Dell PowerEdge C4130: руководство по обслуживанию

Chassis dimensions

This figure shows the dimensions of Dell PowerEdge C4130 system — Figure 1. Details the dimensions of Dell PowerEdge C4130 system

Table 1. The dimensions of Dell PowerEdge C4130 systemThe dimensions of Dell PowerEdge C4130 system table contains the length, width and height specifications of the system.
Xa	Xb	Y	Za	Zb	Zc
482.4 mm	434 mm	43.1 mm	18.0 mm	885.8 mm	924.8 mm

Chassis weight

Table 1. Chassis weightFollowing table contains the chassis weight information: Maximum weight is 22.73 Kg
System	Maximum weight
PowerEdge C4130 (with PCIe GPUs)	22.13 kg (48.79 lb)
PowerEdge C4130 (with SXM2 GPUs)	22.73 kg (50.11 lb)

Processor specifications

The PowerEdge C4130 system supports up to two Intel Xeon E5-2600 v4 product family processors.

PSU specifications

Table 1. PSU specificationsThe PowerEdge C4130 system supports up to two AC redundant power supply units (PSU).
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage
1100 W AC	Platinum	4100 BTU/hr	50/60 Hz	100–240 V AC, autoranging
1600 W AC	Platinum	6000 BTU/hr	50/60 Hz	200–240 V AC, autoranging
2000 W AC	Platinum	7500 BTU/hr	50/60 Hz	200–240 V AC, autoranging

NOTE: Heat dissipation is calculated by using the PSU wattage rating.

NOTE: This system is also designed to connect to the IT power systems with a phase to phase voltage not exceeding 230 V.

NOTE: PSUs rated for 1600 W and higher require high-line voltage (200-240 V) to supply their rated capacity.

System battery specifications

The PowerEdge C4130 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion bus specifications

The PowerEdge C4130 system supports PCI express (PCIe) generation 3 expansion cards, which need to be installed on the system board by using expansion card risers. This system supports four expansion card riser configurations. The following table provides detailed information about the expansion card riser configurations:

Table 1. Expansion card riser configurationsThe Expansion card riser configurations table contains the possible 4 configurations for the expansion card riser.
Expansion card riser	PCIe slots on the riser	Height	Length	Link
Configuration 1 (System Config: D and G)	Slot 1	half height	half Length	x16
Configuration 1 (System Config: D and G)	Slot 2	half height	half Length	x16
Configuration 2 (System Config: A, B, and K)	Slot 1	half height	half Length	x8
Configuration 2 (System Config: A, B, and K)	Slot 2	half height	half Length	x16
Configuration 3 (System Config: C, F, and H)	Slot 1	half height	half Length	x8
Configuration 3 (System Config: C, F, and H)	Slot 2	half height	half Length	x8
Configuration 4 (System Config: E and I)	Slot 1	half height	half Length	x8
Configuration 4 (System Config: E and I)	Slot 2	NA	NA	NA

Memory specifications

Table 1. Memory specificationsThe memory specification configuration table contains the minimum (4 GB) and maximum (1024 GB) specifications allowed with 1 or 2 processors. The PowerEdge C4130 system supports DDR4 registered DIMMs (RDIMMs) and load registered DIMMs (LRDIMMs).
Memory module sockets	Memory capacity	Minimum RAM	Maximum RAM
Sixteen 288-pin	4 GB single rank, 8 GB, 16 GB, 32 GB dual rank, and 64 GB quad rank	4 GB with a single processor 8 GB with two processors	Up to 512 GB with a single processor Up to 1024 GB with dual processors

Drive specifications

The PowerEdge C4130 system supports up to two 1.8 inch uSATA SSDs, and up to four 2.5 inch SAS/SATA cabled hard drives.

NOTE: Systems with NVLink configurations do not support the 2.5-inch SAS/SATA cabled hard drives.

NOTE: Initial status LED of PCIe SSDs may vary based on the actual drive status and server components populated.

Ports and connectors specifications

Table 1. Ports and connectors specificationsThe following table contains the Ports and connectors specifications that includes the number or type of NIC, Serial, USB, Video and IDSDM.
Connectors
Back
	NIC	Two 1 Gbps
	Serial	9-pin, DTE, 16550-compatible
	USB	Two 4-pin, USB 3.0-compliant
	Video	15-pin VGA
Internal
	USB	One 4-pin, USB 3.0-compliant
	Internal dual SD module	Two optional flash memory card slots with the internal dual SD module NOTE: One card slot is dedicated for redundancy.

Video specifications

The PowerEdge C4130 system supports Matrox G200eR2 Integrated VGA controller with 16 MB capacity.

Table 1. Resolution information for Video modesThe Resolution information for Video modes table contains the refresh rate and color depth specifications of the VGA controller at different resolutions.
Resolution	Refresh rate (Hz)	Color depth (bit)
640 X 480	60, 70	8, 16, 32
800 X 600	60, 75, 85	8, 16, 32
1024 X 768	60, 75, 85	8, 16, 32
1152 X 864	60, 75, 85	8, 16, 32
1280 X 1024	60, 75	8, 16, 32
1440 X 900	60	8, 16, 32

Environmental specifications

NOTE: For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on Dell.com/poweredgemanuals.

Table 1. Temperature specificationsThe Temperature specifications table contains operating and storage temperature specifications of the system.
Temperature	Specifications
Storage	–40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft)	10°C to 25°C (50°F to 77°F) with no direct sunlight on the equipment. NOTE: Certain system configurations may require reductions in the upper temperature limits. NOTE: The performance of the system may be impacted when operating above the upper temperature limit or with a faulty fan.
Maximum temperature gradient (operating and storage)	20°C/h (36°F/h)

Table 2. Relative humidity specificationsThe Relative humidity specifications table contains relative humidity specifications of the system at operating or storage state.
Relative humidity	Specifications
Storage	5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating	10% to 80% relative humidity with 29°C (84.2°F) maximum dew point.

Table 3. Maximum vibration specificationsThe Maximum vibration specifications table contains the maximum vibration specification at operating or storage state.
Maximum vibration	Specifications
Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations).
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 min (all six sides tested).

Table 4. Maximum shock specificationsThe Maximum shock specifications table contains the maximum vibration at operating or storage state.
Maximum vibration	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 40 G for up to 2.3 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.

Table 5. Maximum altitude specificationsThe maximum altitude specifications table contains the altitude specification at operating or storage state.
Maximum altitude	Specifications
Operating	30482000 m (10,0006560 ft)
Storage	12,000 m (39,370 ft)

Table 6. Operating temperature de-rating specificationsThe Operating temperature de-rating specifications table contains the operating temperature de-rating for upto 25°C (77°F).
Operating temperature de-rating	Specifications
Up to 25°C (77°F)	Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).

Table 7. Particulate contamination specificationsThe Particulate contamination specifications table contains the air filtration, conductive dust and corrosive dust limits to help avoid IT equipment damage or failure.
Particulate contamination specifications
NOTE: The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If it is determined that levels of particulates or gaseous pollution are beyond the limits specified below and are the reason for the damage and/or failures to your equipment, it may be necessary for you to re-mediate the environmental conditions that are causing the damage and/or failures. Re-mediation of environmental conditions will be the responsibility of the customer.
Air filtration NOTE: Applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust NOTE: Applies to data center and non-data center environments.	Air must be free of conductive dust, zinc whiskers, or other conductive particles.
Corrosive dust NOTE: Applies to data center and non-data center environments.	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity.

Table 8. Gaseous contamination specificationsThe Gaseous contamination specifications table contains copper coupon and silver coupon corrosion rate specifications.
Gaseous contamination specifications
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
	Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
	Silver coupon corrosion rate	<200 Å/month as defined by AHSRAE TC9.9.