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Dell EMC PowerEdge C6525 Technical: технические характеристики и спецификации
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Dell EMC PowerEdge C6525 Technical: технические характеристики и спецификации

Sled dimensions

Figure 1. Sled dimensions

This figure shows the dimensions of the sled.PowerEdgeC6400A

Table 1. Dimensions of the PowerEdgeC6525 sledThe dimensions of the PowerEdgeC6525 sled are as follows: X= 174.4 mm (6.86 inches), Y= 40.5 mm (1.59 inches), Z=574.5 mm (22.61 inches).
X Y Z
174.4 mm (6.86 inches) 40.1 mm (1.58 inches) 570.34 mm (22.45 inches)

Chassis weight

Table 1. Chassis weight with sledsThe chassis weight of the enclosure with sleds systems, the maximum chassis weight for 12 x 3.5-inch drive systems is 45.53 Kg (100.37 lb), the maximum chassis weight for 24 x 2.5-inch drive systems is 41.5 Kg (91.49 lb), the maximum chassis weight for no backplane systems is 35.15 Kg (77.49 lb).
System Maximum weight (with all sleds and drives)
12 x 3.5-inch configuration 45.53 kg (100.37 lb)
24 x 2.5-inch configuration 41.5 kg (91.49 lb)
System with no backplane 35.15 kg (77.49 lb)

Processor specifications

The PowerEdge C6525 sled supports up to two processors in each of the four independent sleds. Each processor supports up to 64 cores.
Table 1. Processor specificationsThis table lists the processor specifications
Supported processor Number of processors supported
AMD EPYC™ 7002 and 7003 Series processor 2

Supported operating systems

The PowerEdge C6525 supports the following operating systems:

  • Canonical Ubuntu LTS
  • Citrix XenServer
  • Microsoft Windows Server
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
  • CentOS
NOTE For more information, see www.dell.com/ossupport.

System battery specifications

The PowerEdge C6525 sled supports CR 2032 3.0-V lithium coin cell system battery.

NOTE One battery is supported on each PowerEdge C6525 sled.

Expansion card installation guidelines

The following table describes the supported expansion cards:

PCIe slot priority

WARNING Consumer-Grade GPU should not be installed or used in the Enterprise Server products.
Table 1. Expansion card riser configurationsThe table below shows the expansion card riser configurations
Riser options Slot 1 Slot 2 Length Height Primary processor Minimum processor requirement Supported configurations
Riser 1A

Riser 1A
PCIe Gen 4 x 16

 NA Half Length Low Profile 1 1
  • 12 x 3.5-inch drives
  • 24 x 2.5-inch drives
  • 8 x 2.5-inch NVMe drives
  • No backplane
Riser 1A+2A

Riser 1A
PCIe Gen 4 x 16

Riser 2A
PCIe Gen 4 x 16

 Half Length Low Profile 1 and 2 2
  • 12 x 3.5-inch drives
  • 24 x 2.5-inch drives
  • 8 x 2.5-inch NVMe drives
  • No backplane
Riser 2A NA

Riser 2A
PCIe Gen 4 x 16

 Half Length Low Profile 2 2
  • 12 x 3.5-inch drives
  • 24 x 2.5-inch drives
  • 8 x 2.5-inch NVMe drives
  • No backplane
No riser NA NA Half Length Low Profile NA 1
  • 12 x 3.5-inch drives
  • 24 x 2.5-inch drives
  • 8 x 2.5-inch NVMe drives
  • No backplane

The following table provides guidelines for installing expansion cards to ensure proper cooling and mechanical fit. The expansion cards with the highest priority should be installed first using the slot priority indicated. All the other expansion cards should be installed in the card priority and slot priority order.

Table 2. Riser configurations: No riser - Processor 1 and 2This table provides information on the slot priority for No riser - Processor 1 and 2 configuration for PowerEdge C6525 system.
Card Type Slot Priority Maximum number of cards
LOM riser ; 1G (Intel) (BASeT) 3 1
LOM riser ; 10G (Mellanox/Broadcom/QLogic) (BASeT/SFP/SFP+) 3 1
LOM riser ; 25G (QLogic/Mellanox/Intel) 3 1
BOSS S1V5 (Inventec) 4 1
Card,Network 10G (Broadcom) (BASeT) 3 1
Table 3. Riser configurations: Riser 1A - Processor 1 and 2This table provides information on the slot priority for Riser 1A - Processor 1 and 2 riser configuration for PowerEdge C6525 system.
Card type Slot priority Maximum number of cards
LOM riser ; 1G (Intel/Broadcom) (BASeT) 3 1
LOM riser ; 10G (Broadcom/QLogic) (BASeT/SFP/SF+/SFP+) 3 1
LOM riser ; 25G (QLogic/Mellanox) 3 1
Card,Network 1G (Broadcom/Intel) 1 1
Card,Network 10G (Broadcom/Intel/QLogic) 1 1
Card,Network 10G (Broadcom) (BASeT) 3 1
Card,Network 25G (Broadcom/Intel/QLogic/Mellanox/SolarFlare) 1 1
Card,Network 100G (Mellanox/Intel) 1 1
GPU: Nvidia T4 16GB 2 1
PCIe SSD (Samsung/Intel) 1 1
PERC 10: External Adapter (Inventec/Foxconn) 1 1
HBA: External Adapter (Foxconn) 1 1
BOSS S1V5 (Inventec) 4 1
ASSY,CRD,CTL,H750,ADPT,250MM (Broadcom) 1 1
ASSY,CRD,CTL,H350,ADPT (Broadcom) 1 1
ASSY,CRD,CTL,H750,ADPT (Broadcom) 1 1
Table 4. Riser configurations: Riser 1A + Riser 2A - Processor 2This table provides information on the slot priority for Riser 1A + Riser 2A - Processor 2 riser configuration for PowerEdge C6525 system.
Card type Slot priority Maximum number of cards
LOM riser ; 1G (Intel/Broadcom) (BASeT) 3 1
LOM riser ; 10G (Broadcom/QLogic) (BASeT/SFP/SF+/SFP+) 3 1
LOM riser ; 25G (/QLogic/Mellanox) 3 1
Card,Network 1G (Broadcom/Intel) 1, 2 2
Card,Network 10G (Broadcom/Intel/QLogic) 1, 2 2
Card,Network 10G (Broadcom) (BASeT) 3 1
Card,Network 25G (Broadcom/Intel/QLogic/Mellanox/SolarFlare) 1, 2 2
Card,Network 100G (Mellanox/Intel) 1, 2 2
GPU: Nvidia T4 16GB 2 1
PCIe SSD (Samsung/Intel) 1, 2 2
PERC 10: External Adapter (Inventec/Foxconn) 1 1
HBA: External Adapter (Foxconn) 1 1
BOSS S1V5 (Inventec) 4 1
ASSY,CRD,CTL,H750,ADPT,250MM (Broadcom) 1 1
ASSY,CRD,CTL,H350,ADPT (Broadcom) 1 1
ASSY,CRD,CTL,H750,ADPT (Broadcom) 1 1
Table 5. Riser configurations: Riser 2A - Processor 2This table provides information on the slot priority for Riser 2A - Processor 2 riser configuration for PowerEdge C6525 system.
Card type Slot priority Maximum number of cards
LOM riser ; 1G (Intel/Broadcom) (BASeT) 3 1
LOM riser ; 10G (Broadcom/QLogic) (BASeT/SFP/SF+/SFP+) 3 1
LOM riser ; 25G (QLogic/Mellanox) 3 1
Card,Network 1G (Broadcom/Intel) 2 1
Card,Network 10G (Broadcom/Intel/QLogic) 2 1
Card,Network 10G (Broadcom) (BASeT) 3 1
Card,Network 25G (Broadcom/Intel/QLogic/Mellanox/SolarFlare) 2 1
Card,Network 100G (Mellanox/Intel) 2 1
GPU: Nvidia T4 16GB 2 1
PCIe SSD (Samsung/Intel) 2 1
BOSS S1V5 (Inventec) 4 1

Memory specifications

Table 1. Memory specifications The table below shows the memory specifications.

Memory module

sockets

DIMM typeDIMM rank DIMM capacity Single processor Dual processors
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
Sixteen 288-pinsLRDIMMOctal rank 128 GB 128 GB 1024 GB 256 GB 2048 GB
RDIMM Single rank 8 GB 8 GB 64 GB 16 GB 128 GB
Dual rank 16 GB 16 GB 128 GB 32 GB 256 GB
32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1024 GB

Drives specifications

The PowerEdge C6525 sled supports SAS and SATA hard drives and Solid State Drives (SSDs).

Table 1. Supported drive options for the PowerEdge C6525 sled This table lists out the supported drive options for the PowerEdge C6525 sled.
Maximum number of drives in the sled Maximum number of drives assigned per sled
12 x 3.5-inch drive systems Three SAS or SATA hard drives and SSDs per sled
24 x 2.5-inch Non-NVMe drives configuration Six SAS or SATA hard drives and SSDs per sled
8 x 2.5-inch NVMe drives configuration (2 NVMe drives per sled / 8 NVMe drives per chassis) The NVMe backplane supports either of these configurations:
  • Two NVMe drives and four SAS or SATA hard drives and SSDs per sled
    NOTE NVMe drives are limited to PCIe Gen3 speed.
  • Six SAS or SATA hard drives and SSDs per sled
M.2 SATA drive (optional) The supported capacity of the M.2 SATA card is up to 480 GB
NOTE The M.2 SATA card can be installed on the M.2 riser or on the BOSS card
Micro-SD card (optional) for boot (up to 64 GB) One on riser 1A

USB ports specifications

Table 1. PowerEdge C6525 sled USB port specificationsThe following table shows the USB specifications for the PowerEdge C6525 sled.
Back panel
One USB 3.0-compliant port

Display port specifications

The PowerEdge C6525 sled supports one Mini display port.

NIC ports specifications

The PowerEdge C6525 sled supports one 10/100/1000 Mbps Network Interface Controller (NIC) port located on the rear of the sled.

iDRAC9 port specifications

The PowerEdge C6525 sled supports one iDRAC9 direct port that is located on the rear of the system.

Storage specifications

The PowerEdge C6525 sled supports RAID options with M.2 SATA drives.

Table 1. Supported RAID options with M.2 SATA drives This table lists out the supported RAID options with M.2 SATA drives
Options Single M.2 SATA drive without RAID Dual M.2 SATA drives with hardware RAID
Hardware RAID No Yes
RAID Mode N/A RAID 1
Number of drives supported 1 2
Supported CPUs CPU 1 CPU 1
NOTE RAID options are only supported on BOSS cards which support two M.2 SATA drives.

Video specifications

The PowerEdge C6525 sled supports one Matrox G200 integrated graphics card with 16 MB RAM.
Table 1. Supported video resolution optionsFor 1024 x 768 resolution, the refresh rate is 60 Hz and the color depth is up to 24. For 1280 x 800 resolution, the refresh rate is 60 Hz and the color depth is up to 24. For 1280 x 1024 resolution, the refresh rate is 60 Hz and the color depth is up to 24. For 1360 x 768 resolution, the refresh rate is 60 Hz and the color depth is up to 24. For 1440 x 900 resolution, the refresh rate is 60 Hz and the color depth is up to 24. For 1600 x 900 resolution, the refresh rate is 60 Hz and the color depth is up to 24.For 1600 x 1200 resolution, the refresh rate is 60 Hz and the color depth is up to 24.For 1600 x 1050 resolution, the refresh rate is 60 Hz and the color depth is up to 24.For 1920 x 1080 resolution, the refresh rate is 60 Hz and the color depth is up to 24.For 1920 x 1200 resolution, the refresh rate is 60 Hz and the color depth is up to 24.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 up to 24
1280 x 800 60 up to 24
1280 x 1024 60 up to 24
1360 x 768 60 up to 24
1440 x 900 60 up to 24
1600 x 90060up to 24
1600 x 120060up to 24
1680 x 105060up to 24
1920 x 108060up to 24
1920 x 120060up to 24

Environmental specifications

The sections below contains information about the environmental specifications of the system.

NOTE For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/poweredgemanuals.

Standard operating temperature specifications

NOTE
  1. Not available: Indicates that the configuration is not offered by Dell EMC.
  2. Not supported: Indicates that the configuration is not thermally supported.
NOTE All components including the DIMMs, communication cards, M.2 SATA, and PERC cards can be supported with sufficient thermal margin if the ambient temperature is equal to or below the maximum continuous operating temperature listed in these tables.
NOTE Some of the system hardware configurations require a lowered upper temperature limit. For more information about the operating temperature requirement, contact technical support.
Table 1. Standard operating temperature specificationsThe following table shows the standard operating temperature specifications:
Standard operating temperature Allowable Operation
Temperature Ranges (For Altitude <900 meters or 2953 feet) 5 to 40°C (41 to 104°F) with no direct sunlight on the platform
Excursion Limited Operation
5 to 35°C (41 to 95°F) Continuous Operation 35 to 40°C (95 to 104°F) 10% Annual Runtime
Humidity Percent Ranges 8%RH with -12°C minimum dew point to 85%RH with 24°C (75.2°F) maximum dew point
Operational Altitude De-Rating Maximum temperature is reduced by 1°C/175 meters (1.8°F/574 feet) above 900 meters (2,953 feet)
NOTE Some configurations require a lower ambient temperature.

The following tables list key restrictions on ambient temperature based on which CPU is configured in the system. All inlet temperatures that are provided below are in continuous degrees centigrade.

Table 2. Maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooledThis table describes the maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7513 200 32 20 20 25 25 30
7443 200 24 20 20 25 25 30
7413 180 24 20 20 25 25 30 (-2)
7313 155 16 25 25 25 25 30
7662 225 64 Not supported Not supported Not supported Not supported 20
7713 225 64 Not supported Not supported Not supported Not supported 20
7543 225 32 Not supported Not supported Not supported Not supported 20
7763 280 64 Not supported Not supported Not supported Not supported Not supported
7H12 280 64 Not supported Not supported Not supported Not supported Not supported
7742 225 64 Not supported Not supported Not supported Not supported 20
7642 225 48 Not supported Not supported Not supported Not supported 20
7542 225 32 Not supported Not supported Not supported Not supported 20
7702 200 64 20 20 25 25 30
7552 200 48 20 20 25 25 30
7532 200 32 20 20 25 25 30
7502 180 32 20 20 25 25 30
7402 180 24 20 20 25 25 30
7452 155 32 25 25 25 25 30
7352 155 24 25 25 25 25 30
7302 155 16 25 25 25 25 30
7262 155 8 25 25 25 25 30
7282 120 16 30 30 30 35 35
7272 120 12 30 30 30 35 35
7252 120 8 30 30 30 35 35
7F72 240 24 Not supported Not supported Not supported Not supported 20
7F52 240 16 Not supported Not supported Not supported Not supported Not supported
7F32 180 8 20 20 25 25 30
NOTE Thermal corner case is when the system is working at CPU intensive workload. From the above table, (-2) represents the thermal impact at thermal corner case.
NOTE H745 is Not supported for CPU TDP ≥ 180 Watts.
NOTE
  • 85C Optics Transceiver is required for OCP cards.
  • Additional thermal restrictions are required for 128GB LRDIMM and GPU configuration.
Table 3. Maximum continuous operating temperature for dual processor with 3.5-inch Direct drive configuration - Air cooledThis table describes the maximum continuous operating temperature for dual processor with 3.5-inch Direct drive configuration - Air cooled
CPU TDP Cores 12 x drives 8 x drives 4 x drives
7513 200 32 Not supported Not supported Not supported
7443 200 24 Not supported Not supported Not supported
7413 180 24 Not supported Not supported Not supported
7313 155 16 Not supported Not supported Not supported
7662 225 64 Not supported Not supported Not supported
7713 225 64 Not supported Not supported Not supported
7543 225 32 Not supported Not supported Not supported
7763 280 64 Not supported Not supported Not supported
7H12 280 64 Not supported Not supported Not supported
7742 225 64 Not supported Not supported Not supported
7642 225 48 Not supported Not supported Not supported
7542 225 32 Not supported Not supported Not supported
7702 200 64 Not supported Not supported Not supported
7552 200 48 Not supported Not supported Not supported
7532 200 32 Not supported Not supported Not supported
7502 180 32 Not supported Not supported Not supported
7402 180 24 Not supported Not supported Not supported
7452 155 32 Not supported Not supported Not supported
7352 155 24 Not supported Not supported Not supported
7302 155 16 Not supported Not supported Not supported
7262 155 8 Not supported Not supported Not supported
7282 120 16 20 20 20
7272 120 12 20 20 20
7252 120 8 20 20 20
7F72 240 24 Not supported Not supported Not supported
7F52 240 16 Not supported Not supported Not supported
7F32 180 8 Not supported Not supported Not supported
NOTE
  • 85C Optics Transceiver is required for OCP cards
  • Additional thermal restrictions are required for 128GB LRDIMM and GPU configuration
Table 4. Maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch NVMe drive configuration - Liquid cooledThis table describes the maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch NVMe drive configuration - Liquid cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7513 200 32 35 35 35 35 35
7443 200 24 35 35 35 35 35
7413 180 24 35 35 35 35 35
7313 155 16 35 35 35 35 35
7662 225 64 35 35 35 35 35
7713 225 64 35 35 35 35 35
7543 225 32 35 35 35 35 35
7763 280 64 35 35 35 35 35
7H12 280 64 35 35 35 35 35
7742 225 64 35 35 35 35 35
7642 225 48 35 35 35 35 35
7542 225 32 35 35 35 35 35
7702 200 64 35 35 35 35 35
7552 200 48 35 35 35 35 35
7532 200 32 35 35 35 35 35
7502 180 32 35 35 35 35 35
7402 180 24 35 35 35 35 35
7452 155 32 35 35 35 35 35
7352 155 24 35 35 35 35 35
7302 155 16 35 35 35 35 35
7262 155 8 35 35 35 35 35
7282 120 16 35 35 35 35 35
7272 120 12 35 35 35 35 35
7252 120 8 35 35 35 35 35
7F72 240 24 35 35 35 35 35
7F52 240 16 35 35 35 35 35
7F32 180 8 35 35 35 35 35
Table 5. Maximum continuous operating temperature for dual processor with 3.5-inch Direct drive configuration - Liquid cooledThis table describes the maximum continuous operating temperature for dual processor with 3.5-inch Direct drive configuration - Liquid cooled
CPU TDP Cores 12 x drives 8 x drives 4 x drives
7513 200 32 35 35 35
7443 200 24 35 35 35
7413 180 24 35 35 35
7313 155 16 35 35 35
7662 225 64 35 35 35
7713 225 64 35 35 35
7543 225 32 35 35 35
7763 280 64 35 35 35
7H12 280 64 35 35 35
7742 225 64 35 35 35
7642 225 48 35 35 35
7542 225 32 35 35 35
7702 200 64 35 35 35
7552 200 48 35 35 35
7532 200 32 35 35 35
7502 180 32 35 35 35
7402 180 24 35 35 35
7452 155 32 35 35 35
7352 155 24 35 35 35
7302 155 16 35 35 35
7262 155 8 35 35 35
7282 120 16 35 35 35
7272 120 12 35 35 35
7252 120 8 35 35 35
7F72 240 24 35 35 35
7F52 240 16 35 35 35
7F32 180 8 35 35 35
NOTE Additional thermal restrictions are required for 128GB LRDIMM and GPU configuration
Table 6. Maximum continuous operating temperature for single processor with 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooledThis table describes the maximum continuous operating temperature for single processor with 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7713P 225 64 30 30 30 35 35
7513 200 32 35 35 35 35 35
7543P 225 32 30 30 30 35 35
7443 200 24 35 35 35 35 35
7443P 200 24 35 35 35 35 35
7313P 155 16 35 35 35 35 35
7413 180 24 35 35 35 35 35
7313 155 16 35 35 35 35 35
7662 225 64 30 30 30 35 35
7713 225 64 30 30 30 35 35
7543 225 32 30 30 30 35 35
7763 280 64 Not supported Not supported Not supported Not supported Not supported
7H12 280 64 Not supported Not supported Not supported Not supported Not supported
7742 225 64 30 30 30 35 35
7642 225 48 30 30 30 35 35
7542 225 32 30 30 30 35 35
7702 200 64 35 35 35 35 35
7702P 200 64 35 35 35 35 35
7552 200 48 35 35 35 35 35
7532 200 32 35 35 35 35 35
7502 180 32 35 35 35 35 35
7502P 180 32 35 35 35 35 35
7402 180 24 35 35 35 35 35
7402P 180 24 35 35 35 35 35
7452 155 32 35 35 35 35 35
7352 155 24 35 35 35 35 35
7302 155 16 35 35 35 35 35
7302P 155 16 35 35 35 35 35
7262 155 8 35 35 35 35 35
7282 120 16 35 35 35 35 35
7272 120 12 35 35 35 35 35
7252 120 8 35 35 35 35 35
7232P 120 12 35 35 35 35 35
7F72 240 24 30 30 30 35 35
7F52 240 16 30 30 30 35 35
7F32 180 8 35 35 35 35 35
NOTE Additional thermal restrictions are required for 128GB LRDIMM and GPU configuration
Table 7. Maximum continuous operating temperature for single processor with 3.5-inch Direct drive configuration - Air cooledThis table describes the maximum continuous operating temperature for single processor with 3.5-inch Direct drive configuration - Air cooled
CPU TDP Cores 12 x drives 8 x drives 4 x drives
7713P 225 64 20 25 25
7513 200 32 25 35 35
7543P 225 32 20 25 25
7443 200 24 25 35 35
7443P 200 24 25 35 35
7313P 155 16 30 35 35
7413 180 24 25 35 35
7313 155 16 30 35 35
7662 225 64 20 25 25
7713 225 64 20 25 25
7543 225 32 20 25 25
7763 280 64 Not supported Not supported Not supported
7H12 280 64 Not supported Not supported Not supported
7742 225 64 20 25 25
7642 225 48 20 25 25
7542 225 32 20 25 25
7702 200 64 25 35 35
7702P 200 64 25 35 35
7552 200 48 25 35 35
7532 200 32 25 35 35
7502 180 32 25 35 35
7502P 180 32 25 35 35
7402 180 24 25 35 35
7402P 180 24 25 35 35
7452 155 32 30 35 35
7352 155 24 30 35 35
7302 155 16 30 35 35
7302P 155 16 30 35 35
7262 155 8 30 35 35
7282 120 16 35 35 35
7272 120 12 35 35 35
7252 120 8 35 35 35
7232P 120 12 35 35 35
7F72 240 24 20 25 25
7F52 240 16 20 25 25
7F32 180 8 25 35 35

Other thermal restrictions for 280W CPU

  • 128GB LRDIMM is Not supported.
  • Limits 280W CPU enabled with GPU.
  • Does not support PSU redundant mode(1+1).
  • Supports PSU Non-Redundant mode (2+0) configuration mode.

T4 GPU card restrictions

Table 8. Maximum continuous operating temperature for dual processor with 1x T4 GPU card for 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooledThis table describes the maximum continuous operating temperature for dual processor with 1x T4 GPU card for 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7513 200 32 Not supported 25
7443 200 24 Not supported 25
7413 180 24 Not supported 25
7313 155 16 Not supported 25
7662 225 64 Not supported
7713 225 64 Not supported
7543 225 32 Not supported
7763 280 64 Not supported
7H12 280 64 Not supported
7F72 240 24 Not supported
7F52 240 16 Not supported
7742 225 64 Not supported
7642 225 48
7542 225 32
7702 200 64 Not supported 25
7552 200 48 25
7532 200 32 25
7502 180 32 25
7402 180 24 25
7F32 180 8 25
7452 155 32 25
7352 155 24 Not supported 25
7302 155 16 25
7262 155 8 25
7282 120 16 Not supported 25 25 30
7272 120 12 25 25 30
7252 120 8 25 25 30
NOTE
  • 3.5" chassis (Air cooled) is not able to support GPU card.
  • 128GB LRDIMM is Not supported.
  • 1x GPU card + OCP card is supported. Slot #2 is first priority for T4 GPU.
  • 1x GPU card + PCIe card is supported. Slot #2 is first priority for T4 GPU.
Table 9. Maximum continuous operating temperature for dual processor with 1x T4 GPU card for 2.5-inch direct / 2.5-inch NVMe drive configuration - Liquid cooledThis table describes the maximum continuous operating temperature for dual processor with 1x T4 GPU card for 2.5-inch direct / 2.5-inch NVMe drive configuration - Liquid cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7513 200 32 30 30 30 30 30
7443 200 24 30 30 30 30 30
7413 180 24 30 30 30 30 30
7313 155 16 30 30 30 30 30
7662 225 64 30 30 30 30 30
7713 225 64 30 30 30 30 30
7543 225 32 30 30 30 30 30
7763 280 64 30 30 30 30 30
7H12 280 64 30 30 30 30 30
7F72 240 24 30 30 30 30 30
7F52 240 16 30 30 30 30 30
7742 225 64 30 30 30 30 30
7642 225 48 30 30 30 30 30
7542 225 32 30 30 30 30 30
7702 200 64 30 30 30 30 30
7532 200 32 30 30 30 30 30
7502 180 32 30 30 30 30 30
7402 180 24 30 30 30 30 30
7F32 180 8 30 30 30 30 30
7452 155 32 30 30 30 30 30
7352 155 24 30 30 30 30 30
7302 155 16 30 30 30 30 30
7262 155 8 30 30 30 30 30
7282 120 16 30 30 30 30 30
7272 120 12 30 30 30 30 30
7252 120 8 30 30 30 30 30
NOTE
  • 128GB LRDIMM is not supported.
  • 3.5“ chassis is not supported
Table 10. Maximum continuous operating temperature for single processor with 1x T4 GPU card for 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooledThis table describes the maximum continuous operating temperature for single processor with 1x T4 GPU card for 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7713P 225 64 20 20 20 20 25
7513 200 32 20 25 25 25 30
7543P 225 32 20 20 20 20 25
7443 200 24 20 25 25 25 30
7443P 200 24 20 25 25 25 30
7313P 155 16 20 25 25 25 35
7413 180 24 20 25 25 25 30
7313 155 16 20 25 25 25 35
7662 225 64 20 20 20 20 25
7713 225 64 20 20 20 20 25
7543 225 32 20 20 20 20 25
7763 280 64 Not supported Not supported Not supported Not supported Not supported
7H12 280 64 Not supported Not supported Not supported Not supported Not supported
7F72 240 24 20 20 20 20 25
7F52 240 16 20 20 20 20 25
7742 225 64 20 20 20 20 25
7642 225 48 20 20 20 20 25
7542 225 32 20 20 20 20 25
7702 200 64 20 25 25 25 30
7702P 200 64 20 25 25 25 30
7532 200 32 20 25 25 25 30
7502 180 32 20 25 25 25 30
7502P 180 32 20 25 25 25 30
7402 180 24 20 25 25 25 30
7402P 180 24 20 25 25 25 30
7452 155 32 20 25 25 25 35
7352 155 24 20 25 25 25 35
7302 155 16 20 25 25 25 35
7302P 155 16 20 25 25 25 35
7262 155 8 20 25 25 25 35
7282 120 16 25 25 25 30 35
7272 120 12 25 25 25 30 35
7252 120 8 25 25 25 30 35
7232P 120 12 25 25 25 30 35
NOTE
  • 3.5" chassis (Air cooled) is not able to support GPU card.
  • 128GB LRDIMM is Not supported.
  • OCP card is supported.
Table 11. Maximum continuous operating temperature for dual processor with 128GB LRDIMM for 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooledThis table describes the maximum continuous operating temperature for dual processor with 128GB LRDIMM for 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7513 200 32 20 20 25 25 25
7443 200 24 20 20 25 25 25
7413 180 24 20 20 25 25 25
7313 155 16 20 20 25 25 30
7662 225 64 Not supported Not supported Not supported Not supported 20
7713 225 64 Not supported Not supported Not supported Not supported 20
7543 225 32 Not supported Not supported Not supported Not supported 20
7763 280 64 Not supported Not supported Not supported Not supported Not supported
7H12 280 64 Not supported Not supported Not supported Not supported Not supported
7742 225 64 Not supported Not supported Not supported Not supported 20
7642 225 48 Not supported Not supported Not supported Not supported 20
7542 225 32 Not supported Not supported Not supported Not supported 20
7702 200 64 20 20 25 25 25
7532 200 32 20 20 25 25 25
7502 180 32 20 20 25 25 25
7402 180 24 20 20 25 25 25
7452 155 32 20 20 25 25 30
7352 155 24 20 20 25 25 30
7302 155 16 20 20 25 25 30
7262 155 8 20 20 25 25 30
7F72 240 24 Not supported Not supported Not supported Not supported 20
7F52 240 16 Not supported Not supported Not supported Not supported Not supported
7282 120 16 20 20 25 30 30
7272 120 12 20 20 25 30 30
7252 120 8 20 20 25 30 30
NOTE H745 is Not supported for CPU TDP ≥ 180 Watts.
NOTE
  • 128GB LRDIMM is Not supported on 3.5" chassis.
  • T4 GPU card is Not supported with 128GB LRDIMM.
Table 12. Maximum continuous operating temperature for dual processor with 128GB LRDIMM for 2.5-inch direct / 2.5-inch NVMe drive configuration - Liquid cooledThis table describes the maximum continuous operating temperature for dual processor with 1x T4 GPU card for 3.5-inch direct drive configuration - Liquid cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7513 200 32 30 30 30 30 30
7443 200 24 30 30 30 30 30
7413 180 24 30 30 30 30 30
7313 155 16 30 30 30 30 30
7662 225 64 30 30 30 30 30
7713 225 64 30 30 30 30 30
7543 225 32 30 30 30 30 30
7763 280 64 30 30 30 30 30
7H12 280 64 30 30 30 30 30
7F72 240 24 30 30 30 30 30
7F52 240 16 30 30 30 30 30
7742 225 64 30 30 30 30 30
7642 225 48 30 30 30 30 30
7542 225 32 30 30 30 30 30
7702 200 64 30 30 30 30 30
7532 200 32 30 30 30 30 30
7502 180 32 30 30 30 30 30
7402 180 24 30 30 30 30 30
7F32 180 8 30 30 30 30 30
7452 155 32 30 30 30 30 30
7352 155 24 30 30 30 30 30
7302 155 16 30 30 30 30 30
7262 155 8 30 30 30 30 30
7282 120 16 30 30 30 30 30
7272 120 12 30 30 30 30 30
7252 120 8 30 30 30 30 30
NOTE
  • T4 GPU card is not supported with 128GB LRDIMM.
  • 128GB LRDIMM is not supported on 3.5” chassis.

Expanded operating temperature specifications

Table 1. Expanded operating temperatureThe following table shows the expanded operating temperature specifications:
Expanded operating temperature Allowable Operation
Temperature Ranges (For Altitude <900 meters or 2953 feet) 5 to 45°C (41 to 113°F) with no direct sunlight on the platform
Excursion Limited Operation
5 to 35°C (41 to 95°F) Continuous Operation 35 to 40°C (95 to 104°F) 10% Annual Runtime 40 to 45°C (104 to 113°F)1% Annual Runtime
Humidity Percent Ranges 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational Altitude De-Rating Maximum temperature is reduced by 1°C/125 meters (1.8°F/410 feet) above 900 meters (2,953 feet)
NOTE When operating in the expanded temperature range, system performance may be impacted.
NOTE When operating in the expanded temperature range, ambient temperature warnings may be reported in the System Event Log.

Particulate and gaseous contamination specifications

Table 1. Particulate contamination specificationsThe following table shows the particulate contamination specifications:
Particulate contamination Specifications

Air filtration

Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.

NOTE This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE Air entering the data center must have MERV11 or MERV13 filtration.

Conductive dust

Air must be free of conductive dust, zinc whiskers, or other conductive particles.

NOTE This condition applies to data center and non-data center environments.

Corrosive dust

Air must be free of corrosive dust.

Residual dust present in the air must have a deliquescent point less than 60% relative humidity.

NOTE This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe following table shows the gaseous contamination specifications:
Gaseous contamination Specifications

Copper coupon corrosion rate

<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013

Silver coupon corrosion rate

<200 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Relative humidity specifications

Table 1. Relative humidity specificationsThe following table shows the relative humidity specifications:
Relative humidity Allowable Operation
Temperature Ranges (For Altitude <900 meters or 2953 feet) 10 to 35°C (50 to 95°F) with no direct sunlight on the platform
Humidity Percent Ranges 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational Altitude De-Rating Maximum temperature is reduced by 1°C/300 meters (1.8°F/984 feet) above 900 meters (2,953 feet)

Maximum vibration specifications

Table 1. Maximum vibration specificationsThe following table shows the maximum vibration specifications:
Maximum vibration Specifications

Operating

0.26 Grms at 5 Hz to 350 Hz (all operation orientations).

Storage

1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).

Maximum shock specifications

Table 1. Maximum shock specificationsThe following table shows the maximum shock specifications:
Maximum shock Specifications

Operating

Six consecutively executed shock pulses 6 G in the positive and negative x, y, z axis for up to 11 ms (four pulses on each side of the system).

Storage

Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Maximum altitude specifications

Table 1. Maximum altitude specificationsThe following table shows the maximum altitude specifications:
Maximum altitude Allowable Operation
Maximum Temperature Gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware
Non-Operational Temperature Limits -40 to 65°C (-40 to 149°F)
Non-Operational Humidity Limits 5% to 95% RH with 27°C (80.6°F) maximum dew point. Atmosphere shall be non-condensing at all times
Maximum Non-Operational Altitude 12,000 meters (39,370 feet)
Maximum Operational Altitude 3,048 meters (10,000 feet)

Operating temperature de-rating specifications

Operating temperature de-rating specifications

Table 1. Operating temperature de-rating specificationsThe following table shows the operating temperature de-rating specifications
Operating temperature de-rating Specifications
< 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 meters (3,117 ft).
35°C-40°C (95°F-104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 meters (3,117 ft).
> 45°C (113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 meters (3,117 ft).

Fresh Air Operation

Table 1. Fresh Air operation restrictionsThis table shows the fresh Air operation restrictions
Liquid cooled Air Cooled
  • NVMe SSD is not supported.
  • LRDIMM is not supported.
  • PCIe cards greater than 25W are not supported.
  • GPU card is not supported.
  • 3.5-inch drive configuration is not supported.
  • NVMe SSD is not supported.
  • LRDIMM is not supported.
  • PCIe cards greater than 25W are not supported.
  • GPU card is not supported.
  • 3.5-inch drive configuration is not supported.
  • The 2.5-inch, no backplane configuration supports a maximum processor TDP of 200 Watts only.
  • Supports single processor configuration only. No support for dual processor configuration.