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Dell EMC PowerEdge C4140: технические характеристики и спецификации

Chassis dimensions

Figure 1. Details the dimensions of PowerEdge C4140 system
This figure shows the dimensions of PowerEdge C4140 system
Table 1. The dimensions of PowerEdge C4140 systemThe dimensions of PowerEdge C4140 system table contains the length, width and height specifications of the system.
XaXbYZa Zb*Zc
482.4 mm (18.99 inches)434 mm (17.08 inches)43.1 mm (1.69 inches)18.0 mm (0.70 inches)886.4 mm (34.89 inches)923.8 mm (36.37 inches)

* - Zb goes to the nominal rear wall external surface where the system board I/O connectors are located.

System weight

Table 1. System weightFollowing table contains the chassis weight information: Maximum weight is 22.1 Kg with PCIe GPUs and 24 kg with SXM2 GPUs.
System Maximum weight
PowerEdge C4140 (Configuration C - with PCIe GPUs) 22.1 kg (48.7 lb)
PowerEdge C4140 (Configuration K - with SXM2 GPUs)24 kg (52.91 lb)

GPU specifications

The Dell EMC PowerEdge C4140 supports up to 4 double wide GPUs, with 300 W each in either PCIe or SXM2 form factor. The following GPUs are supported:
  • NVIDIA Tesla P40
  • NVIDIA Tesla P100 12 GB PCIe
  • NVIDIA Tesla P100 16 GB PCIe and NVLink
  • NVIDIA Tesla V100 16 GB PCIe and NVLink
  • NVIDIA Tesla V100 32GB PCIe and NVLINK

Processor specifications

The PowerEdge C4140 system supports two 2nd Generation Intel Xeon Scalable processors with up to 26 cores per processor.
NOTE Ensure that both the processors are populated and both are of same type or model.
NOTE Processor sockets are not hot-pluggable.

Supported operating systems

The Dell EMC PowerEdge C4140 supports the following operating systems:
  • Canonical Ubuntu LTS
  • Citrix XenServer
  • Microsoft Windows Server
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
NOTE For more information on the specific versions and additions, go to www.dell.com/support/home/us/en/04/Drivers/SupportedOS/poweredge-c4140

PSU specifications

The Dell EMC PowerEdge C4140 system supports the following AC power supply units (PSU):

Table 1. PSU specifications

The table below are the specifications for 2000 W and 2400 W power supplies:

PSU Class Heat dissipation (maximum) Frequency Voltage AC Current
High line 100–240 V Low line 100–120 V
2400 W AC Titanium 9000 BTU/hr 50/60 Hz 100–240 V AC, autoranging 2400 W NA 16 A
2000 W AC Platinum 7500 BTU/hr 50/60 Hz 100–240 V AC, autoranging 2000 W NA 11.5 A
NOTE
  • Heat dissipation is calculated using the PSU wattage rating.
  • This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.

Cooling fans specifications

The Dell EMC PowerEdge C4140 system supports up to eight standard cooling fans.
NOTE When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.
Table 1. Dell EMC PowerEdge C4140 fan support matrixThis table describes the fan support matrix for C4140.
Processor count Fan 1 Fan 2 Fan 3 Fan 4 Fan 5 Fan 6 Fan 7 Fan 8
2 Required Required Required Required Required Required Required Required
NOTE Each fan is listed in the systems management software, referenced by the respective fan number. If there is a problem with a particular fan, you can easily identify and replace the proper fan by noting the fan numbers on the cooling fan assembly.

System battery specifications

The PowerEdge C4140 system supports CR 2032 lithium coin cell system battery.

Expansion bus specifications

The PowerEdge C4140 system supports PCI express (PCIe) generation 3 expansion cards, which are installed on the system, using expansion card risers. This system supports two risers, riser 1A and riser 2A.

NOTE Riser slots are not hot-pluggable.

Memory specifications

Table 1. Memory specificationsThe table below shows the memory specifications for the C4140 system:
DIMM type DIMM rank DIMM capacity Dual processors
Minimum RAM Maximum RAM
LRDIMM Quad rank 64 GB 128 GB 1536 GB
RDIMM Dual rank 64 GB 128 GB 1536 GB
RDIMM Dual rank 32 GB 64 GB 768 GB
RDIMM Dual rank 16 GB 32 GB 384 GB
RDIMM Single rank 8 GB 16 GB 192 GB
NOTE
  • Ensure that all the memory slots are populated either with DIMMs or DIMM blanks.
  • It is recommended to have all DIMMs of same type.
NOTE Memory DIMM slots are not hot-pluggable.

Storage specifications

The Dell EMC PowerEdge C4140 system supports the following controller cards :
Table 1. Dell EMC PowerEdge C4140 system controller cards This table provides the controller cards supported by Dell EMC PowerEdge C4140 system.
Internal controllers External controllers

One BOSS PCIe card with M.2 SATA SSDs

Up to two NVMe/PCIe SSDs as internal storage

Up to 2 NVMe add-in cards in slots 1 and 3

12 Gbps SAS HBA

H840

NOTE The M.2 boot drives have to be of the same capacity and set in a mirrored RAID-1 configuration.
NOTE Initial status LED of PCIe SSDs may vary based on the actual drive status and server components populated.
NOTE IDSDM and vFlash slot is not hot-pluggable
NOTE Mini-PERC socket is not hot-pluggable.

Drive specifications

The Dell EMC PowerEdge C4140 system supports optional two 2.5-inch cabled SATA SSDs is installed only in PSU 2 bay.
CAUTION Do not power off or reboot your system while the drive is being formatted. Doing so can cause a drive failure.
NOTE Two SATA SSDs in a non-RAID configuration by using the optional SATA drive cage. Option to configure RAID 1 manually only.
Figure 1. 2.5-inch SATA SSDs
This image shows 2.5-inch SATA SSDs.
  1. HDD1
  2. HDD0

USB ports

The PowerEdge C4140 system supports:

  • Two USB 3.0-compliant ports on the back panel
  • One internal USB 3.0-compliant port

NIC ports

The PowerEdge C4140 system supports up to four integrated 10/100/1000/Mbps Network Interface Controller (NIC) ports on the back panel.
NOTE You can install up to three PCIe add-on NIC cards.
NOTE The NDC slot is not hot-pluggable.

Serial port

The PowerEdge C4140 system supports one serial port on the rear view. This port is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

NOTE The serial port is not hot-pluggable.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The PowerEdge C4140 system supports one 15-pin VGA port on the back of system.

NOTE The VGA ports are not hot-pluggable.

Video specifications

The PowerEdge C4140 system supports a Matrox G200eW3 integrated VGA controller.
Table 1. Supported video resolution optionsThis table describes the supported video resolution options:
Resolution Refresh rate (Hz) Color depth (bit)
640 X 480 60, 70 8, 16, 32
800 X 600 60, 75, 85 8, 16, 32
1024 X 768 60, 75, 85 8, 16, 32
1152 X 864 60, 75, 85 8, 16, 32
1280 X 1024 60, 75 8, 16, 32
1440 X 900 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/poweredgemanuals
Table 1. Temperature specifications

The table below shows the optimal working temperature specifications:

Temperature Specifications
Storage –40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C to 30°C (50°F to 86°F) with no direct sunlight on the equipment.
NOTE Certain system hardware configurations may require operating temperatures to be less than 25°C. For more information, see the Ambient temperature limitations section.
Fresh air For information about fresh air, see Expanded Operating Temperature section.
Maximum temperature gradient (operating and storage) 20°C/h (68°F/h)
Table 2. Relative humidity specifications

The table below shows the relative humidity specification during operations and storage:

Relative humidity Specifications
Storage 5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating 10% to 80% relative humidity with 29°C (84.2°F) maximum dew point.
Table 3. Maximum vibration specifications

The table below shows the maximum vibration specifications during operations and storage:

Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Table 4. Maximum shock specifications

The table below shows the maximum shock specifications during operations and storage:

Maximum shock Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Table 5. Maximum altitude specifications

The table below shows the maximum altitude specifications during operations and storage.

Maximum altitude Specifications
Operating

3048 m (10,000 ft)

Storage 12,000 m (39,370 ft)
Table 6. Operating temperature de-rating specifications

The table below shows the operating temperature de-rating specifications:

Operating temperature de-rating Specifications
Up to 30°C (86°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).

Standard operating temperature

Table 1. Standard operating temperature specifications

The standard operating temperature for altitude less than 950 m or 3117 ft ranges 5°C–40°C (41°F–104°F) with no direct sunlight on the equipment.

NOTE The chassis supports a maximum of 135 W processors.
Standard operating temperature Specifications
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C to 30°C (50°F to 86°F) with no direct sunlight on the equipment.

Maximum recommended ambient operating temperature

Table 1. Configuration BThe below describes the Maximum recommended ambient operating temperature for Configuration B:
CPU Power Dissipation / GPU Power (4x) 2x 70 W 2x 85 W 2x 105 W 2x 125 W 2x 130 W 2x 140 W 2x 150 W 2x 165 W
325 W 21 21 20 19 19 18 17 15
300 W 23 23 22 21 21 20 19 17
275 W 25 25 24 23 23 22 21 19
250 W 27 26 26 25 25 24 23 22
225 W 29 28 28 27 27 26 25 24
200 W 30 30 30 30 29 28 27 26
Table 2. Configuration CThe below describes the Maximum recommended ambient operating temperature for Configuration C:
CPU Power Dissipation / GPU Power (4x) 2x 70 W 2x 85 W 2x 105 W 2x 125 W 2x 130 W 2x 140 W 2x 150 W 2x 165 W
325 W 24 23 22 21 20 20 19 17
300 W 28 26 24 23 23 23 22 20
275 W 28 27 26 25 25 24 23 21
250 W 30 29 28 27 26 26 25 23
225 W 30 30 30 29 28 28 28 26
200 W 30 30 30 30 30 30 30 28
Table 3. Configuration GThe below describes the Maximum recommended ambient operating temperature for Configuration G:
CPU Power Dissipation / GPU Power (4x) 2x 70 W 2x 85 W 2x 105 W 2x 125 W 2x 130 W 2x 140 W 2x 150 W 2x 165 W
325 W 23 22 20 19 18 18 18 17
300 W 25 24 22 21 21 20 19 18
275 W 27 26 23 23 23 22 21 20
250 W 28 27 25 25 25 24 23 22
225 W 30 29 27 27 27 26 25 24
200 W 30 30 29 29 29 28 27 26
Table 4. Configuration KThe below describes the Maximum recommended ambient operating temperature for Configuration K:
CPU Power Dissipation / NVLink SXM2 2x 70 W 2x 85 W 2x 105 W 2x 125 W 2x 130 W 2x 140 W 2x 150 W 2x 165 W
300W 25 24 22 21 20 19 18 18
Table 5. Configuration MThe below describes the Maximum recommended ambient operating temperature for Configuration M:
CPU Power Dissipation / NVLink SXM2 2x 70 W 2x 85 W 2x 105 W 2x 125 W 2x 130 W 2x 140 W 2x 150 W 2x 165 W
300W 24 24 23 23 22 22 20 20

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specifications

Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have the MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.

Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE Air entering the data center must have the MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specifications

The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.

Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined byANSI/ISA71.04-2013.
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013.
NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.