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Dell EMC PowerEdge C6420: технические характеристики и спецификации
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Dell EMC PowerEdge C6420: технические характеристики и спецификации

Dimensions of the Dell EMCPowerEdgeC6420 sled

Figure 1. Dimensions of the PowerEdge C6420 sled
This figure shows the dimensions of the PowerEdge C6400 enclosure.
Table 1. Dimensions of the PowerEdge C6420 sledThe dimensions of the PowerEdge C6400 enclosure are as follows: X= 174.4 mm (6.86 inches), Y= 40.5 mm (1.59 inches), Z=574.5 mm (22.61 inches).
XYZ
174.4 mm (6.86 inches)40.5 mm (1.59 inches)574.5 mm (22.61 inches)

Chassis weight

Table 1. Chassis weight of the enclosure with the sledsFor the Dell EMC PowerEdge C6420 sleds systems, the maximum chassis weight for 12 x 3.5-inch drive systems is 43.62 Kg (96.16lb), the maximum chassis weight for no backplane systems is 34.56 Kg (76.19 lb).
System Maximum weight (with all sleds and drives)
12 x 3.5-inch hard drive systems 43.62 Kg (96.16 lb)
No backplane systems 34.56 Kg (76.19 lb)

Processor specifications

The Dell EMC PowerEdge C6420 sled supports up to two Intel Xeon Scalable processor in each of the four independent sleds. Each processor supports up to 28 cores.
NOTE The fabric processor must be installed in the processor 2 socket in a mixed configuration of fabric and non-fabric processors.

Supported operating systems

The Dell EMC PowerEdge C6420 supports the following operating systems:
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • Microsoft Windows Server with Hyper-V
  • Canonical Ubuntu LTS
  • VMware ESXi
  • Citrix XenServer
NOTE For more information about the specific versions and additions, see https://www.dell.com/support/home/drivers/supportedos/poweredge-c6420

System battery

The PowerEdge C6420 sled uses a CR 2032 3V replaceable lithium coin cell battery.

NOTE There is a system battery in each of the sleds.

Expansion bus specifications

The Dell EMC PowerEdge C6420 sled supports four Generation 3 capable PCIe slots.
Table 1. Expansion bus specificationsThe table below shows the supported expansion bus:
PCIe Slots Description Form factor
x8 Mezz PCIe riser Slot 1: x8 PCIe Gen3 from processor 1 Custom form factor
x8+x8 OCP Mezz riser Slot 2: x8 PCIe Gen3 from processor 1 Standard Open Compute Project (OCP) form factor
Slot 3: x8 PCIe Gen3 from processor 1
x16 PCIe main riser Slot 4: x16 PCIe Gen3 processor 1 Standard Low Profile PCIe form factor
x16 buried PCIe riser Slot 5: x16 PCIe Gen3 from processor 2 Custom form factor
NOTE M.2 SATA riser is supported on the buried riser.

Memory specifications

Table 1. Memory specifications The table below shows the memory specifications.

Memory module

sockets

DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
Sixteen 288-pins LRDIMM Quad rank 64 GB 64 GB 512 GB 128 GB 1024 GB
Octal rank 128 GB 128 GB 1024 GB 256 GB 2048 GB
RDIMM Single rank 8 GB 8 GB 64 GB 16 GB 128 GB
Dual rank 16 GB 16 GB 128 GB 32 GB 256 GB
32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1024 GB
NOTE The older 32 GB capacity RDIMM memory with x4 data width and 8Gb DRAM density cannot be mixed with the newer 32GB capacity RDIMM memory with x8 data width and 16Gb DRAM density in the same AMD EPYC™ processor unit.

Drives and storage specifications

The Dell EMC PowerEdge C6420 sled supports SAS and SATA Drives and Solid State Drives (SSDs).

Table 1. Supported drive options for the PowerEdge C6420 sledThis table lists out the supported drive options for the PowerEdge C6420 sled.
Maximum number of drives in the enclosure Maximum number of drives assigned per sled
12 x 3.5-inch drive systems Three SAS or SATA Drives and SSDs per sled
24 x 2.5-inch drive systems Six SAS or SATA Drives and SSDs per sled
24 x 2.5-inch drive systems with NVMe The NVMe backplane supports either of these configurations:
  • Two NVMe drives and four SAS or SATA Drives and SSDs per sled
  • Six SAS or SATA Drives and SSDs per sled
M.2 SATA drive (optional) The supported capacity of the M.2 SATA card is up to 240 GB
NOTE The M.2 SATA card can be installed on the x8 (slot 1) mezzanine riser or the x16 riser slot (slot 5).
microSD card (optional) for boot (up to 64 GB) One on each PCIe riser of each sled
Table 2. Supported RAID options with M.2 SATA drivesThis table lists out the supported RAID options with M.2 SATA drives
Options Single M.2 SATA drive without RAID Dual M.2 SATA drives with hardware RAID
Hardware RAID No Yes
RAID Mode N/A RAID 1
Number of drives supported 1 2
Supported processors processor 1 processor 1 and processor 2

Video specifications

The Dell EMC PowerEdge C6420 sled supports a Matrox G200eW3 integrated graphics card with 16 MB RAM.
Table 1. Supported video resolution optionsFor 1024 x 768 resolution, the refresh rate is 60 Hz and the color depth is up to 24. For 1280 x 800 resolution, the refresh rate is 60 Hz and the color depth is up to 24. For 1280 x 1024 resolution, the refresh rate is 60 Hz and the color depth is up to 24. For 1360 x 768 resolution, the refresh rate is 60 Hz and the color depth is up to 24. For 1440 x 900 resolution, the refresh rate is 60 Hz and the color depth is up to 24.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 up to 24
1280 x 800 60 up to 24
1280 x 1024 60 up to 24
1360 x 768 60 up to 24
1440 x 900 60 up to 24

Environmental specifications

The sections below contains information about the environmental specifications of the system.

NOTE For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/poweredgemanuals.

Standard operating temperature specifications

NOTE
  1. Not available: Indicates that the configuration is not offered by Dell EMC.
  2. Not supported: Indicates that the configuration is not thermally supported.
NOTE All components including the DIMMs, communication cards, M.2 SATA, and PERC cards can be supported with sufficient thermal margin if the ambient temperature is equal to or below to the maximum continuous operating temperature listed in these tables except for the Mellanox DP LP card and Intel Rush Creek card.
Table 1. Standard operating temperature specificationsThe following table shows the standard operating temperature specifications:
Standard operating temperature Specifications

Temperature ranges (for altitude less than 950 m or 3117 ft)

10°C–35°C (50°F–95°F) with no direct sunlight on the equipment.

NOTE Some configurations require a lower ambient temperature. For more information, see the following tables.
Table 2. Maximum continuous operating temperature for nonfabric dual processor configurationThis table describes the maximum continuous operating temperature for nonfabric dual processor configuration
TDP Watts Processor model Heat sink model Max memory/processor 3.5-inch chassis2.5-inch chassis No-BP Chassis
12x Drives 8x Drives 4x Drives 24x Drives 20x Drives 16x Drives 12x Drives 8x Drives 4x Drives N/A
205 W 8280 CPU1: FMM2M | CPU2: V2DRD CPU1: 6 | CPU2: 8 Not Supported (2°C)Not Supported (10°C)Not Supported (11°C)Not Supported(19°C) 20 21 21 21 21 30
8280L CPU1: FMM2M | CPU2: V2DRD CPU1: 6 | CPU2: 8 20 21 21 21 21 30
8280M CPU1: FMM2M | CPU2: V2DRD CPU1: 6 | CPU2: 8 20 21 21 21 21 30
8270 CPU1: FMM2M | CPU2: V2DRD CPU1: 6 | CPU2: 8 20 21 21 21 21 30
8268 CPU1: FMM2M | CPU2: V2DRD CPU1: 6 | CPU2: 8 20 21 21 21 21 30
200 W 6254 CPU1: FMM2M | CPU2: V2DRD CPU1: 6 | CPU2: 8 Not Supported(6°C)Not Supported(14°C)Not Supported(15°C) 20 21 22 22 22 22 30
165 W 8276 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 Not Supported(11°C)Not Supported(18°C)Not Supported(19°C) 30 30 30 30 30 35 35
8276L CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 30 30 30 30 30 35 35
8276M CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 30 30 30 30 30 35 35
8260 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 30 30 30 30 30 35 35
8260L CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 30 30 30 30 30 35 35
8260M CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 30 30 30 30 30 35 35
8260C CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 30 30 30 30 30 35 35
150 W 6252 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 Not Supported(14°C) 21 23 30 30 30 30 30 35 35
6248 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 21 23 30 30 30 30 30 35 35
6240 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 21 23 30 30 30 30 30 35 35
6242 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 21 23 30 30 30 30 30 35 35
6244 CPU1: FMM2M | CPU2: V2DRD CPU1: 6 | CPU2: 8 21 23 30 30 30 30 30 35 35
6240C CPU1: FMM2M | CPU2: V2DRD CPU1: 6 | CPU2: 8 21 23 30 30 30 30 30 35 35
125 W 6230 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 25 30 30 30 30 35 35 35 35 35
5220 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 25 30 30 30 30 35 35 35 35 35
5218 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 25 30 30 30 30 35 35 35 35 35
5218B CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 25 30 30 30 30 35 35 35 35 35
8253 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 25 30 30 30 30 35 35 35 35 35
6238T CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 25 30 30 30 30 35 35 35 35 35
6230N CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 25 30 30 30 30 35 35 35 35 35
115 W 5217 CPU1: FMM2M | CPU2: V2DRD CPU1: 6 | CPU2: 8 25 30 30 30 30 35 35 35 35 35
105 W 5218T CPU1: FMM2M | CPU2: V2DRD CPU1: 6 | CPU2: 8 30 35 35 35 35 35 35 35 35 35
5218N CPU1: FMM2M | CPU2: V2DRD CPU1: 6 | CPU2: 8 30 35 35 35 35 35 35 35 35 35
5222 CPU1: FMM2M | CPU2: V2DRD CPU1: 6 | CPU2: 8 30 35 35 35 35 35 35 35 35 35
8256 CPU1: FMM2M | CPU2: V2DRD CPU1: 6 | CPU2: 8 30 35 35 35 35 35 35 35 35 35
100 W 4216 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 30 35 35 35 35 35 35 35 35 35
85 W 5215 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 35 35 35 35 35 35 35 35 35 35
5215M CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 35 35 35 35 35 35 35 35 35 35
5215L CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 35 35 35 35 35 35 35 35 35 35
4215 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 35 35 35 35 35 35 35 35 35 35
4214 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 35 35 35 35 35 35 35 35 35 35
4214C CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 35 35 35 35 35 35 35 35 35 35
4210 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 35 35 35 35 35 35 35 35 35 35
4208 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 35 35 35 35 35 35 35 35 35 35
3204 CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 35 35 35 35 35 35 35 35 35 35
70 W 4209T CPU1: JYKMM | CPU2: V2DRD CPU1: 8 | CPU2: 8 35 35 35 35 35 35 35 35 35 35
Table 3. Maximum continuous operating temperature for non-fabric single processor configurationThis table describes the maximum continuous operating temperature for nonfabric single processor configuration
TDP Watts Processor model Heat sink model Max memory/processor 3.5-inch chassis2.5-inch chassisNo-BP Chassis
12x Drives 8x Drives 4x Drives 24x Drives 20x Drives 16x Drives 12x Drives 8x Drives 4x Drives N/A
205W 8280 CPU1: FMM2M CPU1: 6 30 30 30 35 35 35 35 35 35 35
8280L CPU1: FMM2M CPU1: 6 30 30 30 35 35 35 35 35 35 35
8280M CPU1: FMM2M CPU1: 6 30 30 30 35 35 35 35 35 35 35
8270 CPU1: FMM2M CPU1: 6 30 30 30 35 35 35 35 35 35 35
8268 CPU1: FMM2M CPU1: 6 30 30 30 35 35 35 35 35 35 35
200 W 6254 CPU1: FMM2M CPU1: 6 30 30 30 35 35 35 35 35 35 35
165 W 6212U CPU1: JYKMM CPU1: 8 30 35 35 35 35 35 35 35 35 35
8276 CPU1: JYKMM CPU1: 8 30 35 35 35 35 35 35 35 35 35
8276L CPU1: JYKMM CPU1: 8 30 35 35 35 35 35 35 35 35 35
8276M CPU1: JYKMM CPU1: 8 30 35 35 35 35 35 35 35 35 35
8260 CPU1: JYKMM CPU1: 8 30 35 35 35 35 35 35 35 35 35
8260L CPU1: JYKMM CPU1: 8 30 35 35 35 35 35 35 35 35 35
8260M CPU1: JYKMM CPU1: 8 30 35 35 35 35 35 35 35 35 35
8260C CPU1: JYKMM CPU1: 8 30 35 35 35 35 35 35 35 35 35
150 W 6210U CPU1: JYKMM CPU1: 8 30 35 35 35 35 35 35 35 35 35
6252 CPU1: JYKMM CPU1: 8 30 35 35 35 35 35 35 35 35 35
6248 CPU1: JYKMM CPU1: 8 30 35 35 35 35 35 35 35 35 35
6240 CPU1: JYKMM CPU1: 8 30 35 35 35 35 35 35 35 35 35
6242 CPU1: JYKMM CPU1: 8 30 35 35 35 35 35 35 35 35 35
6244 CPU1: FMM2M CPU1: 6 30 35 35 35 35 35 35 35 35 35
6240C CPU1: FMM2M CPU1: 6 30 35 35 35 35 35 35 35 35 35
125W 6230 CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
5220 CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
5218 CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
5218B CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
8253 CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
6238T CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
6230N CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
115 W 5217 CPU1: FMM2M CPU1: 6 30 35 35 35 35 35 35 35 35 35
105 W 5218T CPU1: FMM2M CPU1: 6 30 35 35 35 35 35 35 35 35 35
5218N CPU1: FMM2M CPU1: 6 30 35 35 35 35 35 35 35 35 35
5222 CPU1: FMM2M CPU1: 6 30 35 35 35 35 35 35 35 35 35
8256 CPU1: FMM2M CPU1: 6 30 35 35 35 35 35 35 35 35 35
100 W 4216 CPU1: JYKMM CPU1: 8 30 35 35 35 35 35 35 35 35 35
85 W 5215 CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
5215M CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
5215L CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
4215 CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
4214 CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
4214C CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
4210 CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
4208 CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
3204 CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
70 W 4209T CPU1: JYKMM CPU1: 8 35 35 35 35 35 35 35 35 35 35
Table 4. Configuration Restrictions with Mellanox Navi Dual Port Card with Active (Optical) connectivityThis table describes the configuration Restrictions with Mellanox Navi Dual Port Card with Active (Optical) connectivity
TDP Watts3.5-inch chassis2.5-inch chassisNo-BP Chassis
12x HDDs 8x HDDs 4x HDDs 24x HDDs 16x HDDs 8x HDDs 4x HDDs N/A
205 W Not supported Not supported Not supported Not supported Not supported Not supported Not supported 23
200 W Not supported Not supported Not supported Not supported Not supported Not supported Not supported 23
173 W Not supported Not supported Not supported Not supported Not supported 24 24 28
165 W Not supported Not supported Not supported 24 25 25 26 29
160 W Not supported Not supported Not supported 24 25 26 26 30
150 W Not supported Not supported Not supported 26 27 28 28 31
140 W Not supported 23 25 28 29 29 30 33
135 W Not supported 24 25 29 30 30 31 33
130 W Not supported 24 26 30 31 31 31 34
125 W 20 25 27 30 31 32 32 35
115 W 21 27 28 32 33 34 34 >35
113 W 21 27 28 32 33 34 34 >35
105 W 22 28 30 34 35 >35 >35 >35
85 W 23 32 33 >35 >35 >35 >35 >35
70 W 25 34 >35 >35 >35 >35 >35 >35
Table 5. Configuration Restrictions with Intel Rush CreekThis table describes the configuration Restrictions with Intel Rush Creek
TDP Watts3.5-inch chassis2.5-inch chassisNo-BP Chassis
12x HDDs 8x HDDs 4x HDDs 24x HDDs 16x HDDs 8x HDDs 4x HDDs N/A
205 W Not supported Not supported Not supported Not supported Not supported 20 20 23
200 W Not supported Not supported Not supported Not supported Not supported 21 21 24
173 W Not supported Not supported Not supported 20 20 23 24 28
165 W Not supported Not supported Not supported 22 22 24 25 29
160 W Not supported Not supported Not supported 22 22 24 26 29
150 W Not supported Not supported Not supported 24 24 26 27 30
140 W Not supported Not supported Not supported 26 26 27 28 31
135 W Not supported Not supported 20 26 26 28 29 32
130 W Not supported Not supported 20 27 27 29 29 33
125 W Not supported Not supported 21 28 28 30 30 33
115W Not supported 21 23 29 31 31 32 34
105 W 20 23 24 30 33 33 34 >35
85 W 24 26 27 34 >35 >35 >35 >35
70 W 25 28 29 >35 >35 >35 >35 >35
Table 6. Configuration Restrictions with Intel NVMe SSD AIC P4800XThis table describes the configuration Restrictions with Intel NVMe SSD AIC P4800X
TDP Watts3.5-inch chassis2.5-inch chassisNo-BP Chassis
12x HDDs 8x HDDs 4x HDDs 24x HDDs 16x HDDs 8x HDDs 4x HDDs N/A
205 W Not supported Not supported Not supported Not supported Not supported Not supported Not supported Not supported
200 W Not supported Not supported Not supported Not supported Not supported Not supported Not supported Not supported
173 W Not supported Not supported Not supported Not supported Not supported Not supported Not supported 20
165 W Not supported Not supported Not supported Not supported Not supported Not supported Not supported 20
160 W Not supported Not supported Not supported Not supported Not supported Not supported Not supported 25
150 W Not supported Not supported Not supported Not supported 20 20 20 25
140 W Not supported Not supported Not supported 20 20 20 20 25
135 W Not supported Not supported Not supported 20 20 20 20 25
130 W Not supported Not supported Not supported 20 20 20 20 25
125 W Not supported Not supported Not supported 20 25 25 25 30
115 W Not supported Not supported Not supported 25 25 25 25 30
105 W Not supported Not supported Not supported 25 25 25 25 30
85 W Not supported Not supported Not supported 30 30 30 30 >35
70 W Not supported Not supported Not supported >35 >35 >35 >35 >35

Expanded operating temperature specifications

Table 1. Expanded operating temperatureThe following table shows the expanded operating temperature specifications:
Expanded operating temperature Specifications
Continuous operation 5°C–40°C at 5% to 85% RH with maximum 29°C dew point.
NOTE Outside the standard operating temperature (10°C–35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C.
For temperatures between 35°C-40°C, derate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
≤ 1% of annual operating hours –5°C–45°C at 5% to 90% RH with maximum 29°C dew point.
NOTE Outside the standard operating temperature (10°C–35°C), the system can operate down to –5°C-45°C for a maximum of 1% of its annual operating hours.
For temperatures between 40°C-45°C, derate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
NOTE When operating in the expanded temperature range, system performance may be impacted.
NOTE When operating in the expanded temperature range, ambient temperature warnings may be reported in the System Event Log.

Operating temperature derating specifications

Table 1. Operating temperatureThe following table shows the operating temperature derating specifications:
Operating temperature derating Specifications

< 35°C (95°F)

Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 meters (3,117 ft)

35°C–40°C (95°F–104°F)

Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 meters (3,117 ft)

> 45°C (113°F)

Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 meters (3,117 ft)

Relative humidity specifications

Table 1. Relative humidity specificationsThe following table shows the humidity specifications:
Relative humidity Specifications

Storage

5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.

Operating

10% to 80% relative humidity with 29°C (84.2°F) maximum dew point

Temperature specifications

Table 1. Temperature specificationsThe following table shows the temperature specifications:

Temperature

Specifications

Storage

–40°C–65°C (–40°F-149°F)

Continuous operation (for altitude less than 950 m or 3117 ft)

10°C–35°C (50°F-95°F) with no direct sunlight on the equipment.

Fresh air

For information about fresh air, see Expanded Operating Temperature section.

Maximum temperature gradient (operating and storage)

20°C/h (68°F/h)

NOTE Some configurations require a lower ambient temperature for more information, see the Standard operating temperature specifications.

Thermal restrictions

Table 1. Thermal restrictions matrix for dual processorsThis table describes the thermal matrix for dual processors:
Maximum continuous operating inlet temperature (°C)
3.5" Chassis 2.5" Chassis No-BP Chassis
TDP Watts Proc No. DPN of CPU Heat Sinks Max DIMM counts 12x HDDs 8x HDDs 4x HDDs 24x HDDs 20x HDDs 16x HDDs 12x HDDs 8x HDDs 4x HDDs N/A
165W 6238R CPU1: | CPU2: CPU1: 8 | CPU2: 8 Not Supported 30 30 30 30 30 35 35
6240R CPU1: | CPU2: CPU1: 8 | CPU2: 8 Not Supported Not Supported 30 30 30 30 30 35 35
150W 6230R CPU1: | CPU2: CPU1: 8 | CPU2: 8 21 23 30 30 30 30 30 35 35
6226R CPU1: | CPU2: CPU1: 8 | CPU2: 8 21 23 30 30 30 30 30 35 35
6208U CPU1: | CPU2: CPU1: 8 | CPU2: 8 21 23 30 30 30 30 30 35 35
150W 5220R CPU1: | CPU2: CPU1: 8 | CPU2: 8 21 23 30 30 30 30 30 35 35
130W 4215R CPU1: | CPU2: CPU1: 8 | CPU2: 8 25 25 30 30 35 35 35 35 35
125W 5218R CPU1: | CPU2: CPU1: 8 | CPU2: 8 25 30 30 30 30 35 35 35 35 35
100W 4214R CPU1: | CPU2: CPU1: 8 | CPU2: 8 30 35 35 35 35 35 35 35 35 35
4210R CPU1: 8 | CPU2: 8 CPU1: 8 | CPU2: 8 30 35 35 35 35 35 35 35 35
95W 4210T CPU1: | CPU2: CPU1: 8 | CPU2: 8 30 35 35 35 35 35 35 35 35 35
85W 3206R CPU1: | CPU2: CPU1: 8 | CPU2: 8 35 35 35 35 35 35 35 35 35 35
Table 2. Thermal restrictions matrix for single processorThis table describes the thermal matrix for single processor:
Maximum continuous operating inlet temperature (°C)
3.5" Chassis 2.5" Chassis No-BP Chassis
TDP Watts Proc No. DPN of CPU Heat Sinks Max DIMM counts 12x HDDs 8x HDDs 4x HDDs 24x HDDs 20x HDDs 16x HDDs 12x HDDs 8x HDDs 4x HDDs N/A
165W 6238R CPU1:| CPU2: CPU1:8| CPU2:8 30 35 35 35 35 35 35 35 35 35
6240R CPU1:| CPU2: CPU1:8| CPU2:8 30 35 35 35 35 35 35 35 35 35
150W 6230R CPU1:| CPU2: CPU1:8| CPU2:8 30 35 35 35 35 35 35 35 35 35
6226R CPU1:| CPU2: CPU1:8| CPU2:8 30 35 35 35 35 35 35 35 35 35
6208U CPU1:| CPU2: CPU1:8| CPU2:8 30 35 35 35 35 35 35 35 35 35
5220R CPU1:| CPU2: CPU1:8| CPU2:8 30 35 35 35 35 35 35 35 35 35
130W 4215R CPU1:| CPU2: CPU1:8| CPU2:8 35 35 35 35 35 35 35 35 35 35
125W 5218R CPU1:| CPU2: CPU1:8| CPU2:8 35 35 35 35 35 35 35 35 35 35
100W 4214R CPU1:| CPU2: CPU1:8| CPU2:8 35 35 35 35 35 35 35 35 35 35
4210R CPU1:| CPU2: CPU1:8| CPU2:8 35 35 35 35 35 35 35 35 35 35
95W 4210T CPU1:| CPU2: CPU1:8| CPU2:8 35 35 35 35 35 35 35 35 35 35
85W 3206R CPU1:| CPU2: CPU1:8| CPU2:8 35 35 35 35 35 35 35 35 35 35

Particulate and gaseous contamination specifications

Table 1. Particulate contamination specificationsThe following table shows the particulate contamination specifications:
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE This condition applies to data center and non-data center environments.
Corrosive dust Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe following table shows the gaseous contamination specifications:
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Maximum vibration specifications

Table 1. Maximum vibration specificationsThe following table shows the maximum vibration specifications:
Maximum vibration Specifications

Operating

0.26 Grms at 5 Hz to 350 Hz (all operation orientations).

Storage

1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).

Maximum shock specifications

Table 1. Maximum shock specificationsThe following table shows the maximum shock specifications:
Maximum shock Specifications

Operating

24 executed shock pulses 6 G in the positive and negative x, y, z axis for up to 11 ms (four pulses on each side of the system).

Storage

Six consecutively executed shock pulses of 71 G in the positive and negative x, y, z axes for up to 2 ms (one pulse on each side of the system).

Maximum altitude specifications

Table 1. Maximum altitude specificationsThe following table shows the maximum altitude specifications:
Maximum altitude Specifications

Operating

3048 m (10,000 ft)

Storage

12,000 m (39,370 ft)

Fresh Air Operation

Fresh Air operation restrictions

  • Processors with a TDP greater than 105 W are not supported
  • Support for processors of 85 W and below without PERC restrictions
  • 3.5-inch drive configuration is not supported
  • 114-mm heat sink is required for the processor in CPU1 socket
  • Kerby-flat OCP is not supported
  • M.2 card on DCS Mezzanine slot is not supported.
  • NVMe SSD is not supported
  • AEP DIMM and LRDIMM are not supported
  • PCIe cards greater than 25 W are not supported
  • H730 PERC and H330 support for 105-W processors
  • No PERC restrictions for 85 W and lesser TDP processors