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Dell EMC PowerEdge C6520: технические характеристики и спецификации
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Dell EMC PowerEdge C6520: технические характеристики и спецификации

Sled dimensions

Figure 1. Sled dimensions

This figure shows the dimensions of the sled C6520.

Table 1. PowerEdgeC6520 sled dimensionsThis table provides the dimensions of the sled:
X Y Z
174.4 mm (6.86 inches) 40.1 mm (1.58 inches)570.34 mm (22.45 inches)

Chassis weight

Table 1. Chassis weight of the enclosure with the PowerEdge C6520 sledsThe table below shows the maximum weight of the.
System configuration Maximum weight (with all sleds and drives)
12 x 3.5-inch 45.6 kg (100.53 lb)
24 x 2.5-inch 41.4 kg (91.27 lb)
System with no backplane 35 kg (77.16 lb)

Processor specifications

Table 1. PowerEdge C6520 processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
3rd Generation Intel Xeon Scalable processors with up to 40 cores two

PSU specifications

The PowerEdge C6520 system supports up to two AC power supply units (PSUs).

Table 1. PSU specificationsThe table lists the specifications for 1600 W, 2000 W, 2400 W, 2600 W power supplies.
PSU Class Heat dissipation (maximum) Frequency Voltage AC Current
High line Low line 100–120 V
2600 W Platinum Platinum 9750 BTU/hr 50/60 Hz 100 - 240 V autoranging 2600 W (220 - 240 V) 1400 W 16 A
2400 W Platinum 9000 BTU/hr 50/60 Hz 100 - 240 V autoranging 2400 W (200 - 240 V) 1400 W 16 A
2000 W Platinum 7500 BTU/hr 50/60 Hz 100 - 240 V autoranging 2000 W (200 - 240 V) 1000 W 11.5 A
1600 W Platinum 6000 BTU/hr 50/60 Hz 100 - 240 V autoranging 1600 W (200 - 240 V) 800 W 10 A
NOTE The 2600 W PSU with part number 9D4R6 supports only C14-C19 adapter cord.
NOTE This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.
NOTE Heat dissipation is calculated using the PSU wattage rating.
NOTE When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

Supported operating systems

The PowerEdge C6520 system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Citrix Hypervisor
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi/vSAN
  • CentOS
  • Windows Preinstallation Environment (WinPE) 64-bit drivers

For more information, go to www.dell.com/ossupport.

System battery specifications

The PowerEdge C6520 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdge C6520 system supports up to four PCI express (PCIe) Gen 4 expansion cards.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot Risers Riser width PCIe slot height PCIe slot length PCIe slot width
Slot 1 Riser 1a x16 PCIe Low profile Half length x8
Slot 1 Riser 1b with support for SNAP I/O module x16 PCIe Low profile Half length x8 + x8
Slot 2 Riser 2b x16 PCIe Low profile Half length x8
NOTE For information on the expansion card installation guidelines, see the system specific Installation and Service Manual available at https://www.dell.com/poweredgemanuals

Memory specifications

The PowerEdge C6520 system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum system capacity Maximum system capacity Minimum system capacity Maximum system capacity
RDIMM Single rank 8 GB 8 GB 64 GB 16 GB 128 GB
Dual rank 16 GB 16 GB 128 GB 32 GB 256 GB
32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1 TB
LRDIMM Quad rank 64 GB 64 GB 512 GB 128 GB 1 TB
128 GB 128 GB 1 TB 256 GB 2 TB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
16, 288-pin 3200 MT/s, 2933 MT/s, 2666 MT/s

Drives

The PowerEdge C6520 system supports:
  • 12 x 3.5-inch SAS/SATA (HDD/SSD) drives
  • 24 x 2.5-inch SAS/SATA (HDD/SSD) /NVMe drive.
Table 1. Maximum number of supported drive options for the PowerEdge C6520 sled This table lists out the maximum number of supported drive options for the PowerEdge C6520 sled.
Maximum number of drives in the sled Maximum number of drives assigned per sled
12 x 3.5-inch drive systems Three SAS or SATA drives and SATA SSDs per sled
24 x 2.5-inch Non-NVMe drives configuration Six SAS or SATA drives and SATA SSDs per sled
8 x 2.5-inch NVMe drives configuration (2 NVMe drives per sled / 8 NVMe drives per chassis) The NVMe backplane supports either of these configurations:
  • Two NVMe drives and four SAS or SATA drives and SATA SSDs per sled
    NOTE NVMe drives are limited to PCIe Gen3 speed.
  • Six SAS or SATA drives and SATA SSDs per sled
24 x 2.5-inch NVMe drives configuration Six NVMe drives per sled
M.2 SATA drive (optional) The supported capacity of the M.2 SATA card is up to 960 GB
NOTE The M.2 SATA card can be installed on the M.2 riser or on the BOSS card
Micro-SD card (optional) for boot (up to 64 GB) One on Riser 1a
NOTE For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at https://www.dell.com/support Browse all Products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

Storage specifications

The PowerEdge C6520 sled supports.

Table 1. Storage controller cards for the systemThis table provides the controller cards supported on the system:
Internal controllers External controllers
  • PERC H745
  • HBA355i
  • HBA345
  • S150
  • H345
  • Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs
  • H350
  • H750
  • 12 Gbps SAS Ext. HBA
Table 2. Supported RAID options with M.2 SATA drives This table lists out the supported RAID options with M.2 SATA drives
Options Single M.2 SATA drive without RAID Dual M.2 SATA drives with hardware RAID
Hardware RAID No Yes
RAID Mode N/A RAID 1, RAID 0
Number of drives supported 1 2
Supported CPUs CPU 1 CPU 1
NOTE RAID options are only supported on BOSS cards which support two M.2 SATA drives.

USB port specifications

The PowerEdge C6520 sled supports USB 3.0 on rear of the system.

Display port specifications

The PowerEdge C6520 sled supports 1 x Mini-DisplayPort .

NIC port specifications

The PowerEdge C6520 sled supports one 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.
Table 1. NIC port specification for the sledThis table describes the NIC port specification for the system.
Feature Specifications
LOM card 1 GbE
OCP 3.0 card 1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 25 GbE x 4

iDRAC9 port specifications

The PowerEdge C6520 sled supports 1 x iDRAC Direct port (Micro-AB USB) that is located on the rear of the system.

Video specifications

The PowerEdge C6520 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported front video resolution options for the systemThis table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on www.dell.com/support/home.
Table 1. Operational climatic range category A3 This table describes the operational climatic range for category A3.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft)
Table 2. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE * - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-104 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)

Maximum vibration specifications

Table 3. Maximum vibration specificationsThe following table shows the maximum vibration specifications:
Maximum vibration Specifications

Operating

0.26 Grms at 5 Hz to 350 Hz (all operation orientations).

Storage

1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).

Maximum shock pulse specifications

Table 4. Maximum shock specifications The maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock Specifications

Operating

Six consecutively executed shock pulses 6 G in the positive and negative x, y, z axis for up to 11 ms (four pulses on each side of the system).

Storage

Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration

Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.

NOTE This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE Air entering the data center must have MERV11 or MERV13 filtration.

Conductive dust

Air must be free of conductive dust, zinc whiskers, or other conductive particles.

NOTE This condition applies to data center and non-data center environments.

Corrosive dust

  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Thermal restrictions

NOTE
  1. Not available: Indicates that the configuration is not offered by Dell EMC.
  2. Not supported: Indicates that the configuration is not thermally supported.
NOTE All components including the DIMMs, communication cards, M.2 SATA, and PERC cards can be supported with sufficient thermal margin if the ambient temperature is equal to or below the maximum continuous operating temperature listed in these tables.
NOTE Some of the system hardware configurations require a lowered upper temperature limit. For more information about the operating temperature requirement, contact technical support.
NOTE Some configurations require a lower ambient temperature. For more information, see the following tables.

The following tables list key restrictions on ambient temperature based on which CPU is configured in the system. All inlet temperatures that are provided below are in continuous degrees centigrade.

Table 1. Maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch NVMe drive configuration- Air cooledThis table describes the maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooled
Processors TDP (W) Cores 6 x drives/sled 4 x drives/sled 2 x drives/sled 1 x drive/sled No BP
8380 270 40 Not supported Not supported Not supported Not supported Not supported
8368 270 38 Not supported Not supported Not supported Not supported Not supported
8368Q 270 38 Not supported Not supported Not supported Not supported Not supported
8362 265 32 Not supported Not supported Not supported Not supported Not supported
8360Y 250 36 Not supported Not supported Not supported Not supported Not supported
8358 250 32 Not supported Not supported Not supported Not supported Not supported
8358P 240 32 Not supported Not supported Not supported Not supported 20
6348 235 28 Not supported Not supported Not supported Not supported 20
6342 230 24 Not supported Not supported Not supported 20 20
8352Y 205 32 20 20 25 25 25
8352S 205 32 20 20 25 25 25
6338 205 32 20 20 25 25 25
6330 205 28 20 20 25 25 25
6354 205 18 Not supported 20 20 20 25
6346 205 16 Not supported 20 20 20 25
8352V 195 36 20 20 25 25 25
8352M 185 32 20* 20* 25 25 25
6338N 185 32 20* 20* 25 25 25
5320 185 26 20* 20* 25 25 25
6336Y 185 24 20* 20* 25 25 25
6326 185 16 20* 20* 25 25 25
6330N 165 28 25 25* 25* 25* 25*
6338T 165 24 25 25* 25* 25* 25*
5318Y 165 24 25 25* 25* 25* 25*
5318S 165 24 25 25* 25* 25* 25*
6334 165 8 25 25* 25* 25* 25*
5318N 150 24 25* 30 30 30 30*
5320T 150 20 25* 30 30 30 30*
4316 150 20 25* 30 30 30 30*
5317 150 12 25* 30 30 30 30*
5315Y 140 8 30 30 30* 30* 30*
4314 135 16 30* 30* 30* 30* 30*
4310 120 12 35 35 35 35 35
4310T 105 10 35 35 35 35 35
4309Y 105 8 35 35 35 35 35
NOTE
  • Data with * mark means it can have a temperature offset by +5°C, if using extended processor 1 with HSK on this configuration.
  • H745 is not supported with processor TDP > 185 W.
  • Additional thermal restrictions are required for PCIE > 25 Watts, 128GB LRDIMM and GPU configuration.
Table 2. Maximum continuous operating temperature for single processor with 2.5-inch direct drive configuration for processor 1 - Air cooledThis table describes the maximum continuous operating temperature for single processor with 2.5-inch direct drive configuration - Air cooled
Processors TDP (W) Cores 6 x drives/sled 4 x drives/sled 2 x drives/ sled 1 x drive/ sled No BP
8380 270 40 20 20 20 20 25
8368 270 38 20 20 25 25 25
8368Q 270 38 Not supported Not supported Not supported Not supported Not supported
8362 265 32 20 20 25 25 25
8360Y 250 36 20 20 25 25 25
8358 250 32 20 20 25 25 25
8358P 240 32 20 20 25 25 25
6348 235 28 25 25 25 25 30
6342 230 24 25 25 25 25 30
8351N 225 36 20 20 25 25 25
8352Y 205 32 30 30 35 35 35
6314U 205 32 30 30 35 35 35
8352S 205 32 30 30 35 35 35
6338 205 32 30 30 35 35 35
6330 205 28 30 30 35 35 35
6354 205 18 25 25 30 30 30
6346 205 16 25 25 30 30 30
8352V 195 36 30 30 30 30 35
8352M 185 32 35 35 35 35 35
6338N 185 32 35 35 35 35 35
5320 185 26 35 35 35 35 35
6336Y 185 24 35 35 35 35 35
6312U 185 24 35 35 35 35 35
6326 185 16 35 35 35 35 35
6330N 165 28 35 35 35 35 35
6338T 165 24 35 35 35 35 35
5318Y 165 24 35 35 35 35 35
5318S 165 24 35 35 35 35 35
6334 165 8 35 35 35 35 35
5318N 150 24 35 35 35 35 35
5320T 150 20 35 35 35 35 35
4316 150 20 35 35 35 35 35
5317 150 12 35 35 35 35 35
5315Y 140 8 35 35 35 35 35
4314 135 16 35 35 35 35 35
4310 120 12 35 35 35 35 35
4310T 105 10 35 35 35 35 35
4309Y 105 8 35 35 35 35 35
NOTE Additional thermal restrictions are required for PCIE > 25 Watts, 128GB LRDIMM and GPU configuration.
Table 3. Maximum continuous operating temperature for dual processor with 2.5-inch Pure NVMe drive configuration- Air cooled
Processors TDP (W) Cores 6 x drives/sled 4 x drives/sled 2 x drives/sled 1 x drive/sled
8380 270 40 Not supported Not supported Not supported Not supported
8368 270 38 Not supported Not supported Not supported Not supported
8368Q 270 38 Not supported Not supported Not supported Not supported
8362 265 32 Not supported Not supported Not supported Not supported
8360Y 250 36 Not supported Not supported Not supported Not supported
8358 250 32 Not supported Not supported Not supported Not supported
8358P 240 32 Not supported Not supported Not supported Not supported
6348 235 28 Not supported Not supported Not supported Not supported
6342 230 24 Not supported Not supported Not supported 20
8352Y 205 32 20 20 25 25
8352S 205 32 20 20 25 25
6338 205 32 20 20 25 25
6330 205 28 20 20 25 25
6354 205 18 Not supported Not supported 20 20
6346 205 16 Not supported Not supported 20 20
8352V 195 36 20 20 25 25
8352M 185 32 20 20 25 25
6338N 185 32 20 20 25 25
5320 185 26 20 20 25 25
6336Y 185 24 20 20 25 25
6326 185 16 20 20 25 25
6330N 165 28 20* 20* 25* 25*
6338T 165 24 20* 20* 25* 25*
5318Y 165 24 20* 20* 25* 25*
5318S 165 24 20* 20* 25* 25*
6334 165 8 20* 20* 25* 25*
5318N 150 24 25 25 30 30
5320T 150 20 25 25 30 30
4316 150 20 25 25 30 30
5317 150 12 25 25 30 30
5315Y 140 8 25* 25* 30* 30*
4314 135 16 25* 25* 30* 30*
4310 120 12 30 30 35 35
4310T 105 10 30* 30* 35 35
4309Y 105 8 30* 30* 35 35
Table 4. Maximum continuous operating temperature for dual processor with 3.5-inch direct drive configuration- Air cooledhis table describes the maximum continuous operating temperature for dual processor with 3.5-inch direct drive configuration - Air cooled
Processors TDP (W) Cores 3 x drives/sled 2 x drives/sled 1 x drive/sled
8380 270 40 Not supported Not supported Not supported
8368 270 38 Not supported Not supported Not supported
8368Q 270 38 Not supported Not supported Not supported
8362 265 32 Not supported Not supported Not supported
8360Y 250 36 Not supported Not supported Not supported
8358 250 32 Not supported Not supported Not supported
8358P 240 32 Not supported Not supported Not supported
6348 235 28 Not supported Not supported Not supported
6342 230 24 Not supported Not supported Not supported
8351N 225 36 Not supported Not supported Not supported
8352Y 205 32 Not supported Not supported Not supported
6314U 205 32 Not supported Not supported Not supported
8352S 205 32 Not supported Not supported Not supported
6338 205 32 Not supported Not supported Not supported
6330 205 28 Not supported Not supported Not supported
6354 205 18 Not supported Not supported Not supported
6346 205 16 Not supported Not supported Not supported
8352V 195 36 Not supported Not supported Not supported
8352M 185 32 Not supported Not supported Not supported
6338N 185 32 Not supported Not supported Not supported
5320 185 26 Not supported Not supported Not supported
6336Y 185 24 Not supported Not supported Not supported
6312U 185 24 Not supported Not supported Not supported
6326 185 16 Not supported Not supported Not supported
6330N 165 28 Not supported Not supported 20
6338T 165 24 Not supported Not supported 20
5318Y 165 24 Not supported Not supported 20
5318S 165 24 Not supported Not supported 20
6334 165 8 Not supported Not supported 20
5318N 150 24 Not supported Not supported 20
5320T 150 20 Not supported Not supported 20
4316 150 20 Not supported Not supported 20
5317 150 12 Not supported Not supported 20
5315Y 140 8 Not supported 20 20*
4314 135 16 Not supported 20* 20*
4310 120 12 20 25 25
4310T 105 10 25 30 30
4309Y 105 8 25 30 30
Table 5. Maximum continuous operating temperature for single processor with 3.5-inch direct drive configuration- Air cooled
Processors TDP (W) Cores 3 x drives/sled 2 x drives/sled 1 x drive/sled
8380 270 40 Not supported Not supported Not supported
8368 270 38 Not supported Not supported Not supported
8368Q 270 38 Not supported Not supported Not supported
8362 265 32 Not supported Not supported Not supported
8360Y 250 36 Not supported Not supported Not supported
8358 250 32 Not supported Not supported Not supported
8358P 240 32 Not supported Not supported 20
6348 235 28 Not supported 20 20
6342 230 24 Not supported 20 20
8351N 225 36 Not supported Not supported 20
8352Y 205 32 20 25 25
6314U 205 32 20 25 25
8352S 205 32 20 25 25
6338 205 32 20 25 25
6330 205 28 20 25 25
6354 205 18 Not supported 20 25
6346 205 16 Not supported 20 25
8352V 195 36 20 25 25
8352M 185 32 25 30 30
6338N 185 32 25 30 30
5320 185 26 25 30 30
6336Y 185 24 25 30 30
6312U 185 24 25 30 30
6326 185 16 25 30 30
6330N 165 28 25 30 30
6338T 165 24 25 30 30
5318Y 165 24 25 30 30
5318S 165 24 25 30 30
6334 165 8 25 30 30
5318N 150 24 30 35 35
5320T 150 20 30 35 35
4316 150 20 30 35 35
5317 150 12 30 35 35
5315Y 140 8 30 35 35
4314 135 16 30 35 35
4310 120 12 30 35 35
4310T 105 10 35 35 35
4309Y 105 8 35 35 35
Table 6. Maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch NVMe drive configuration- Liquid cooledThis table describes the maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch NVMe drive configuration - Liquid cooled
Processors TDP (W) Cores 6 x drives/ sled 4 x drives/ sled 2 x drives/ sled 1 x drive/ sled No BP
8380 270 40 35 35 35 35 35
8368 270 38 35 35 35 35 35
8368Q 270 38 35 35 35 35 35
8362 265 32 35 35 35 35 35
8360Y 250 36 35 35 35 35 35
8358 250 32 35 35 35 35 35
8358P 240 32 35 35 35 35 35
6348 235 28 35 35 35 35 35
6342 230 24 35 35 35 35 35
8352Y 205 32 35 35 35 35 35
8352S 205 32 35 35 35 35 35
6338 205 32 35 35 35 35 35
6330 205 28 35 35 35 35 35
6354 205 18 35 35 35 35 35
6346 205 16 35 35 35 35 35
8352V 195 36 35 35 35 35 35
8352M 185 32 35 35 35 35 35
6338N 185 32 35 35 35 35 35
5320 185 26 35 35 35 35 35
6336Y 185 24 35 35 35 35 35
6326 185 16 35 35 35 35 35
6330N 165 28 35 35 35 35 35
6338T 165 24 35 35 35 35 35
5318Y 165 24 35 35 35 35 35
5318S 165 24 35 35 35 35 35
6334 165 8 35 35 35 35 35
5318N 150 24 35 35 35 35 35
5320T 150 20 35 35 35 35 35
4316 150 20 35 35 35 35 35
5317 150 12 35 35 35 35 35
5315Y 140 8 35 35 35 35 35
4314 135 16 35 35 35 35 35
4310 120 12 35 35 35 35 35
4310T 105 10 35 35 35 35 35
4309Y 105 8 35 35 35 35 35
NOTE Additional thermal restrictions are required for PCIE > 25 Watts, 128GB LRDIMM and GPU configuration.
Table 7. Maximum continuous operating temperature for dual processor with 2.5-inch Pure NVMe drive configuration- Liquid cooledThis table describes the maximum continuous operating temperature for dual processor with 2.5-inch NVMe drive configuration - Liquid cooled
Processors TDP (W) Cores 6 x drives/ sled 4 x drives/ sled 2 x drives/ sled 1 x drive/ sled
8380 270 40 35 35 35 35
8368 270 38 35 35 35 35
8368Q 270 38 35 35 35 35
8362 265 32 35 35 35 35
8360Y 250 36 35 35 35 35
8358 250 32 35 35 35 35
8358P 240 32 35 35 35 35
6348 235 28 35 35 35 35
6342 230 24 35 35 35 35
8352Y 205 32 35 35 35 35
8352S 205 32 35 35 35 35
6338 205 32 35 35 35 35
6330 205 28 35 35 35 35
6354 205 18 35 35 35 35
6346 205 16 35 35 35 35
8352V 195 36 35 35 35 35
8352M 185 32 35 35 35 35
6338N 185 32 35 35 35 35
5320 185 26 35 35 35 35
6336Y 185 24 35 35 35 35
6326 185 16 35 35 35 35
6330N 165 28 35 35 35 35
6338T 165 24 35 35 35 35
5318Y 165 24 35 35 35 35
5318S 165 24 35 35 35 35
6334 165 8 35 35 35 35
5318N 150 24 35 35 35 35
5320T 150 20 35 35 35 35
4316 150 20 35 35 35 35
5317 150 12 35 35 35 35
5315Y 140 8 35 35 35 35
4314 135 16 35 35 35 35
4310 120 12 35 35 35 35
4310T 105 10 35 35 35 35
4309Y 105 8 35 35 35 35
NOTE Additional thermal restrictions are required for PCIE > 25 Watts, 128GB LRDIMM and GPU configuration.
Table 8. Maximum continuous operating temperature for dual processor with 3.5-inch direct drive configuration- Liquid cooledThis table describes the maximum continuous operating temperature for dual processor with 3.5-inch direct drive configuration- Liquid cooled
Processors TDP (W) Cores 3 x drives/sled 2 x drives/sled 1 x drive/sled
8380 270 40 35 35 35
8368 270 38 35 35 35
8368Q 270 38 35 35 35
8362 265 32 35 35 35
8360Y 250 36 35 35 35
8358 250 32 35 35 35
8358P 240 32 35 35 35
6348 235 28 35 35 35
6342 230 24 35 35 35
8352Y 205 32 35 35 35
8352S 205 32 35 35 35
6338 205 32 35 35 35
6330 205 28 35 35 35
6354 205 18 35 35 35
6346 205 16 35 35 35
8352V 195 36 35 35 35
8352M 185 32 35 35 35
6338N 185 32 35 35 35
5320 185 26 35 35 35
6336Y 185 24 35 35 35
6326 185 16 35 35 35
6330N 165 28 35 35 35
6338T 165 24 35 35 35
5318Y 165 24 35 35 35
5318S 165 24 35 35 35
6334 165 8 35 35 35
5318N 150 24 35 35 35
5320T 150 20 35 35 35
4316 150 20 35 35 35
5317 150 12 35 35 35
5315Y 140 8 35 35 35
4314 135 16 35 35 35
4310 120 12 35 35 35
4310T 105 10 35 35 35
4309Y 105 8 35 35 35
NOTE Additional thermal restrictions are required for PCIE > 25 Watts, 128GB LRDIMM and GPU configuration.

ASHRAE A3 Configuration Restriction

Table 9. ASHRAE A3 Configuration RestrictionThis table shows the ASHRAE A3 Configuration Restriction:
Liquid cooled Air Cooled
  • NVMe SSD is not supported.
  • LRDIMM is not supported.
  • PCIe cards greater than 25 W are not supported.
  • GPU card is not supported.
  • 3.5-inch drive configuration is not supported.
  • NVMe SSD is not supported.
  • LRDIMM is not supported.
  • PCIe cards greater than 25W are not supported.
  • GPU card is not supported.
  • 3.5-inch drive configuration is not supported.
  • For 1P sled, maximum supported CPU TDP is 150 W.
  • For 2P sled, maximum supported CPU TDP is 105 W..