERC H355
Internal Boot Boot Optimized Storage Subsystem (NVMe BOSS-N1): HWRAID 1, 2 x M.2 SSDs
Software RAID S160
SAS Hot Bus Adapters (HBA) HBA355i

Drives

The PowerEdge C6615 system supports:

Up to 16 x 2.5-inch SAS/SATA (HDD/SSD) drives
Up to 16 x 2.5-inch SATA/NVMe drives on Universal Backplane configuration
Up to 16 x 2.5-inch NVMe backplane
Up to 8 x E3.s NVMe SSDs hard drive backplane
No backplane

NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page >Browse all Products > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

The PowerEdge C6615 system supports one USB 3.0 on the rear of the system.

Display port specifications

The PowerEdge C6615 system supports one Mini-DisplayPort on the rear of the system.

NIC port specifications

The PowerEdge C6615 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
LOM card	1 GbE x 1
OCP card (OCP 3.0)	1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 10 GbE x 4, 25 GbE x 4

iDRAC port specifications

The PowerEdge C6615 system supports one iDRAC Direct port (Micro-AB USB 2.0-compliant port) on the rear of the system.

Video specifications

The PowerEdge C6615 system supports integrated Matrox G200 graphics controller from mini-DP display port.

Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
640 x 480	60	8, 16, 32
800 x 600	60	8, 16, 32
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

Table 1. Continuous Operation Specifications for ASHRAE A3This table describes the specifications required for continuous operation for ASHRAE A3.
Continuous Operation Specifications for ASHRAE A3
Temperature range for altitudes <= 900 m (<= 2953 ft)	5 — 40°C (41-104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft)

Table 2. Continuous Operation Specifications for ASHRAE A4This table describes the specifications required for continuous operation for ASHRAE A4.
Continuous Operation Specifications for ASHRAE A3
Temperature range for altitudes <= 900 m (<= 2953 ft)	5 — 45°C (41-113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft)

Table 3. Common Environmental Specifications for ASHRAE A3 and A4This table describes the common environmental specifications for ASHRAE A3 and ASHRAE A4
Continuous Operation Specifications for ASHRAE A3
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape NOTE:Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-104 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

Thermal air restrictions

NVMe SSD and EDSFF are not supported
DIMMs with a capacity greater than 64GB are not supported
PERC H755 is not supported
A single sled can only hold up to two cards, including PCIe and OCP cards.
A2 GPU is not supported
96GB Samsung, 128GB and 256GB DIMM is not supported
CPU TDP Restriction
- Air cooled, 2.5-inch chassis
  - Maximum supported CPU TDP is 150W
- Air cooled, no backplane chassis
  - Maximum supported CPU TDP is 225W

Table 1. DIMM blank requirementsDIMM blank requirements
CPU installed	1x socket configuration
DIMM slots of	CPU1 slot
DIMM blank requirement	Yes

All sled slots must be fully populated or blanked
All HDD slots must be fully populated or blanked
BOSS card slot must be populated or blanked
All PSU slots must be fully populated or blanked
All E3.s slots must be fully populated or blanked

Thermal restriction matrix

Table 1. Supported ambient temperature- 2.5-inch Chassis, air cooledSupported ambient temperature- 2.5-inch Chassis, air cooled.
Processor	TDP	Mac cTDP	Cores	DIMM Capacity ≤ 64GB/DIMM
8534P	200 W	225 W	64	35
8434P	200 W	225 W	48	35
8324P	180 W	225 W	32	35
8224P	160 W	225 W	24	35
8124P	125 W	150 W	16	35
8024P	90 W	100 W	8	35

NOTE:Does not support 96GB Samsung DIMM.

Table 2. Supported ambient temperature- 2.5-inch SAS/SATA and NVMe chassis with PERC H755 card, air cooledSupported ambient temperature- 2.5-inch SAS/SATA and NVMe chassis with PERC H755 card, air cooled.
Processor	TDP	Mac cTDP	Cores	DIMM Capacity ≤ 64GB/DIMM
8534P	200 W	225 W	64	35
8434P	200 W	225 W	48	35
8324P	180 W	225 W	32	35
8224P	160 W	225 W	24	35
8124P	125 W	150 W	16	35
8024P	90 W	100 W	8	35

Table 3. Supported ambient temperature- No BP chassis and E3.s chassis, air cooledSupported ambient temperature - No BP chassis and E3.s chassis, air cooled.
Processor	TDP	Mac cTDP	Cores	DIMM Capacity ≤ 64GB/DIMM
8534P	200 W	225 W	64	35
8434P	200 W	225 W	48	35
8324P	180 W	225 W	32	35
8224P	160 W	225 W	24	35
8124P	125 W	150 W	16	35
8024P	90 W	100 W	8	35

NOTE:Does not support 96GB Samsung DIMM.